Method of forming an MOS transistor and structure therefor
First Claim
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1. An MOS transistor comprising:
- a substrate having a first conductivity type;
a body region of the transistor formed as a first doped region of a second conductivity type in the substrate and electrically coupled to a conductor;
an opening extending into the substrate and into the first doped region, the opening having a sidewall; and
a gate structure of the MOS transistor within the opening, the gate structure including a first insulator having a first thickness along a first portion of the sidewall and also including a second insulator having a second thickness along another portion of the sidewall wherein the second thickness is greater than the first thickness.
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Abstract
In one embodiment, an MOS transistor is formed with trench gates. The gate structure of the trench gates generally has a first insulator that has a first thickness in one region of the gate and a second thickness in a second region of the gate.
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Citations
23 Claims
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1. An MOS transistor comprising:
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a substrate having a first conductivity type;
a body region of the transistor formed as a first doped region of a second conductivity type in the substrate and electrically coupled to a conductor;
an opening extending into the substrate and into the first doped region, the opening having a sidewall; and
a gate structure of the MOS transistor within the opening, the gate structure including a first insulator having a first thickness along a first portion of the sidewall and also including a second insulator having a second thickness along another portion of the sidewall wherein the second thickness is greater than the first thickness. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of forming an MOS transistor comprising:
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providing a substrate having a first conductivity type and having a first surface;
forming a first doped region of a second conductivity type within at least a portion of the substrate and having a first peak doping concentration;
forming a second doped region of the first conductivity type overlying at least a portion of the first doped region and having a second peak doping that is no greater than the first peak doping concentration;
forming a third doped region of the first conductivity type overlying at least a portion of the second doped region and having a third peak doping concentration that is greater than the second peak doping concentration; and
forming an opening into the substrate with the opening having a sidewall juxtaposed to the first doped region and the second doped region. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method of forming an MOS transistor comprising:
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forming a channel region having a first conductivity type and having a first peak doping concentration;
forming a current carrying region of a second conductivity type overlying the channel region and having a second peak doping concentration that is no greater than the first peak doping concentration;
forming a first doped region overlying the current carrying region and having a third peak doping concentration; and
forming a trench gate structure having a first insulator of a first thickness juxtaposed to the channel region and having a second insulator of a greater thickness juxtaposed to a portion of the current carrying region. - View Dependent Claims (17, 18, 19, 20)
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21. A method of forming an MOS transistor comprising:
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providing a semiconductor substrate of a first conductivity type having a first surface;
forming a channel region of a second conductivity type on the first surface;
forming a current carrying region of the first conductivity type overlying the channel region;
forming a trench gate structure extending from the first surface into the channel region and having a insulator of a first thickness juxtaposed to the channel region;
forming a first conductor within the trench gate structure adjacent to the insulator; and
forming a second conductor within the trench gate structure electrically connected to the first conductor wherein the second conductor has a lower resistivity than the first conductor. - View Dependent Claims (22, 23)
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Specification