DETERMINING THE QUALITY AND RELIABILITY OF A COMPONENT BY MONITORING DYNAMIC VARIABLES

• US 20070208538A1
• Filed: 03/06/2006
• Published: 09/06/2007
• Est. Priority Date: 03/06/2006
• Status: Active Grant

• Current Assignee: Oracle America, Inc. (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Vacar, Dan, McElfresh, David, Gross, Kenny, Lopez, Leoncio
• Granted Patent: US 7,283,919 B2
• Time in Patent Office: Days
• US Class Current: 702/182
• CPC Class Codes: G01R 31/2849 Environmental or reliability testing, e.g. burn-in or validation tests of individual semiconductors G01R31/2642; of printed circuits boards G01R31/2817; of IC's G01R31/2855
• CPC Class Codes: G06F 11/24 Marginal checking or other specified testing methods not covered by G06F11/26, e.g. race tests

Abstract

One embodiment of the present invention provides a system that tests the quality and/or the reliability of a component. During operation, the system applies test conditions to a plurality of specimens of the component. While applying the test conditions, the system measures the same variable from each of the plurality of specimens. Next, the system computes a running average of the measured variable across the plurality of specimens. The system then computes residuals between the measured variable for each specimen and the running average. The system next determines from the residuals whether the associated specimens are degraded.

Claims

1. A method for testing the quality and/or the reliability of a component, comprising:

applying test conditions to a plurality of specimens of the component;

while applying the test conditions, measuring the same variable from each of the plurality of specimens;

computing a running average of the measured variable across the plurality of specimens;

computing residuals between the measured variable for each specimen and the running average;

determining from the residuals whether the associated specimens are degraded;

recording the time at which the specimen of the component was determined to have degraded; and

determining how many test events have been repeated on the specimen of the component when the specimen of the component was determined to have degraded.

2. The method of claim 1, wherein determining from the residuals whether the associated specimens are degraded involves comparing the residuals with a set of threshold limits.

4. The method of claim 1, wherein the quality and/or the reliability test can be applied to:

an early failure rate test of the component;

a burn-in screen of the component;

an accelerated stress test of the component;

or

a repair-center reliability evaluation of a returned component.

5. The method of claim 1, wherein parameters for the test conditions can specify:

temperature;

vibration;

voltage noise;

humidity;

or

radiation.

6. The method of claim 1, wherein the quality and/or the reliability test is an in-situ test wherein the quality and/or the reliability of the component is determined based on a dynamic behavior in the measured variable of the component when the component is under the test conditions.

3. (canceled)

7. A computer-readable storage medium storing instructions that when executed by a computer cause the computer to perform a method for testing the quality and/or the reliability of a component, the method comprising:

applying test conditions to a plurality of specimens of the component;

while applying the test conditions, measuring the same variable from each of the plurality of specimens;

computing a running average of the measured variable across the plurality of specimens;

computing residuals between the measured variable for each specimen and the running average; and

determining from the residuals whether the associated specimens are degraded;

recording the time at which the specimen of the component was determined to have degraded; and

determining how many test events have been repeated on the specimen of the component when the specimen of the component was determined to have degraded.

8. The computer-readable storage medium of claim 7, wherein determining from the residuals whether the associated specimens are degraded involves comparing the residuals with a set of threshold limits.

10. The computer-readable storage medium of claim 7, wherein the quality and/or the reliability test can be applied to:

an early failure rate test of the component;

a burn-in screen of the component;

an accelerated stress test of the component;

or

a repair-center reliability evaluation of a returned component.

11. The computer-readable storage medium of claim 7, wherein parameters for the test conditions can specify:

temperature;

vibration;

voltage noise;

humidity;

or

radiation.

12. The computer-readable storage medium of claim 7, wherein the quality and/or the reliability test is an in-situ test wherein the quality and/or the reliability of the component is determined based on a dynamic behavior in the measured variable of the component when the component is under the test conditions.

9. (canceled)

13. An apparatus that tests the quality and/or the reliability of a component, comprising:

an applying mechanism configured to apply test conditions to a plurality of specimens of the component;

a measurement mechanism configured to measure the same variable from each of the plurality of specimens while the test conditions are applied;

an average-computing mechanism configured to compute a running average of the measured variable across the plurality of specimens;

an residuals-computing mechanism configured to compute residuals between the measured variable for each specimen and the running average;

a determination mechanism configured to determine from the residuals whether the associated specimens are degraded;

a recording mechanism configured to record the time at which the specimen of the component was determined to have degraded; and

a determination mechanism configured to determine how many test events have been repeated on the specimen of the component when the specimen of the component was determined to have degraded.

14. The apparatus of claim 13, wherein while determining from the residuals whether the associated specimens are degraded the determination mechanism is configured to compare the residuals with a set of threshold limits.

16. The apparatus of claim 13, wherein the quality and/or the reliability test can be applied to:

an early failure rate test of the component;

a burn-in screen of the component;

an accelerated stress test of the component;

or

a repair-center reliability evaluation of a returned component.

17. The apparatus of claim 13, wherein parameters for the test conditions can specify:

temperature;

vibration;

voltage noise;

humidity;

or

radiation.

18. The apparatus of claim 13, wherein the quality and/or the reliability test is an in-situ test wherein the quality and/or the reliability of the component is determined based on a dynamic behavior in the measured variable of the component when the component is under the test conditions.

15. (canceled)