Thermal mass gas flow sensor and method of forming same

• US 20070209433A1
• Filed: 03/10/2006
• Published: 09/13/2007
• Est. Priority Date: 03/10/2006
• Status: Abandoned Application

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Gehman, Richard, Dmytriw, Anthony, Shiffer, Stephen, Blumhoff, Christopher
• Application Number:
  US11/373,947
• Publication Number:
  US 20070209433A1
• Time in Patent Office: Days
• US Class Current: 73/204.260
• CPC Class Codes: G01F 1/6845 Micromachined devices
• CPC Class Codes: G01F 1/692 Thin-film arrangements

Abstract

A thermal gas flow sensor and method of forming such a sensor. The sensor has a substrate and a heater disposed on the substrate. At least one pair of thermal sensing elements is disposed on the substrate either side of the heater. A protective layer is disposed on at least the heater and/or the thermal sensing elements. The protective layer comprises a high temperature resistant polymer based layer which is preferably a fluoropolymer based layer. The protective layer can also cover interconnects and electrical connections also formed on the substrate so as to completely seal the sensor. A passivation layer, such as silicon nitride, can be disposed on the sensing and/or heating elements and optionally the interconnects and is arranged to interpose the protective layer and the substrate.

Claims

1. A thermal mass gas flow sensor, comprising:

a substrate and at least one pair of thermal sensing elements disposed on said substrate;

a heater, disposed on said substrate, between said thermal sensing elements; and

a protective layer disposed on at least said heater and/or said thermal sensing elements, wherein said protective layer comprises a high temperature resistant insulating or dielectric layer.

2. The sensor of claim 1, further comprising a dielectric or insulating passivation layer disposed on said sensing elements and said heater, said passivation layer interposing said protective layer and said sensing elements and said heater.

3. The sensor of claim 1, wherein said protective layer further comprises a polymer based layer.

4. The sensor of claim 3, wherein said sensor is configured as a microbridge or mircobrick gas flow sensor.

5. The sensor of claim 3, wherein said polymer comprises a fluoropolymer.

6. The sensor of claim 5, wherein said protective layer comprises at least one fluoropolymer selected from the group consisting of polytetrafluoroetheylene and fluorinated parylene.

7. The sensor of claim 1, wherein said protective layer is a hydrophobic layer.

8. A thermal gas micro flow sensor comprising:

a substrate;

a heater disposed on said substrate;

at least one pair of thermal sensing elements disposed on said substrate either side of said heater; and

a protective layer, disposed on at least said heater and/or said thermal sensing elements, wherein said protective layer comprises an high temperature resistant polymer based layer.

9. The sensor of claim 8, further comprising interconnects, disposed on said substrate, electrically connected to said thermal sensing elements and said heater, said protective layer also being disposed on said interconnects.

10. The sensor of claim 9, further comprising a passivation layer formed on said thermal sensing elements, said heater, and said interconnects, wherein said passivation layer interposes said substrate and said protective layer.

11. The sensor of claim 10, wherein said passivation layer has windows formed therein providing access to said interconnects and further comprising electrical connections comprising conductive links or wires electrically connected to said interconnects through said windows for connecting said temperature sensing elements and said heater to external circuitry, said protective layer sealing said windows and optionally said electrical connections.

12. The sensor of claim 11, wherein said passivation layer comprises a silicon nitride layer (SiNx).

13. The sensor of claim 11, wherein said substrate includes a microbridge structure formed thereon and wherein said thermal sensing elements and said heater are disposed on said microbridge structure thereby forming a microbridge flow sensor.

14. The sensor of claim 13, wherein said protective layer comprises at least one fluoropolymer selected from the group consisting of polytetrafluoroetheylene and fluorinated parylene

15. The sensor of claim 11, wherein said substrate is fabricated in the form of a microbrick structure providing a substantially solid structure beneath said temperature and heating elements.

16. The sensor of claim 15, wherein said protective layer comprises at least one fluoropolymer selected from the group consisting of polytetrafluoroetheylene and fluorinated parylene

17. A method of manufacturing a thermal mass gas flow sensor comprising:

providing a substrate;

forming at least one pair of temperature sensing elements on said substrate;

forming a heating element on said substrate between said at least one pair of temperature sensing elements, and

forming a protective layer on at least said temperature sensing elements and/or said heating elements, wherein said protective layer comprises a high temperature resistant polymer based layer.

18. The method of claim 17, wherein forming said protective layer, comprises vapor depositing a fluoropolymer thin film on said sensing and heating elements.

19. The method of claim 18, further comprising:

forming electrical interconnections on said substrate for passing signals between said sensor and external circuitry; and

forming said protective layer also on said electrical interconnections.

20. The method of claim 18, further comprising depositing a passivation layer on said sensing and heating elements preparatory to forming said protective layer.