Stacked image sensor optical module and fabrication method
First Claim
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1. An optical module comprising:
- a substrate;
a spacer directly adhered to the substrate;
at least one electronic component coupled to the substrate, the at least one electronic component being encapsulated in the spacer; and
an image sensor coupled to the spacer, the spacer spacing the image sensor above the at least one electronic component.
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Abstract
An optical module includes a substrate, a spacer coupled to the substrate, at least one electronic component, e.g., a passive component, coupled to the substrate, and an image sensor coupled to the spacer. The spacer spaces the image sensor above the at least one electronic component.
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Citations
23 Claims
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1. An optical module comprising:
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a substrate;
a spacer directly adhered to the substrate;
at least one electronic component coupled to the substrate, the at least one electronic component being encapsulated in the spacer; and
an image sensor coupled to the spacer, the spacer spacing the image sensor above the at least one electronic component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15-18. -18. (canceled)
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19. An optical module comprising:
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a substrate;
at least one electronic component coupled to the substrate;
a spacer directly adhered to the substrate, the at least one electronic component being encapsulated within the spacer; and
an image sensor coupled to the spacer, the spacer spacing the image sensor above the at least one electronic component. - View Dependent Claims (20, 21)
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22. A method comprising:
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mounting at least one electronic component to a substrate;
attaching a spacer to the substrate comprising encapsulating the at least one electronic component within the spacer, the spacer being directly adhered to the substrate; and
spacing an image sensor above the at least one electronic component with the spacer. - View Dependent Claims (23)
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Specification