Stacked image sensor optical module and fabrication method

• US 20070210246A1
• Filed: 04/14/2005
• Published: 09/13/2007
• Est. Priority Date: 04/14/2005
• Status: Abandoned Application

• Current Assignee: Amkor Technology Incorporated
• Original Assignee: Amkor Technology Incorporated
• Inventors: Sato, Shin, Ellenberger, Ronald, Popovich, Mark
• Application Number:
  US11/107,591
• Publication Number:
  US 20070210246A1
• Time in Patent Office: Days
• US Class Current: 250/239
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19103 interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

An optical module includes a substrate, a spacer coupled to the substrate, at least one electronic component, e.g., a passive component, coupled to the substrate, and an image sensor coupled to the spacer. The spacer spaces the image sensor above the at least one electronic component.

Claims

1. An optical module comprising:

a substrate;

a spacer directly adhered to the substrate;

at least one electronic component coupled to the substrate, the at least one electronic component being encapsulated in the spacer; and

an image sensor coupled to the spacer, the spacer spacing the image sensor above the at least one electronic component.

2. The optical module of claim 1 wherein the at least one electronic component is located directly below the image sensor.

3. The optical module of claim 1 wherein the at least one electronic component is coupled to a first surface of the substrate, the at least one electronic component being vertically located between the first surface of the substrate and a first surface of the image sensor.

4. The optical module of claim 1 wherein the image sensor is stacked above the at least one electronic component.

5. The optical module of claim 1 wherein the at least one electronic component is mounted within an image sensor die attach area of a first surface of the substrate.

6. The optical module of claim 1 further comprising an opaque coating on a first surface of the image semsor.

7. The optical module of claim 6 wherein the image sensor comprises a second surface comprising:

an active area responsive to electromagnetic radiation; and

bond pads.

8. The optical module of claim 7 further comprising bond wires electrically coupling the bond pads to traces on a first surface of the substrate.

9. The optical module of claim 1 further comprising:

a lens holder coupled to the substrate;

a optical element coupled to the lens holder; and

a window coupled to the lens holder.

10. The optical module of claim 1 wherein the at least one electronic component comprises a passive component.

11. The optical module of claim 1 further comprising solder mounting the at least one electronic component to the substrate.

12. The optical module of claim 11 wherein terminals of the at least one electronic component are coupled to the substrate by the solder.

13. The optical module of claim 1 further comprising:

an adhesive coupling a first surface of the image sensor to a surface of the spacer.

14. The optical module of claim 13 wherein the area of the surface of the spacer is less than the area of the first surface of the image sensor.

15-18. -18. (canceled)

19. An optical module comprising:

a substrate;

at least one electronic component coupled to the substrate;

a spacer directly adhered to the substrate, the at least one electronic component being encapsulated within the spacer; and

an image sensor coupled to the spacer, the spacer spacing the image sensor above the at least one electronic component.

20. The optical module of claim 19 wherein the spacer comprises molding compound.

21. The optical module of claim 19 wherein the spacer comprises an epoxy.

22. A method comprising:

mounting at least one electronic component to a substrate;

attaching a spacer to the substrate comprising encapsulating the at least one electronic component within the spacer, the spacer being directly adhered to the substrate; and

spacing an image sensor above the at least one electronic component with the spacer.

23. The method of claim 22 wherein the mounting at least one electronic component to a substrate comprises surface mounting the at least one electronic component to an image sensor die attach area of the substrate.