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Semiconductor device and manufacturing method thereof

  • US 20070210437A1
  • Filed: 03/07/2007
  • Published: 09/13/2007
  • Est. Priority Date: 03/07/2006
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a semiconductor substrate comprising a top surface and a bottom surface;

    a supporter, a first surface of which is attached to the top surface of the semiconductor substrate so that an edge portion of the semiconductor substrate recedes from a corresponding edge portion of the supporter;

    a connecting electrode disposed on the first surface of the supporter; and

    a protection layer covering a side surface of the semiconductor substrate and having an opening at the connecting electrode, wherein no wiring layer is formed on the bottom surface of the semiconductor substrate.

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