Three dimensional integrated circuits
First Claim
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1. A three-dimensional semiconductor device, comprising:
- a programmable logic circuit; and
a configuration circuit comprising a memory element, wherein;
the memory element is positioned above the logic circuit; and
the memory element is coupled to the logic circuit to program the logic circuit.
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Abstract
In a first aspect, a three-dimensional semiconductor device, wherein: a configurable memory element coupled to a programmable logic circuit to program the logic circuit is positioned substantially above the logic circuit. In a second aspect, a three-dimensional semiconductor device, comprising: a first module layer having a circuit block; and a second module layer positioned substantially above the first module layer, comprising a configuration circuit coupled to the circuit block to program the circuit block.
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Citations
20 Claims
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1. A three-dimensional semiconductor device, comprising:
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a programmable logic circuit; and
a configuration circuit comprising a memory element, wherein;
the memory element is positioned above the logic circuit; and
the memory element is coupled to the logic circuit to program the logic circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A three-dimensional semiconductor device, comprising:
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a first module layer having a circuit block; and
a second module layer positioned substantially above the first module layer, comprising a configuration circuit coupled to the circuit block to program the circuit block. - View Dependent Claims (12, 13, 14, 15)
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16. A three-dimensional semiconductor device, wherein:
a configurable memory element coupled to a programmable logic circuit to program the logic circuit is positioned substantially above the logic circuit. - View Dependent Claims (17, 18, 19, 20)
Specification