EFFLUENT GAS STREAM TREATMENT SYSTEM HAVING UTILITY FOR OXIDATION TREATMENT OF SEMICONDUCTOR MANUFACTURING EFFLUENT GASES

• US 20070212288A1
• Filed: 05/07/2007
• Published: 09/13/2007
• Est. Priority Date: 12/31/1996
• Status: Active Grant

• Current Assignee: BHT Services Pte., Ltd.
• Original Assignee: Kent Carpenter, Mark Holst, Prakash Arya, Scott Lane
• Inventors: Carpenter, Kent, Holst, Mark, Lane, Scott, Arya, Prakash
• Granted Patent: US 7,695,700 B2
• Time in Patent Office: Days
• US Class Current: 423/240.R
• CPC Class Codes: B01D 2258/0216 from CVD treatment or semi-conductor manufacturing
• CPC Class Codes: B01D 47/06 Spray cleaning
• CPC Class Codes: B01D 53/14 by absorption
• CPC Class Codes: B01D 53/1456 Removing acid components
• CPC Class Codes: B01D 53/68 Halogens or halogen compounds
• CPC Class Codes: C23C 16/4412 Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
• CPC Class Codes: Y02C 20/30 of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

Abstract

An effluent gas stream treatment system for treatment of gaseous effluents such as waste gases from semiconductor manufacturing operations. The effluent gas stream treatment system comprises a pre-oxidation treatment unit, which may for example comprise a scrubber, an oxidation unit such an electrothermal oxidizer, and a post-oxidation treatment unit, such as a wet or dry scrubber. The effluent gas stream treatment system of the invention may utilize an integrated oxidizer, quench and wet scrubber assembly, for abatement of hazardous or otherwise undesired components from the effluent gas stream. Gas or liquid shrouding of gas streams in the treatment system may be provided by high efficiency inlet structures.

Claims

1. A method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools, comprising the steps of:

removing water soluble gases from the effluent fluid stream;

oxidizing at least a portion of the oxidizable components of the effluent fluid stream; and

removing acidic components from the effluent fluid stream.

2. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools of claim 1, further comprising removing particulates in the step of removing water soluble gases from the effluent fluid stream.

3. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools of claim 1, further comprising removing particulates in the step of removing acidic components from the effluent fluid stream.

4. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools of claim 1, wherein the step of oxidizing comprises the steps of:

mixing the effluent fluid stream with an oxidizer medium; and

heating the effluent fluid stream.

5. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools of claim 1, wherein the step of oxidizing comprises using a catalytic oxidizer.

6. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools of claim 1, wherein the step of oxidizing comprises using a thermal oxidizer.

7. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools of claim 2, wherein the step of removing particulates and water soluble gases comprises using a wet spray tower.

8. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools of claim 7, wherein said wet spray tower comprises an inert-gas-assisted atomizing nozzle.

9. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools of claim 3, wherein the step of removing particulates and acidic components comprises using a wet spray tower.

10. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools of claim 9, wherein the wet spray tower comprises a demister mesh packing.

11. A method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools using a system that includes an oxidizing unit, comprising the steps of:

effecting, in the oxidizing unit, the destruction of at least portion of the halogen-containing components of the effluent fluid stream using a hydrogen source and the oxidation of at least a portion of the oxidizable components of the effluent fluid stream; and

removing acidic components from the effluent fluid stream.

12. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools using a system that includes an oxidizing unit of claim 11, wherein particulates are removed in the step of removing acidic components from the effluent stream.

13. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools using a system that includes an oxidizing unit of claim 11, wherein the step of effecting oxidation comprises the steps of:

mixing the effluent fluid stream with an oxidizer medium and water vapor; and

heating the effluent fluid stream

14. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools using a system that includes an oxidizing unit of claim 11, wherein the step of effecting oxidation comprises using a catalytic oxidizer.

15. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools using a system that includes an oxidizing unit of claim 11, further comprising the step of:

removing particulates and water soluble gases from the effluent fluid stream upstream of the oxidizing unit.

16. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools using a system that includes an oxidizing unit of claim 15, wherein the step of removing particulates and water soluble gases upstream of the oxidation unit comprises using a wet spray tower including an inert-gas-assisted atomizing nozzle.

17. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools using a system that includes an oxidizing unit of claim 11, wherein the step of removing particulates and acidic components comprises using a wet spray tower including a demister mesh pack.

18. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools using a system that includes an oxidizing unit of claim 11, further comprising the step of:

recycling water vapor from the quench unit back to the oxidizing unit for utilization as a hydrogen source to effect destruction of at least a portion of the halogen-containing components of the effluent fluid stream

19. The method for treating the effluent fluid stream from one or more semiconductor manufacturing process tools using a system that includes an oxidizing unit of claim 11 wherein water vapor is used as a hydrogen source to effect destruction of at least portion of the halogen-containing components of the effluent fluid stream.