DEVICE AND METHOD FOR MOUNTING PART

• US 20070214629A1
• Filed: 05/23/2007
• Published: 09/20/2007
• Est. Priority Date: 04/22/2003
• Status: Active Grant

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Okuda, Osamu, Kawase, Takeyuki, Tanaka, Yoichi, Yoshitake, Takanori, Imafuku, Shigeki, Kino, Toshiyuki
• Granted Patent: US 8,196,295 B2
• Time in Patent Office: Days
• US Class Current: 29/434
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: H05K 13/0853 Determination of transport trajectories inside mounting machines
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/4984 Retaining clearance for motion between assembled parts
• CPC Class Codes: Y10T 29/53039 with control means energized in response to activator stimulated by condition sensor
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53183 Multilead component

Abstract

An object of the present invention is to provide a component mounting apparatus and a component mounting method in which a movement time of a nozzle can be shortened so that production efficiency can be improved. There is provided a control means for controlling movement positions and movement timings of a nozzle elevating means and a nozzle moving means. The control means stores positions and heights of obstacles located between a component supply unit and a circuit board in advance. The control means moves down a nozzle in sync with the time when the nozzle has finished passing over each obstacle after an electronic component has been photographed by a component camera. Alternatively, the control means moves the nozzle in a path to avoid the obstacles. In addition, in a component mounting region, the nozzle moves at a component mounting region movement height and the component is mounted by the nozzle moved down from the component mounting region movement height. Accordingly, it is possible to shorten an elevating stroke of the nozzle (5). In addition, the nozzle can be elevated in an arc trajectory.

Claims

1. A component mounting method comprising the steps of:

using a nozzle to hold a component at its lower end, said component being supplied from a component supply unit;

moving said nozzle up/down and horizontally while avoiding obstacles higher than a height with which said component is picked up from said component supply unit or a height with which said component is to be mounted on a board conveyed by conveyance rails; and

mounting said component on said board;

wherein positions and heights of a plurality of said obstacles disposed between said component supply unit and said board are stored; and

when said nozzle is to move from a position to pick up said component from said component supply unit to a position to mount said picked-up component on said board, a highest one is found from said plurality of obstacles, said nozzle is moved up to a height high enough not to interfere with said highest obstacle, said nozzle is moved horizontally, a current height of said nozzle is compared with a height of an obstacle said nozzle will pass over as soon as said nozzle has finished passing over said highest obstacle, and said nozzle is moved down to a height high enough not to interfere with said obstacle said nozzle will pass over when said nozzle is higher than the height of said obstacle.

2. A component mounting method comprising the steps of:

using a nozzle to hold a component at its lower end, said component being supplied from a component supply unit;

moving said nozzle up/down and horizontally; and

mounting said component on a board;

wherein said nozzle is made to approach a component mounting region movement height close to said board when said nozzle has arrived in a component mounting region above said board;

said nozzle holding said component at said component mounting region movement height is moved to a component mounting position on said board; and

said component is mounted from said component mounting region movement height to said component mounting position.

3. A component mounting method according to claim 2, wherein a horizontal movement operation and an elevating operation are performed simultaneously so as to move said nozzle in an arc moving trajectory when said component is to be mounted on said board.