Pusher assemblies for use in microfeature device testing, systems with pusher assemblies, and methods for using such pusher assemblies

• US 20070216437A1
• Filed: 03/14/2006
• Published: 09/20/2007
• Est. Priority Date: 03/14/2006
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Slaughter, Michael, Larson, Christie
• Granted Patent: US 7,652,495 B2
• Time in Patent Office: Days
• US Class Current: 324/750.90
• CPC Class Codes: G01R 1/0441 Details
• CPC Class Codes: G01R 31/2893 Handling, conveying or loading, e.g. belts, boats, vacuum fingers G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H01L21/67

Abstract

Pusher assemblies for use in microelectronic device testing systems and methods for using such pusher assemblies are disclosed herein. One particular embodiment of such a pusher assembly comprises a plate having a first side and a second side opposite the first side. An engagement assembly is removably coupled to the second side of the plate and positioned to contact a microfeature device being tested. The pusher assembly can include an urging member proximate the first side of the plate and configured to move the engagement assembly toward the device being tested. The pusher assembly can also include a heat transfer unit carried by the first side of the plate. In several embodiments, the pusher assembly can further include a plurality of pins carried by the engagement assembly such that the pins extend through the plate and engage the urging member to restrict axial movement of the urging member toward the device being tested.

Claims

1. A pusher assembly for use in a system for testing microfeature devices, the pusher assembly comprising:

a plate having a first side and a second side opposite the first side;

an engagement assembly removably coupled to the second side of the plate and positioned to contact a microfeature device being tested;

an urging member proximate the first side of the plate, the urging member being configured to move the engagement assembly toward the device being tested; and

a heat transfer unit carried by the first side of the plate.

2. The pusher assembly of claim 1, further comprising a plurality of pins carried by the engagement assembly such that the pins extend through the plate and engage the urging member to restrict axial movement of the urging member toward the device being tested.

3. The pusher assembly of claim 2 wherein:

the plate includes a first shaft and a second shaft projecting from the first side of the plate;

the urging member proximate the first side of the plate includes a first spring carried by the first shaft and the pusher assembly further includes a second spring carried by the second shaft; and

the heat transfer unit is between the first shaft and the second shaft and in direct thermal contact with the engagement assembly.

4. The pusher assembly of claim 3 wherein:

the pusher assembly further includes (a) a first load ring carried by the first shaft between the first side of the plate and the first spring, and (b) a second load ring carried by the second shaft between the first side of the plate and the second spring; and

the pins contact the first and second load rings to restrict axial movement of the first and second springs along the first and second shafts, respectively, toward the device being tested.

5. The pusher assembly of claim 2 wherein the pins are interchangeable components removably carried by the engagement assembly.

6. The pusher assembly of claim 2 wherein the pins have a predetermined length corresponding at least in part to the force of the urging member and/or an outer profile of the device being tested.

7. The pusher assembly of claim 1 wherein the urging member includes a spring having a known spring constant such that the spring is configured to apply a predetermined force to the engagement assembly.

8. The pusher assembly of claim 1 wherein the plate is a thermally conductive plate.

9. The pusher assembly of claim 1 wherein the heat transfer unit is in direct thermal contact with the engagement assembly.

10. The pusher assembly of claim 1 wherein the engagement assembly includes (a) a base portion in direct contact with at least a portion of the second side of the plate, and (b) an engagement element projecting away from the base portion and positioned to engage the device being tested.

11. The pusher assembly of claim 10 wherein:

the plate includes an aperture extending completely through the plate; and

the base portion of the engagement assembly further includes a projection extending through at least a portion of the aperture and in contact with the heat transfer unit.

12. The pusher assembly of claim 1 wherein the engagement assembly includes a contact surface positioned to directly contact the device being tested, the contact surface having a predetermined configuration based at least in part on a configuration of the device being tested.

13. The pusher assembly of claim 12 wherein the contact surface includes a predetermined shape based at least in part on an outer profile of the device being tested.

14. The pusher assembly of claim 12 wherein the contact surface includes a predetermined planform shape based at least in part on a planform shape of the device being tested.

15. The pusher assembly of claim 1 wherein the engagement assembly is a modular, interchangeable component.

16. The pusher assembly of claim 1, further comprising an actuator positioned to provide a known force to the urging member to move the engagement assembly toward the device being tested.

17. A pusher assembly for use in a system for testing microfeature devices, the pusher assembly comprising:

a plate having a first side, a second side opposite the first side, an aperture extending completely through the plate, and a first shaft and a second shaft projecting from the first side;

an engagement assembly removably coupled to the second side of the plate, the engagement assembly including (a) a base portion in direct contact with at least a portion of the second side of the plate, and (b) an engagement element projecting from the base portion and positioned to contact a microfeature device being tested;

a first urging member carried by the first shaft and a second urging member carried by the second shaft, the first and second urging members being positioned to move the engagement assembly toward the device being tested;

a plurality of pins removably carried by the base portion such that the pins extend through the plate and engage the corresponding first and second urging members, the pins being a predetermined length to restrict axial movement of the first and second urging members toward the device being tested; and

a heat transfer unit carried by the first side of the plate.

18. The pusher assembly of claim 17 wherein the plate is a thermally conductive plate.

19. The pusher assembly of claim 17 wherein the heat transfer unit is in direct thermal contact with the engagement assembly.

20. The pusher assembly of claim 17 wherein the base portion of the engagement assembly includes a projection extending through at least a portion of the aperture in the plate and in contact with the heat transfer unit.

21. The pusher assembly of claim 17 wherein:

the pusher assembly further includes (a) a first load ring carried by the first shaft between the first side of the plate and the first urging member, and (b) a second load ring carried by the second shaft between the first side of the plate and the second urging member; and

the pins contact the first and second load rings to restrict axial movement of the first and second urging members along the first and second shafts, respectively, toward the device being tested.

22. The pusher assembly of claim 17 wherein the pins are interchangeable components removably carried by the base portion of the engagement assembly.

23. The pusher assembly of claim 17 wherein the predetermined length of the pins corresponds at least in part to the force of the first and second urging members and/or an outer profile of the device being tested.

24. The pusher assembly of claim 17 wherein the first and second urging members include a first spring having a predetermined spring constant and a second spring having a predetermined spring constant such that the individual first and second springs are configured to apply a predetermined force to the engagement assembly.

25. The pusher assembly of claim 17 wherein the engagement element includes a contact surface positioned to directly contact the device being tested, the contact surface having a predetermined configuration based at least in part on a configuration of the device being tested.

26. The pusher assembly of claim 25 wherein the contact surface includes a predetermined shape based at least in part on an outer profile of the device being tested.

27. The pusher assembly of claim 25 wherein the contact surface includes a predetermined planform shape based at least in part on a planform shape of the device being tested.

28. The pusher assembly of claim 17 wherein the engagement assembly is a modular, interchangeable component.

29. A pusher assembly for use in a system for testing microfeature devices, the pusher assembly comprising:

support means having a first side and a second side opposite the first side;

engagement means removably coupled to the second side of the support means and positioned for engaging a microfeature device being tested;

urging means proximate the first side of the support means and positioned for moving the engagement means toward the device being tested;

force adjustment means carried by the engagement means and positioned for restricting the axial movement of the urging means toward the device being tested; and

heat transfer means carried by the first side of the support means.

30. The pusher assembly of claim 29 wherein the support means includes a thermally conductive plate.

31. The pusher assembly of claim 29 wherein the engagement means includes a contact surface positioned to directly contact the device being tested, the contact surface having a predetermined configuration based at least in part on a configuration of the device being tested.

32. The pusher assembly of claim 29 wherein the heat transfer means is in direct thermal contact with the engagement means.

33. A system for testing microfeature devices, the system comprising:

a pusher assembly including—

a plate having a first side and a second side opposite the first side;

an urging member proximate the first side of the plate, the urging member being configured to move the plate toward the devices being tested; and

a heat transfer unit carried by the first side of the plate; and

an inventory of engagement assemblies configured to be removably coupled to the second side of the plate and positioned to contact each microfeature device being tested, the inventory including (a) a first engagement assembly having a first configuration based at least in part on a configuration of a first microfeature device being tested, and (b) a second engagement assembly having a second configuration based at least in part on a configuration of a second microfeature device being tested.

34. A system for testing a microfeature device including a substrate and an array of conductive elements on the substrate, the system comprising:

a test assembly including a test tray insert and a device carrier carried by the test tray insert, the device carrier being configured to receive a device for testing;

a test contact assembly having test contacts, the individual test contacts being positioned to selectively contact corresponding conductive elements on the device being tested; and

a pusher assembly configured to move a device being tested from a first position in the device carrier in which the conductive elements are out of contact with the corresponding test contacts and a second position in which at least a portion of the test contacts are engaged with corresponding conductive elements, the pusher assembly including—

a plate having a first side and a second side opposite the first side;

an engagement assembly removably coupled to the second side of the plate and positioned to contact the device being tested;

an urging member proximate the first side of the plate, the urging member being configured to move the engagement assembly toward the device; and

a heat transfer unit carried by the first side of the plate.

35. The system of claim 34 wherein the pusher assembly further comprises a plurality of pins carried by the engagement assembly such that the pins extend through the plate and engage the urging member to restrict axial movement of the urging member toward the device.

36. The system of claim 35 wherein the pusher assembly includes a first shaft and a second shaft projecting from the first side of the plate, and wherein:

the urging member includes a first spring carried by the first shaft and a second spring carried by the second shaft; and

the heat transfer unit is between the first shaft and the second shaft and in direct thermal contact with the engagement assembly.

37. The system of claim 35 wherein the pins are interchangeable components removably carried by the engagement assembly.

38. The system of claim 35 wherein the pins have a predetermined length corresponding at least in part to the force of the urging member and/or an outer profile of the device being tested.

39. The system of claim 35 wherein the urging member includes a spring having a known spring constant such that the spring is configured to apply a predetermined force to the engagement assembly.

40. The system of claim 34 wherein the plate is a thermally conductive plate.

41. The system of claim 34 wherein the heat transfer unit is in direct thermal contact with the engagement assembly.

42. The system of claim 34 wherein the individual engagement assembly includes a contact surface positioned to directly contact the device being tested, the contact surface having a predetermined configuration based at least in part on a configuration of the device being tested.

43. The system of claim 34 wherein the engagement assembly is a modular, interchangeable component.

44. The system of claim 34, further comprising the microfeature device.

45. A method for testing microfeature devices having a substrate and a plurality of conductive elements on the substrate, the method comprising:

positioning the device within a device carrier such that the conductive elements on the device are out of contact with corresponding test contacts of a test contact assembly;

moving the conductive elements into contact with corresponding test contacts for testing with a pusher assembly, the pusher assembly including an interchangeable engagement assembly configured to contact the device with a desired force such that the conductive elements engage the test contacts with a desired contact force; and

removing heat from the device during testing with a heat transfer unit carried by the pusher assembly.

46. The method of claim 45 wherein:

the pusher assembly includes a plate having a first side, a second side opposite the first side, an urging member proximate the first side, and the engagement assembly releasably coupled to the second side; and

moving the conductive elements into contact with corresponding test contacts for testing with a pusher assembly includes applying a first force to the urging member such that the urging member moves the engagement assembly to contact the device with a second, predetermined force such that the conductive elements engage the test contacts with the desired contact force.

47. The method of claim 45 wherein:

the pusher assembly includes a plate having a first side, a second side opposite the first side, a first spring and a second spring proximate the first side, and the engagement assembly releasably coupled to the second side; and

moving the conductive elements into contact with corresponding test contacts for testing with a pusher assembly includes applying a first force to the first and second springs such that the first and second springs move the engagement assembly to contact with the device with a second, predetermined force such that the conductive elements engage the test contacts with the desired contact force.

48. The method of claim 45 wherein removing heat from the device with a heat transfer unit includes removing heat from the device with a heat transfer unit in direct thermal contact with the engagement assembly.

49. The method of claim 45 wherein the device is a first device and the engagement assembly is a first engagement assembly, and wherein the method further comprises:

removably attaching a second engagement assembly to the pusher assembly in place of the first engagement assembly, the second engagement assembly having a configuration based at least in part on a configuration of a second device to be tested.

50. The method of claim 45 wherein the device is a first device with first conductive elements and the engagement assembly is a first engagement assembly, and wherein the method further comprises:

positioning a second device within the device carrier, the second device including second conductive elements out of contact with the corresponding test contacts;

removably attaching a second engagement assembly to the pusher assembly in place of the first engagement assembly, the second engagement assembly having a configuration based at least in part on a configuration of the second device;

moving the second conductive elements into contact with corresponding test contacts using the second engagement assembly such that the second conductive elements engage the test contacts with a second desired contact force; and

removing heat from the second device with the heat transfer unit.

51. A method for manufacturing a pusher assembly for use in microfeature device testing systems, the method comprising:

positioning one or more urging members on a first shaft projecting from a first side of a plate and a second shaft projecting from the first side of the plate, the one or more urging members being positioned to move the plate toward a device being tested;

removably attaching an engagement assembly to the second side of the plate, the engagement assembly including a plurality of pins removably carried by the engagement assembly extending through the plate and engaging the one or more urging members to provide a stop that restricts axial movement of the one or more urging members toward the device being tested; and

attaching a heat transfer unit to the first side of the plate.

52. The method of claim 51 wherein positioning one or more urging members on a first shaft projecting from a first side of a plate and a second shaft projecting from the first side of the plate includes positioning a first urging member on the first shaft and a second urging member on the second shaft, the first and second urging members having a predetermined force.

53. The method of claim 51 wherein positioning one or more urging members on a first shaft projecting from a first side of a plate and a second shaft projecting from the first side of the plate includes positioning a first spring member on the first shaft and a second spring member on the second shaft, the first and second springs having a predetermined spring constant.

54. The method of claim 51, further comprising providing a first urging member having a first known force and a second urging member having a second known force, the first and second forces being based at least in part on the configuration of the device being tested.

55. The method of claim 51, further comprising providing a thermally-conductive plate.

56. The method of claim 51, further comprising selecting a plurality of pins having a predetermined height based at least in part on the configuration of the device being tested.

57. The method of claim 51, further comprising:

placing a first load ring on the first shaft between the first side of the plate and a first urging member;

placing a second load ring on the second shaft between the first side of the plate and a second urging member; and

engaging the first and second load rings with corresponding pins such that the first and second load rings provide a stop that restricts axial movement of the first and second urging members toward the device being tested.

58. The method of claim 51 wherein attaching a heat transfer unit to the first side of the plate includes attaching the heat transfer unit to the first side between the first shaft and the second shaft.

59. The method of claim 51 wherein removably attaching an engagement assembly to the second side of the plate includes positioning the engagement assembly in direct thermal contact with the heat transfer unit.