Electro-stimulating massage confiner

• US 20070216580A1
• Filed: 03/15/2006
• Published: 09/20/2007
• Est. Priority Date: 03/15/2006
• Status: Abandoned Application

• Current Assignee: Chant Sincere Co., Ltd.
• Original Assignee: Chant Sincere Co., Ltd.
• Inventors: Chen, Yen-Ming, Lin, Shun-Tian, Yang, Chang-Fa, Hu, Chuan-Lin, Wang, Chao-Wei, Liu, Chi-Tzu, Huang, Kuo-Lun, Liao, Chang-Lun, Chen, Yu-Wei
• Application Number:
  US11/374,957
• Publication Number:
  US 20070216580A1
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material

Abstract

A device shell for use in a wireless communication device, is disclosed to have a shell body injection-molded from a compound material in a predetermined shape, and an antenna circuit formed in the shell body and electrically connectable to a circuit board in a wireless communication device in which the device shell is used.

Claims

1. A device shell for use in a wireless communication device, comprising:

a shell body injection-molded from a compound material in a predetermined shape; and

at least one antenna circuit formed in said shell body and electrically connectable to a circuit board in a wireless communication device in which the device shell is used.

2. The device shell as claimed in claim 1, wherein said at least one antenna circuit each has a plurality of metal contacts exposed to the outside of said shell body for contacting respective metal contact means at a circuit board in a wireless communication device in which the device shell is used.

3. The device shell as claimed in claim 2, wherein the metal contacts of said at least one antenna circuit are metal contact pins.

4. The device shell as claimed in claim 2, wherein the metal contacts of said at least one antenna circuit are metal contact springs.

5. The device shell as claimed in claim 1, wherein said at least one antenna circuit is respectively formed in a substrate through an insert molding process and then packaged in said shell body, said substrate being made out of one of the materials of ceramics, polymers, and compounds of ceramics and polymers.

6. The device shell as claimed in claim 1, wherein said at least one antenna circuit is respectively formed in an antenna circuit bonding member through one of the processes of electroplating and electroforming, said antenna circuit bonding member being directly formed in said shell body through one of the processes of secondary molding, screen printing, spray coating, and depositing technique.

7. The device shell as claimed in claim 6, wherein said antenna circuit bonding member is directly formed in said shell body out of one of the materials of conducting polymer and conducting compound material.

8. The device shell as claimed in claim 1, which is made by:

injection molding said shell body, and then covering a layer of a conducting polymer or compound material on said shell body by printing or spray coating, and then employing an electroplating or electroforming process to said layer of conducting polymer or compound material to form said least one antenna circuit.

9. The device shell as claimed in claim 1, which is made by:

injection molding said shell body, and then forming said at least one antenna circuit in said shell body by electroplating or electroforming by means of photoresist or shielding means.

10. The device shell as claimed in claim 1, wherein said at least one antenna circuit is respectively formed in an antenna circuit bonding member through one of the processes of electroplating and electroforming, and then covered with a packaging layer, said packaging layer being selected from a compound material containing ceramics and polymer, or a material having a predetermined dielectric constant, said antenna circuit bonding member being directly formed in said shell body through one of the processes of secondary molding, screen printing, spray coating, and depositing technique.

11. The device shell as claimed in claim 1, wherein said at least one antenna circuit each has a three-dimensional configuration.