Spread illuminating apparatus

• US 20070217202A1
• Filed: 01/30/2007
• Published: 09/20/2007
• Est. Priority Date: 03/14/2006
• Status: Abandoned Application

• Current Assignee: Minebea Company Limited (MinebeaMitsumi Inc.)
• Original Assignee: Minebea Company Limited (MinebeaMitsumi Inc.)
• Inventors: Sato, Makoto
• Application Number:
  US11/699,553
• Publication Number:
  US 20070217202A1
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: G02B 6/0083 Details of electrical connections of light sources to drivers, circuit boards, or the like
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64

Abstract

A spread illuminating apparatus includes: a light conductor plate; at least one LED disposed at a side surface of the light conductor plate; an FPC including a substrate and first and second conductive patterns formed respectively at the front ad rear surfaces of the substrate; and a heat radiating plate to hold the FPC. The LED is mounted on electrode pads formed at the first conductive pattern of the FPC, and all the side faces of the LED are covered with an individual thermal conductor enclosure which is connected to the second conductive pattern via an opening formed at the substrate of the FPC. Thus, a heat radiation system is established from the side faces of the LED through to the heat radiating plate which is affixed to the rear surface of the FPC.

Claims

1. A spread illuminating apparatus comprising:

a light conductor plate;

at least one point light source disposed at a side surface of the light conductor plate;

a flexible printed circuit board comprising a conductive pattern and having the at least one point light source mounted thereon;

a heat radiating plate to hold the flexible printed circuit board; and

at least one thermal conductor enclosure which each covers side faces of each point light source, and which is connected to the conductive pattern of the flexible printed circuit board.

2. A spread illuminating apparatus according to claim 1, wherein:

the flexible printed circuit board further comprises a substrate, with the conductive pattern being composed of first and second conductive patterns formed respectively at a front surface and a rear surface of the substrate;

the point light source is mounted on a pair of electrode pads formed at the first conductive pattern;

the flexible printed circuit board has its rear surface affixed to the heat radiating plate; and

a heat radiation system from the thermal conductor enclosure to the heat radiating plate contains a thermal pathway which connects between the thermal conductor enclosure and the second conductive pattern without the substrate intervening therebetween.

3. A spread illuminating apparatus according to claim 2, wherein the flexible printed circuit board comprises an opening at a front surface thereof so as to expose a part of the second conductive pattern, and the thermal pathway is formed such that the thermal conductor enclosure is connected to the part of the second conductive pattern exposed from the opening.

4. A spread illuminating apparatus according to claim 2, wherein the thermal conductor enclosure is connected to a thermal pad formed at the first conductive pattern, and the thermal pathway is formed such that a throughhole communicating with the second conductive pattern is formed at the thermal pad.

5. A spread illuminating apparatus according to claim 1, wherein the thermal conductor enclosure comprises two separate members opposing each other with an air gap therebetween.

6. A spread illuminating apparatus according to claim 5, wherein the two separate members of the thermal conductor enclosure are connected respectively to the pair of electrode pads having each point light source mounted thereon.

7. A spread illuminating apparatus according to claim 1, wherein the thermal conductor enclosure is made of a copper material and connected to the conductive patter by soldering.

8. A spread illuminating apparatus according to claim 7, wherein the thermal conductor enclosure is connected to the conductive pattern when the point light source is mounted on the flexible printed circuit board.