Light emitting device unit for AC voltage

• US 20070217210A1
• Filed: 01/22/2007
• Published: 09/20/2007
• Est. Priority Date: 03/20/2006
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Kim, Hyung-kun, Kim, Yu-sik, Cho, Jae-hee, Jeong, Jae-wook
• Application Number:
  US11/655,830
• Publication Number:
  US 20070217210A1
• Time in Patent Office: Days
• US Class Current: 362/428
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H05B 45/00 Circuit arrangements for operating light-emitting diodes [LED]
• CPC Class Codes: H05B 45/40 Details of LED load circuits
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

A light emitting diode unit for AC voltage is provided. The light emitting diode unit includes a sub-mount on which electric wires are formed; a first light emitting diode array in which a plurality of first light emitting diodes are serially connected to the sub-mount; and a second light emitting diode array, in which a plurality of second light emitting diodes are connected to the sub-mount as bridge circuits, connecting to the first light emitting diode array. Therefore, rectification can be performed through the bridge circuit without an additional rectifying device by connecting the light emitting diodes to the bridge circuit in series, and thus the structure of the unit can be simplified and a size of the light emitting diode unit can be reduced.

Claims

1. A light emitting diode unit for alternating current (AC) voltage, the light emitting diode unit comprising:

a sub-mount, on which electric wires are formed;

a first light emitting diode array in which a plurality of first light emitting diodes are serially connected to the sub-mount; and

a second light emitting diode array, in which a plurality of second light emitting diodes are connected to the sub-mount in the form of a bridge circuit connecting to the first light emitting diode array.

2. The light emitting diode unit of claim 1, wherein the first light emitting diode and the second light emitting diode are light emitting chips.

3. The light emitting diode unit of claim 1, wherein a breakdown voltage (V_b) of the second light emitting diode satisfies following equation,

$V_b>$

( V p - nV f ) n ,

where V_f denotes a forward voltage of the second light emitting diode, V_p denotes a maximum value of the supplied voltage, and n denotes the number of second light emitting diodes arranged on a side of the bridge circuit.

4. The light emitting diode unit of claim 1, wherein the first and second light emitting diodes are mounted on the sub-mount as flip chips.

5. The light emitting diode unit of claim 1, wherein one of the second light emitting diodes is connected to a side of the bridge circuit, or a plurality of the second light diodes are serially connected to a side of the bridge circuit.

6. The light emitting diode unit of claim 1, wherein the number of first and second light emitting diodes that emit light during a half period of the AC voltage is larger than a value of (V_p/V_f) when V_f denotes the forward voltages applied to the first and second light emitting diodes and V_p denotes a maximum value of the supplied voltage.