Articles and methods including patterned substrates formed from densified, adhered metal powders

• US 20070218258A1
• Filed: 03/20/2006
• Published: 09/20/2007
• Est. Priority Date: 03/20/2006
• Status: Abandoned Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Hackett, Steven, Brown, Katherine, Do, Thanh-Huong, Nees, Terry, Michel, Matthew
• Application Number:
  US11/385,008
• Publication Number:
  US 20070218258A1
• Time in Patent Office: Days
• US Class Current: 428/209
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 2203/0143 Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
• CPC Class Codes: H05K 3/102 by bonding of conductive powder, i.e. metallic powder H05K3/12 takes precedence
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 156/1039 Surface deformation only of sandwich or lamina [e.g., embossed panels]
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

In general the disclosure relates to manufacturing methods for producing conductive patterns on flexible substrates. For example, a layer of a metal powder composition is deposited onto an adhesive overlaying a substrate. Pressure is applied to the metal powder composition on the adhesive coated substrate web by a die having one or more projections, in order to reproduce a pattern on the substrate. The metal powder is compressed by the projections of the die, thereby densifying the powder and causing it to adhere to the adhesive in a reproduction of the die pattern. The metal powder does not adhere substantially in uncompressed regions, and may be removed. In this manner, a metal powder composition may be densified and adhered to a substrate forming a web of flexible circuit elements, for example, circuit elements such as antennas, resistors, capacitors, inductive coils, conduction pads and the like.

Claims

1. An article comprising:

a flexible substrate;

an adhesive covering a surface of the flexible substrate; and

a densified metal powder adhered to the flexible substrate by the adhesive, wherein the densified metal powder forms a pattern.

2. The article according to claim 1, wherein the densified metal powder is less than 100% dense.

3. The article according to claim 1, wherein the flexible substrate comprises a polymeric film.

4. The article according to claim 1, wherein the metal powder comprises one or more electrically conductive metal selected from the group consisting of tin, copper and aluminum.

5. The article according to claim 1, wherein the adhesive comprises a thermoplastic (co)polymer.

6. The article according to claim 1, wherein the densified metal powder exhibits a resistivity from about 2 to about 50 microohm-cm.

7. The article according to claim 1, wherein the flexible substrate is a continuous roll.

8. The article according to claim 1, wherein the surface is a first surface of the flexible substrate and the article further comprises:

a second adhesive covering a second surface of the flexible substrate; and

a densified metal powder overlaying the second adhesive layer, wherein the densified metal powder is less than 100% dense.

9. The article according to claim 1, further comprising an overlayer covering at least a portion of the densified metal powder.

10. The article according to claim 1, wherein the flexible substrate comprises one or more polymer selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polyimide, polyolefin, and polystyrene;

wherein the adhesive comprises one or more (co)polymer selected from the group consisting of (co)polymers of ethylene and alkyl acrylic esters, (co)polymers of ethylene and alkyl acrylic esters modified with anhydride or acid groups, (co)polymers of ethylene and vinyl acetate, (co)polymers of ethylene and methacrylic acid, (co)polymers of ethylene and acrylic acid, copolymers of ethylene and octane, and syndiotactic polypropylene; and

wherein the pattern formed by the densified metal powder is an electrically conductive circuit pattern comprising one or more electrical circuit elements selected from the group consisting of a conductive path, a connection pad, a capacitor, a capacitor plate, a resonant coil, a resistor, a fuse, an inductive coil, a bridge, and an antenna.

11. A process comprising:

applying an adhesive layer to a first surface of a flexible substrate;

applying a metal powder to the adhesive layer; and

compressing the metal powder on the adhesive layer for a time and at a pressure sufficient to form a pattern of densified adhered metal powder.

12. The process of claim 11, wherein compressing comprises applying a pressure to the metal powder to densify the metal powder to less than 100% dense.

13. The process of claim 11, wherein compressing comprises compressing the metal powder with a patterned die to form the pattern corresponding to raised elements of the patterned die.

14. The process according to claim 11, further comprising removing uncompressed metal powder from the adhesive layer.

15. The process according to claim 11, wherein the compressed metal powder exhibits a resistivity from about 2 to about 50 microohm-cm.

16. The process according to claim 11, further comprising:

applying a second adhesive layer to a second surface of a flexible substrate;

applying a metal powder to the second adhesive layer;

compressing the metal powder on the second adhesive layer on the second surface with a patterned die having raised elements in the form of a pattern, for a time and at a pressure sufficient to densify the metal powder to at least about 90% and at most less than 100% dense in a pattern corresponding to the raised elements of the patterned die; and

removing uncompressed metal powder from the second adhesive layer.

17. The process according to claim 11, further comprising applying an overlayer covering at least a portion of the densified metal powder.

18. A system for making a continuous patterned flexible substrate, comprising:

a web handling assembly for feeding a continuous flexible substrate bearing a first adhesive layer from a supply roll to a take-up roll;

a first powder applicator for applying a metal powder to the first adhesive layer at a position between the supply roll and the take-up roll;

a patterned die having raised elements in the form of a pattern positioned between the powder applicator and the take-up roll and configured to apply a pressure to the metal powder on the first adhesive layer for a time sufficient to densify the metal powder to at least about 90% and at most less than 100% dense in a pattern corresponding to the raised elements of the patterned die; and

a powder removal device for removing uncompressed metal powder from the first adhesive layer.

19. The system according to claim 18, further comprising a second powder applicator for applying a metal powder to a second adhesive layer;

a patterned die having raised elements in the form of a pattern and configured to apply a pressure to the applied metal powder on the second adhesive layer for a time sufficient to densify the metal powder to at least about 90% and at most less than 100% dense in a pattern corresponding to the raised elements of the patterned die.

20. The system according to claim 18, further comprising an overlayer applicator for applying an overlayer covering at least a portion of the densified metal powder after removing uncompressed metal powder from the first adhesive layer.