SEMICONDUCTOR-PROCESSING APPARATUS WITH ROTATING SUSCEPTOR

• US 20070218702A1
• Filed: 02/15/2007
• Published: 09/20/2007
• Est. Priority Date: 03/15/2006
• Status: Abandoned Application

• Current Assignee: ASM Japan K.K. (ASM International NV)
• Original Assignee: ASM Japan K.K. (ASM International NV)
• Inventors: SHIMIZU, Akira, TAK, Young-Duck, KOH, Wonyong, PARK, Hyung-Sang
• Application Number:
  US11/675,520
• Publication Number:
  US 20070218702A1
• Time in Patent Office: Days
• US Class Current: 438/758
• CPC Class Codes: C23C 16/06 characterised by the deposition of metallic material
• CPC Class Codes: C23C 16/36 Carbonitrides
• CPC Class Codes: C23C 16/45551 for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
• CPC Class Codes: H01L 21/67161 characterized by the layout of the process chambers
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece
• CPC Class Codes: H01L 21/68764 characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Abstract

An apparatus for depositing thin film on a processing target includes: a reaction space; a susceptor movable up and down and rotatable around its center axis; and isolation walls that divide the reaction space into multiple compartments including source gas compartments and purge gas compartments, wherein when the susceptor is raised for film deposition, a small gap is created between the susceptor and the isolation walls, thereby establishing gaseous separation between the respective compartments, wherein each source gas compartment and each purge gas compartment are provided alternately in a susceptor-rotating direction of the susceptor.

Claims

1. An apparatus for deposition thin film on a target, comprising:

a reaction space;

a susceptor having multiple target-supporting areas thereon and disposed inside the reaction space for placing multiple targets each on the target-supporting areas, said susceptor being movable between an upper position and a lower position in its axial direction and being rotatable around its axis when at the upper position; and

multiple compartments for processing divided by partition walls which each extend radially from a central axis of the multiple compartments, said multiple compartments being disposed inside the reaction space over the susceptor with a gap such that the susceptor can continuously rotate at the upper position for film deposition on the targets without contacting the partition walls, said multiple compartments being configured to operate different processes in the compartments simultaneously while the susceptor on which the targets are placed is rotating at the upper position.

2. The apparatus according to claim 1, wherein at least one of the partition walls has at least one gas outflow hole for introducing reaction gas or purge gas into one of the multiple compartments which is defined by the at least one of the partition walls.

3. The apparatus according to claim 1, wherein a center of the partition walls has a gas outflow hole for introducing purge gas or inert gas to a center of the multiple compartments.

4. The apparatus according to claim 1, wherein the partition walls have gas outflow holes for discharging inert gas toward the susceptor as a gas curtain to separate the multiple compartments with respect to gas.

5. The apparatus according to claim 1, wherein at least one of the partition walls has front and back sides with respect to a susceptor-rotating direction, said at least one of the partition walls separating two of the multiple compartments, one of the front and back sides having at least one gas outflow hole for introducing reaction gas or purge gas into one of the two multiple compartments, the other of the front and back sides having at least one gas outflow hole for discharging inert gas toward the susceptor as a gas curtain to separate the one of the two multiple compartments from the other of the two multiple compartments with respect to gas.

6. The apparatus according to claim 5, wherein the front and back sides of the partition wall have planes, respectively, facing the susceptor, angled to each other, and facing away from each other.

7. The apparatus according to claim 1, wherein at least one of the multiple compartments is provided with a gas outflow port at an upper part of the at least one of the multiple compartments for introducing reaction gas or purge gas thereinto.

8. The apparatus according to claim 7, wherein the susceptor has annular slits formed around the target-supporting areas for passing gas therethrough.

9. The apparatus according to claim 1, wherein the susceptor has slits for passing gas therethrough each formed between the target-supporting areas.

10. The apparatus according to claim 9, wherein the slits are constituted by recesses extending from a periphery of the susceptor toward a central axis of the susceptor.

11. The apparatus according to claim 1, further comprising an exhaust system having gas inflow ports provided under the susceptor.

12. The apparatus according to claim 11, wherein the exhaust system is movable in the axial direction of the susceptor together with the susceptor without rotating around its axis.

13. The apparatus according to claim 1, wherein the multiple compartments have different sizes in a susceptor-rotating direction.

14. The apparatus according to claim 1, wherein each target-supporting area is rotatable around its axis at a rotation speed faster than the susceptor.

15. The apparatus according to claim 1, wherein at least one of the multiple compartments has a size such that each target-supporting area cannot be fully included in a region corresponding to the at least one of the multiple compartments.

16. The apparatus according to claim 1, wherein at least one of the multiple compartments is provided with an RF power supply unit or an annealing unit.

17. The apparatus according to claim 1, wherein at least one of the multiple compartments is provided with a shower plate for introducing reaction gas into the at least one of the multiple compartments.

18. An apparatus for depositing thin film on a processing target, comprising:

a reaction space;

a susceptor for placing multiple processing targets thereon, said susceptor being movable up and down and rotatable around its center axis; and

isolation walls that divide the reaction space into multiple compartments including source gas compartments and purge gas compartments, wherein when the susceptor is raised for film deposition, a small gap is created between the susceptor and the isolation walls, thereby establishing gaseous separation between the respective compartments, wherein each source gas compartment and each purge gas compartment are provided alternately in a susceptor-rotating direction of the susceptor.

19. The apparatus according to claim 18, wherein the small gap is about 0.5 mm to about 2.0 mm.

20. A method of processing semiconductor targets, comprising:

placing multiple semiconductor targets each on target-supporting areas provide on a susceptor disposed inside a reaction space;

rotating the susceptor around its axis at an upper position where multiple compartments for processing divided by partition walls each extending radially from a central axis of the multiple compartments are disposed over the susceptor with a gap such that the susceptor continuously rotates at the upper position for film deposition on the targets without contacting the partition walls; and

creating processing conditions in each compartment independently and simultaneously while the susceptor on which the targets are placed is continuously rotating at the upper position, thereby processing the targets.

21. The method according to claim 20, wherein the creating step comprises introducing reaction gas or purge gas from at least one gas outflow hole provided in at least one of the partition walls into one of the multiple compartments which is defined by the at least one of the partition walls.

22. The method according to claim 21, wherein the creating step comprises introducing purge gas or inert gas from a gas outflow hole provided in a center of the partition walls to a center of the multiple compartments.

23. The method according to claim 20, wherein the creating step comprises discharging inert gas from gas outflow holes provided in the partition walls toward the susceptor as a gas curtain, thereby separating the multiple compartments with respect to gas.

24. The method according to claim 20, wherein the creating step comprises:

introducing reaction gas or purge gas from at least one gas outflow hole provided on either a front or a back side provided in at least one of the partition walls into one of two of the multiple compartments divided by the at least one of the partition walls; and

introducing inert gas from at least one gas outflow hole provided on the other of the front and back sides provided in the at least one of the partition walls toward the susceptor as a gas curtain to separate the one of the two multiple compartments from the other of the two multiple compartments with respect to gas.

25. The method according to claim 24, wherein the reaction gas or purge gas and the inert gas are introduced in directions away from each other.

26. The method according to claim 20, wherein the creating step comprises introducing reaction gas or purge gas into at least one of the multiple compartments from a gas outflow port provided in the at least one of the multiple compartments at its upper part.

27. The method according to claim 26, wherein the creating step further comprises passing gas through annular slits formed around the target-supporting areas of the susceptor.

28. The method according to claim 20, wherein the creating step further comprises passing gas through slits provided in the susceptor each formed between the target-supporting areas.

29. The method according to claim 28, wherein the gas is passed through the slits extending from a periphery of the susceptor toward a central axis of the susceptor.

30. The method according to claim 20, wherein the creating step further comprises discharging gas from the reaction space through gas inflow ports provided under the susceptor.

31. The method according to claim 30 further comprising moving the gas inflow ports in the axial direction of the susceptor together with the susceptor without rotating around its axis prior to the creating step.

32. The method according to claim 20, wherein the creating step further comprises rotating each target-supporting area around its axis at a rotation speed faster than the susceptor.

33. The method according to claim 20, wherein the creating step comprises introducing reaction gas into one of the multiple compartments, and introducing purge gas into another of the multiple compartments adjacent to and upstream of the one of the compartments in a susceptor-rotating direction.

34. The method according to claim 33, wherein the other of the multiple compartments has a size such that each target on the target-supporting area cannot be fully included in a region corresponding to the other of the multiple compartments at all times of rotating the susceptor.

35. The method according to claim 20, wherein the creating step comprises applying RF power or conducting annealing of the targets in at least one of the multiple compartments.

36. The method according to claim 20, wherein the creating step comprises controlling a rotating speed of the susceptor to deposit atomic layers on the targets while traveling through the multiple compartments.

37. The method according to claim 36, wherein the creating step further comprises constantly applying RF power in at least one of the multiple compartments while the susceptor is rotating, thereby depositing the atomic layers on the targets without a need for intermittent on/off operations of RF power.