SILICONE ADHESIVE COMPOSITION AND METHOD FOR PREPARING THE SAME
First Claim
1. A thermal interface composition comprises a blend of a polymer matrix and a thermally conductive filler comprising particles having a maximum particle diameter of no greater than about 25 microns, said polymer matrix comprising an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilylation catalyst comprising a transition metal, wherein said transition metal catalyst is present in an amount of from about 10 to about 20 ppm based on the weight of the non-filler component and the molar ratio of the silicon-bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2.
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Abstract
A thermal interface material composition including a blend of a polymer matrix and a thermally conductive filler having particles having a maximum particle diameter no greater than about 25 microns, wherein the polymer matrix includes an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilyation catalyst comprising a transition metal, wherein the transition metal is present in an amount of from about 10 to about 20 ppm by weight based on the weight of the non-filler components and the molar ratio of the silicon-bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2. A method is also provided.
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Citations
31 Claims
- 1. A thermal interface composition comprises a blend of a polymer matrix and a thermally conductive filler comprising particles having a maximum particle diameter of no greater than about 25 microns, said polymer matrix comprising an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilylation catalyst comprising a transition metal, wherein said transition metal catalyst is present in an amount of from about 10 to about 20 ppm based on the weight of the non-filler component and the molar ratio of the silicon-bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2.
- 18. A method for making a thermal interface composition comprising blending a polymer matrix and a filler comprising particles having a maximum particle diameter of no greater than about 25 microns, said polymer matrix comprising an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilylation catalyst comprising a transition metal, wherein said transition metal is present in an amount of from about 10 to about 20 ppm based on the weight of the non-filler components and the molar ratio of the silicon-bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2.
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30. A one-part heat cure composition comprising a blend of a polymer matrix and a thermally conductive filler comprising particles having a maximum particle diameter of no greater than about 25 microns, said polymer matrix comprising an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilylation catalyst comprising a transition metal, wherein said transition metal is present in an amount of from about 10 to about 20 ppm by weight based on the weight of the non-filler components and the molar ratio of the silicon-bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2.
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31. A method for making a two-part thermal interface composition comprises mixing part A and part B in a 1:
- 1 ratio by weight to form the composition, wherein said composition comprises a polymer matrix and a thermally conductive filler comprising particles having a maximum particle diameter of no greater than about 25 microns, said polymer matrix comprising an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilylation catalyst comprising a transition metal, wherein said transition metal is present in an amount of from about 10 to about 20 ppm based on the weight of the non-filler components and the molar ratio of the silicon-bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2.
Specification