Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium

• US 20070219736A1
• Filed: 02/15/2007
• Published: 09/20/2007
• Est. Priority Date: 02/17/2006
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Okita, Shinichi
• Granted Patent: US 8,134,681 B2
• Time in Patent Office: Days
• US Class Current: 702/81
• CPC Class Codes: G03F 7/70525 Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure

Abstract

When a host issues an analysis order that specifically instructs the analytical contents to an analytical apparatus (step 401), the analytical apparatus collects two types of measurement and/or inspection results from a measurement and/or inspection instrument (steps 403 to 409), and in step 411, the analytical apparatus analyzes the measurement and/or inspection results and optimizes processing conditions of a series of processes related to wafer W. In step 411, data related to a processing state of a processing apparatus is acquired from the processing apparatus as needed. In step 413, the measurement and/or inspection results and the optimization results are accumulated in a database, and the optimization results are transmitted to various processing apparatuses (including the measurement and/or inspection instrument). After that, the analytical apparatus sends a processing end notice to the host (step 417).

Claims

1. An adjustment method in which a processing condition of a series of a plurality of substrate processings that include a measurement and/or inspection processing is adjusted, the method comprising:

a collection process of collecting information on at least two types of measurement and/or inspection results related to at least one substrate;

an optimization process of optimizing a processing condition of at least part of the plurality of substrate processings based on the collected information on at least two types of measurement and/or inspection results; and

a transmission process of transmitting information on the optimized processing condition to an apparatus that performs a relevant processing.

2. The adjustment method according to claim 1, wherein

in the optimization process, a substrate processing to be optimized is decided based on information on a correlation between the at least two types of measurement and/or inspection results.

3. The adjustment method according to claim 1, wherein

in the optimization process, the processing condition is optimized based on information on at least one of a correlation between the at least two types of measurement and/or inspection results and a total of the at least two types of measurement and/or inspection results.

4. The adjustment method according to claim 3, wherein

the plurality of substrate processings include a film formation processing of forming a film on the substrate and an exposure processing of forming a pattern on the substrate by exposing the substrate,

the information on at least two types of measurement and/or inspection results includes first information on a measurement result of the thickness of a film formed on the substrate by the film formation processing and second information on a measurement result of an alignment mark formed on a base of the substrate before the exposure processing,

a processing condition to be optimized includes at least one of a processing condition related to an alignment condition of the substrate in the exposure processing and a film formation condition of a film on the substrate, and

in the optimization process, in the case there is a correlation between the first information and the second information, at least one of a measurement condition of the poisoning mark and a film formation condition is optimized so that a measurement result of the alignment mark of the substrate is not affected by the thickness of a film.

5. A substrate processing method, comprising:

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 4.

6. The adjustment method according to claim 3, wherein

the plurality of substrate processings include a film formation processing of forming a film on the substrate and an exposure processing of transferring a pattern to the substrate via a projection optical system,

the information on at least two types of measurement and/or inspection results includes first information on a measurement result of the thickness of a film formed on the substrate by the film formation processing and second information on a measurement result of a surface shape of an exposed surface of the substrate in the exposure processing,

a processing condition to be optimized includes at least one of a processing condition related to focus of the substrate with respect to the projection optical system in the exposure processing and a film formation condition of a film on the substrate, and

in the optimization process, in the case there is a correlation between the first information and the second information, the film formation condition is optimized, and the processing condition related to focus is optimized based on the first information and the second information.

7. A substrate processing method, comprising:

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 6.

8. The adjustment method according to claim 1, wherein

the at least two types of measurement and/or inspection results are measurement and/or inspection results in a measurement and/or inspection processing that is performed before and after at least one specific processing out of the plurality of substrate processings, and

in the optimization process, the processing condition is optimized based on information on at least one of a correlation, quality and change of the at least two types of measurement and/or inspection results.

9. The adjustment method according to claim 8, wherein

in the optimization process, in the case abnormality is not detected in an anterior measurement and/or inspection processing before the specific processing and abnormality is detected in a posterior measurement and/or inspection processing after the specific processing, a processing condition of a substrate processing that is performed before the posterior measurement and/or inspection processing is optimized.

10. The adjustment method according to claim 9, wherein

in the optimization process, in the case abnormality is not detected in an anterior measurement and/or inspection processing before the specific processing and abnormality is detected in a posterior measurement and/or inspection processing after the specific processing and also there is a correlation between information on a measurement and/or inspection result of the anterior measurement and/or inspection processing and information on a measurement and/or inspection result of the posterior measurement and/or inspection processing, a processing condition of the anterior measurement and/or inspection processing is optimized.

11. The adjustment method according to claim 9, wherein

in the optimization process, in the case abnormality is not detected in an anterior measurement and/or inspection processing before the specific processing and abnormality is detected in a posterior measurement and/or inspection processing after the specific processing, information on a processing state of a substrate processing that is performed before the posterior measurement and/or inspection processing is acquired, and the processing condition is optimized based on the acquired information.

12. The adjustment method according to claim 11, wherein

information on a processing state of the specific processing is preferentially analyzed and a processing condition of the specific processing is optimized.

13. The adjustment method according to claim 9, wherein

in the optimization process, a processing condition of a substrate processing that is performed after the posterior measurement and/or inspection processing is also optimized further.

14. The adjustment method according to claim 1, further comprising:

a storage process of storing a causal relation between the information on at least two types of measurement and/or inspection results and information on an optimization result of the processing condition; and

an extraction process of extracting a processing condition that has high correlativity with the measurement and/or inspection results based on the storage result, the storage process and the extraction process being performed while performing the plurality of substrate processings to a plurality of substrates, wherein

in the optimization process, the extracted processing condition is preferentially optimized.

15. The adjustment method according to claim 1, further comprising:

an extraction process of extracting regularity of information on the measurement and/or inspection results, while performing the plurality of substrate processings to a plurality of substrates, wherein

in the optimization process, the processing condition is optimized based on the extracted regularity.

16. The adjustment method according to claim 1, wherein

the plurality of substrate processings include a film formation processing of forming a film on the substrate and an exposure processing of forming a pattern on the substrate by exposing the substrate,

the information on at least two types of measurement and/or inspection results includes first information on a foreign substance inspection result on the substrate before the exposure processing and second information on a foreign substance inspection result on the substrate after the exposure processing, and

in the optimization process, in the case a foreign substance is not detected in the first information and a foreign substance is detected in the second information and also there is a correlation between the first information and the second information, an inspection condition of a foreign substance on the substrate before the exposure processing is optimized.

17. A substrate processing method, comprising:

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 16.

18. The adjustment method according to claim 1, wherein

the plurality of substrate processings include a film formation processing of forming a film on the substrate, an exposure processing of forming a pattern on the substrate by liquid immersion exposure and a removal processing of liquid on the substrate,

the information on at least two types of measurement and/or inspection results includes first information on an inspection result before the exposure processing of a film formed on the substrate by the film formation processing, and second information on an inspection result of a foreign substance on the substrate after the exposure processing, and

in the optimization process, in the case the first information is normal and the second information is abnormal, information on a processing state of the exposure processing is acquired, and a processing condition of at least one of the exposure processing and the removal processing is optimized based on the acquired information.

19. A substrate processing method, comprising:

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 18.

20. A substrate processing method in which a plurality of substrate processings that include an exposure processing of forming a pattern on a substrate by exposing the substrate and an inspection processing of inspecting the substrate afterward are performed, the method comprising:

an acquisition process of acquiring information as to whether the exposure processing has been performed by liquid immersion exposure or dry exposure; and

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 18, in the case the exposure processing is judged to have been performed by liquid immersion exposure based on the acquired information.

21. The adjustment method according to claim 1, wherein

the plurality of substrate processings include a film formation processing of forming a film on the substrate, an exposure processing of forming a pattern on the substrate by liquid immersion exposure, a removal processing of liquid on the substrate and a postbake processing to the substrate,

the information on at least two types of measurement and/or inspection results includes first information on a foreign substance inspection result of the substrate before the postbake processing and second information on a foreign substance inspection result of the substrate after the postbake processing,

in the case the first information is normal and the second information is abnormal, information on a processing state of the postbake processing is acquired, and in the optimization process, in the case the postbake processing is judged not to be a factor of abnormality in the second information based on the acquired information, at least one of a processing condition of the foreign substance inspection processing of the substrate before the postbake processing, a processing condition of the exposure processing and a processing condition of the liquid removal processing is optimized.

22. A substrate processing method, comprising:

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 21.

23. A substrate processing method in which a plurality of substrate processings that include an exposure processing of forming a pattern on a substrate by exposing the substrate and an inspection processing of inspecting the substrate afterward are performed, the method comprising:

an acquisition process of acquiring information as to whether the exposure processing has been performed by liquid immersion exposure or dry exposure; and

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 21, in the case the exposure processing is judged to have been performed by liquid immersion exposure based on the acquired information.

24. The adjustment method according to claim 1, wherein

the plurality of substrate processings include a film formation processing of forming a film on the substrate, an exposure processing of forming a pattern on the substrate by liquid immersion exposure, a removal processing of liquid on the substrate, a postbake processing to the substrate and a development processing to the substrate,

the information on at least two types of measurement and/or inspection results includes first information on a foreign substance inspection result of the substrate before the postbake processing and second information on a pattern inspection result of the substrate after the development processing,

in the case the first information is normal and the second information is abnormal, information on a processing state of the development processing and the postbake processing is acquired, and

in the optimization process, in the case the development processing and the postbake processing are judged not to be a factor of abnormality in the second information based on the acquired information, at least one of an inspection condition of the substrate before and after the postbake processing, a processing condition of the exposure processing and a processing condition of the liquid removal processing is optimized.

25. A substrate processing method, comprising:

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 24.

26. A substrate processing method in which a plurality of substrate processings that include an exposure processing of forming a pattern on a substrate by exposing the substrate and an inspection processing of inspecting the substrate afterward are performed, the method comprising:

an acquisition process of acquiring information as to whether the exposure processing has been performed by liquid immersion exposure or dry exposure; and

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 24, in the case the exposure processing is judged to have been performed by liquid immersion exposure based on the acquired information.

27. The adjustment method according to claim 1, wherein

the plurality of substrate processings include a film formation processing of forming a film on the substrate, an exposure processing of forming a pattern on the substrate by liquid immersion exposure, a removal processing of liquid on the substrate, a postbake processing to the substrate and a development processing to the substrate,

the information on at least two types of measurement and/or inspection results includes first information on a foreign substance inspection result of the substrate before the development processing and second information on a pattern inspection result of the substrate after the development processing,

in the case the first information is normal and the second information is abnormal, information on a processing state of the development processing is acquired, and

in the optimization process, in the case the development processing is judged not to be a factor of abnormality in the second information based on the acquired information, at least one of a measurement and/or inspection condition of the measurement and/or inspection before the development processing, a processing condition of the exposure processing and a processing condition of the liquid removal processing is optimized.

28. A substrate processing method, comprising:

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 27.

29. A substrate processing method in which a plurality of substrate processings that include an exposure processing of forming a pattern on a substrate by exposing the substrate and an inspection processing of inspecting the substrate afterward are performed, the method comprising:

an acquisition process of acquiring information as to whether the exposure processing has been performed by liquid immersion exposure or dry exposure; and

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 27, in the case the exposure processing is judged to have been performed by liquid immersion exposure based on the acquired information.

30. The adjustment method according to claim 1, wherein

the plurality of substrate processings include a film formation processing of forming a film on the substrate, an exposure processing of forming a pattern on the substrate by liquid immersion exposure, a removal processing of liquid on the substrate, a postbake processing to the substrate, a development processing to the substrate and an etching processing to the substrate,

the information on at least two types of measurement and/or inspection results includes first information on a measurement result of a surface shape of an exposed surface of the substrate before the exposure processing, and second information on a measurement result of a size of a pattern on the substrate after the development processing or the etching processing,

in the case the first information is normal and the second information is abnormal, information on a processing state of at least one of the development processing, the postbake processing and the exposure processing is acquired and analyzed, and

in the case the development processing, the postbake processing and the etching processing are judged not to be a factor of abnormality in the second information, at least one of a processing condition of the exposure processing and a processing condition of the liquid removal processing is optimized.

31. A substrate processing method, comprising:

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 30.

32. A substrate processing method in which a plurality of substrate processings that include an exposure processing of forming a pattern on a substrate by exposing the substrate and an inspection processing of inspecting the substrate afterward are performed, the method comprising:

an acquisition process of acquiring information as to whether the exposure processing has been performed by liquid immersion exposure or dry exposure; and

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 30, in the case the exposure processing is judged to have been performed by liquid immersion exposure based on the acquired information.

33. The adjustment method according to claim 1, wherein

the plurality of substrate processings include a film formation processing of forming a film on the substrate, an exposure processing of forming a pattern on the substrate by liquid immersion exposure, a development processing to the substrate and an etching processing to the substrate,

the information on at least two types of measurement and/or inspection results includes first information on a measurement result of a size of a pattern on the substrate after the development processing and second information on a measurement result of a size of the pattern on the substrate after the etching processing,

in the case the first information is normal and the second information is abnormal, information on a processing state of the etching processing is acquired and analyzed, and

in the case the etching processing is judged not to be a factor of abnormality in the second information, at least one of a processing condition of the exposure processing and a processing condition of the liquid removal processing is optimized.

34. A substrate processing method, comprising:

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 33.

35. The adjustment method according to claim 1, wherein

the plurality of substrate processings include a film formation processing of forming a film on the substrate, an exposure processing of forming a pattern on the substrate by liquid immersion exposure, a postbake processing to the substrate, a development processing to the substrate and an etching processing to the substrate,

the information on at least two types of measurement and/or inspection results includes first information on a measurement and/or inspection result before the exposure processing of a film formed on the substrate by the film formation processing, and second information on a measurement result of variation in a size of a pattern on the substrate after the development processing or the etching processing, and

based on correlativity between the first information and the second information and the change of the first information and the second information, at least one of a film formation/coating condition and a processing condition of the exposure processing is optimized.

36. A substrate processing method, comprising:

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 35.

37. The adjustment method according to claim 1, wherein

the plurality of substrate processings include a film formation processing of performing formation or coating of a film on the substrate, and an exposure processing of forming a pattern on the substrate by liquid immersion exposure,

the information on at least two types of measurement and/or inspection results includes first information on a measurement result of a processing parameter that is used for alignment of the substrate before the exposure processing, and second information on a measurement result of overlay of a pattern on the substrate after the development processing or the etching processing, and

in the case the first information is normal and the second information is abnormal, a processing condition of an alignment processing of the substrate is optimized based on correlativity between the first information and second information.

38. A substrate processing method, comprising:

an adjustment process of adjusting a processing condition of a substrate processing using the adjustment method according to claim 37.

39. A substrate processing apparatus that performs a substrate processing according to transmitted information using the adjustment method according to claim 1.

40. A substrate processing method in which a plurality of substrate processings that include an exposure processing of forming a pattern on a substrate by exposing the substrate and an inspection processing of inspecting the substrate afterward are performed, the method comprising:

an acquisition process of acquiring information as to whether the exposure processing is performed by liquid immersion exposure or dry exposure; and

an adjustment process of adjusting a processing content of at least part of the plurality of substrate processings in accordance with the acquired information; and

a transmission process of transmitting the adjustment result to an apparatus that performs a relevant processing.

41. The substrate processing method according to claim 40, wherein

in the adjustment process, at least one of an inspection item, inspection sensitivity and an inspection condition of the inspection processing is switched depending on liquid immersion exposure or dry exposure.

42. The substrate processing method according to claim 41, wherein

in the case the exposure processing is performed by liquid immersion exposure, at least one of a defect inspection with respect to a pattern defect peculiar to liquid immersion exposure, an abnormality inspection of abnormality of the substrate due to liquid used for liquid immersion exposure, and a remaining liquid inspection of liquid that adheres on the substrate after liquid immersion exposure is added as an inspection item of the inspection processing.

43. The substrate processing method according to claim 42, wherein

the pattern defect peculiar to liquid immersion exposure includes a stain adhering to an optical element of a projection optical system that comes into contact with the liquid, or a pattern defect due to a bubble or a foreign substance in the liquid,

the abnormality inspection of abnormality of the substrate due to the liquid includes an inspection related to a watermark, a stain due to infiltrating of a material of a film formed on the substrate into the liquid and peeling of a film on the substrate, and

the remaining liquid inspection includes a foreign substance inspection of a foreign substance in remaining liquid on the substrate.

44. The substrate processing method according to claim 41, wherein

in the case the exposure processing is performed by liquid immersion exposure, the inspection sensitivity of the inspection processing is set slightly higher than that of dry exposure.

45. The substrate processing method according to claim 41, wherein

an inspection condition of the inspection processing includes at least one of a wavelength of illumination light that illuminates the substrate during the inspection, a detection method, a detection optical system and a detection algorithm.

46. The substrate processing method according to claim 45, wherein

in the case the exposure processing is performed by liquid immersion exposure, an inspection condition of the inspection processing includes at least one of shortening of a wavelength of the illumination light, selection of a bright field out of bright and dark fields, selection of an electron beam detection method out of an optical detection method and the electron beam detection method, selection of a confocal system, and selection of an image comparison algorithm out of the image comparison algorithm, a design data comparison algorithm and a feature extraction algorithm as a detection algorithm.

47. The substrate processing method according to claim 40, wherein

the adjustment process includes

a computation process of computing correlativity between information on a monitoring result of a liquid immersion portion during the liquid immersion exposure and information on an inspection result of the inspection processing;

and

an optimization process of optimizing at least one of an exposure condition in the exposure processing and an inspection condition in the inspection processing, based on the computed correlativity.

48. The substrate processing method according to claim 47, wherein

in the optimization process, at least one of inspection frequency and inspection sensitivity of a portion having the high correlativity on the substrate is increased.

49. The substrate processing method according to claim 47, wherein

in the computation process, correlativity between information on a period of time when each point on the substrate is immersed in liquid and information on an inspection result of the inspection processing is further computed, and in the optimization process, at least one of an exposure route on the substrate, a film formation condition to the substrate, a liquid removal condition on the substrate after liquid immersion exposure is adjusted based on the correlativity.

50. The substrate processing method according to claim 40, wherein

in the adjustment process, information on a permissible range of a correction amount used to correct an exposure dose and focus that are set is switched.

51. The substrate processing method according to claim 40, wherein

in the adjustment process, in the case the exposure processing is performed by the liquid immersion exposure, an inspection processing of a topcoat film that protects a resist film coated on the substrate from liquid is added to an inspection content.

52. The substrate processing method according to claim 40, further comprising:

a storage process of storing information on a inspection result of the inspection processing, and

a computation process of computing information on occurrence frequency of abnormality at each point within the substrate based on the stored information, wherein

in the adjustment process, inspection frequency at each point within the substrate is increased or decreased based on the computed information on occurrence frequency.

53. A substrate processing apparatus that performs a substrate processing according to transmitted information using the substrate processing method according to claim 40.

54. An exposure apparatus that performs exposure to a substrate according to transmitted information using the substrate processing method according to claim 40.

55. A measurement and/or inspection apparatus that performs measurement and/or inspection of a substrate according to transmitted information using the substrate processing method according to claim 40.

56. A program that makes a computer execute a plurality of substrate processings that include an exposure processing of forming a pattern on a substrate by exposing the substrate and an inspection processing of inspecting the substrate afterward, the program making the computer execute:

an acquisition procedure of acquiring information as to whether the exposure processing is performed by liquid immersion exposure or dry exposure;

an adjustment procedure of adjusting of a processing content of at least part of the plurality of substrate processings in accordance with the acquired information; and

a transmission procedure of transmitting the adjustment result to an apparatus that performs a relevant processing.

57. The program according to claim 56, wherein

in the adjustment procedure, at least one of an inspection item, inspection sensitivity, an inspection condition of the inspection processing is switched depending on liquid immersion exposure or dry exposure.

58. The program according to claim 57, wherein

in the case the exposure processing is performed by liquid immersion exposure, the inspection sensitivity of the inspection processing is set slightly higher than that of dry exposure.

59. The program according to claim 57, wherein

the inspection condition of the inspection processing includes at least one of a wavelength of illumination light that illuminates the substrate during the inspection, a detection method, a detection optical system, and a detection algorithm.

60. The program according to claim 59, wherein

in the case the exposure processing is performed by liquid immersion exposure, an inspection condition of the inspection processing includes at least one of shortening of a wavelength of the illumination light, selection of a bright field out of bright and dark fields, selection of an electron beam detection method out of an optical detection method and the electron beam detection method, selection of a confocal system, and selection of an image comparison algorithm out of the image comparison algorithm, a design data comparison algorithm and a feature extraction algorithm as a detection algorithm.

61. The program according to claim 56, wherein

in the case the exposure processing is performed by liquid immersion exposure, at least one of a defect inspection with respect to a pattern defect peculiar to liquid immersion exposure, an abnormality inspection of abnormality of the substrate due to liquid used in liquid immersion exposure and a remaining liquid inspection of remaining liquid that adheres on the substrate after liquid immersion exposure is added as an inspection item of the inspection processing.

62. The program according to claim 61, wherein

the pattern defect peculiar to liquid immersion exposure includes a stain adhering to an optical element of a projection optical system that comes into contact with the liquid, or a pattern defect due to a bubble or a foreign substance in the liquid,

the abnormality inspection of abnormality of the substrate due to the liquid includes an inspection related to a watermark, a stain due to infiltrating of a material of a film formed on the substrate into the liquid and peeling of a film on the substrate, and

the remaining liquid inspection includes a foreign substance inspection of a foreign substance in remaining liquid on the substrate.

63. The program according to claim 56, wherein

the adjustment procedure includes

a computation procedure of computing correlativity between information on a monitoring result of a liquid immersion portion during the liquid immersion exposure and information on an inspection result of the inspection processing;

and

an optimization procedure of optimizing at least one of an exposure condition in the exposure processing and an inspection condition in the inspection processing based on the computed correlativity.

64. The program according to claim 63, wherein

in the optimization procedure, at least one of inspection frequency and inspection sensitivity of a portion having the high correlation on the substrate is increased.

65. The program according to claim 63, wherein

in the computation procedure, correlativity between information on a period of time when each point on the substrate is immersed in liquid and information on an inspection result of the inspection processing is further computed, and

in the optimization procedure, at least one of an exposure route on the substrate, a film formation condition to the substrate, a liquid removal condition on the substrate after liquid immersion exposure is adjusted.

66. The program according to claim 56, wherein

in the adjustment procedure, information on a permissible range of a correction amount used to correct an exposure dose and focus that are set is switched.

67. The program according to claim 56, wherein

in the adjustment procedure, in the case the exposure processing is performed by the liquid immersion exposure, an inspection processing of a topcoat film that protects a resist film coated on the substrate from liquid is added to an inspection content.

68. The program according to claim 56, further making the computer execute:

a storage procedure of storing information on a inspection result of the inspection processing, and

a computation procedure of computing information on occurrence frequency of abnormality at each point within the substrate based on the stored information, wherein

in the adjustment procedure, inspection frequency at each point within the substrate is increased or decreased based on the computed information on occurrence frequency.

69. A computer-readable information recording medium in which the program according to claim 56 is recorded.

70. A program that makes a computer system execute a processing process of a specific processing in which the specific processing that is unnecessary for a substrate that is subject to a dry exposure processing of irradiating exposure light on the substrate without liquid is executed to a substrate that is subject to a liquid immersion exposure processing of exposing the substrate with exposure light via liquid, the program making the computer system execute:

a procedure of changing whether or not to execute the specific processing in the processing process to a substrate based on information that shows whether the substrate is subject to the liquid immersion exposure processing or the dry exposure processing.

71. The program according to claim 70, wherein

the specific processing is an inspection processing of a substrate subject to the liquid immersion exposure processing or a measurement processing related to a substrate subject to the liquid immersion exposure processing.

72. The program according to claim 71, wherein

the inspection processing includes an inspection of a water repellent film that is formed on the substrate.

73. The program according to claim 71, wherein

the inspection processing includes an inspection in which liquid that remains on the substrate is detected after a processing of removing liquid on the substrate.

74. The program according to claim 70, wherein

the specific processing includes a film formation processing of forming a water repellent film on a substrate subject to the liquid immersion exposure processing.

75. A computer-readable information recording medium in which a program that makes a computer system execute a processing process of a specific processing in which the specific processing that is unnecessary for a substrate that is subject to a dry exposure processing of irradiating exposure light to the substrate without liquid is executed to a substrate that is subject to a liquid immersion exposure processing of exposing the substrate with exposure light via liquid is recorded, wherein

the program is a program that makes the computer system execute a procedure of changing whether or not to execute the specific processing in the processing process to a substrate based on information that shows whether the substrate is subject to the liquid immersion exposure processing or the dry exposure processing.

76. The information recording medium according to claim 75, wherein

the specific processing is an inspection processing of a substrate subject to the liquid immersion exposure processing or a measurement processing related to a substrate subject to the liquid immersion exposure processing.

77. The information recording medium according to claim 76, wherein

the inspection processing includes an inspection of a water repellent film that is formed on the substrate.

78. The information recording medium according to claim 76, wherein

the inspection processing includes an inspection in which liquid that remains on the substrate is detected after a processing of removing liquid on the substrate.

79. The information recording medium according to claim 75, wherein

the specific processing includes a film formation processing of forming a water repellent film on a substrate subject to the liquid immersion exposure processing.

80. A measurement and/or inspection system that implements at least one of a measurement processing and an inspection processing to a substrate that is subject to one of a liquid immersion exposure processing of exposing the substrate with exposure light via liquid and a dry exposure processing of irradiating exposure light on the substrate without liquid, the system comprising:

a specific measurement and/or inspection section that executes a specific measurement and/or inspection processing that is unnecessary for a substrate that is subject to the dry exposure processing to a substrate that is subject to the liquid immersion exposure processing, wherein

whether or not the specific measurement and/or inspection section executes the specific measurement and/or inspection processing is changed, in accordance with information that shows whether a substrate is subject to the liquid immersion exposure processing or the dry exposure processing.

81. The measurement and/or inspection system according to claim 80, wherein

the measurement and/or inspection processing includes an inspection of a water repellent film that is formed on the substrate.

82. The measurement and/or inspection system according to claim 80, wherein

the measurement and/or inspection processing includes an inspection in which liquid that remains on the substrate is detected after a processing of removing liquid on the substrate.

83. A processing apparatus that executes a specific processing that is unnecessary for a substrate that is subject to a dry exposure processing of irradiating exposure light to the substrate without liquid to a substrate that is subject to a liquid immersion exposure processing of exposing the substrate with exposure light via liquid, wherein

whether or not to execute the specific processing to a substrate is changed in accordance with information that shows whether the substrate is subject to the liquid immersion exposure processing or the dry exposure processing.

84. The processing apparatus according to claim 83, wherein

the specific processing is an inspection processing of a substrate subject to the liquid immersion exposure processing or a measurement processing related to a substrate subject to the liquid immersion exposure processing.

85. The processing apparatus according to claim 84, wherein

the inspection processing includes an inspection of a water repellent film that is formed on the substrate.

86. The processing apparatus according to claim 84, wherein

the inspection processing includes an inspection in which liquid that remains on the substrate is detected after a processing of removing liquid on the substrate.

87. The processing apparatus according to claim 83, wherein

the specific processing includes a film formation processing of forming a water repellent film on a substrate subject to the liquid immersion exposure processing.

88. A computer system that controls a processing process of a specific processing in which the specific processing that is unnecessary for a substrate that is subject to a dry exposure processing of irradiating exposure light to the substrate without liquid is executed to a substrate that is subject to a liquid immersion exposure processing of exposing the substrate with exposure light via liquid, wherein

whether or not to execute the specific processing in the processing process to a substrate is changed in accordance with information that shows whether the substrate is subject to the liquid immersion exposure processing or the dry exposure processing.

89. The computer system according to claim 88, wherein

the specific processing is an inspection processing of a substrate subject to the liquid immersion exposure processing or a measurement processing related to a substrate subject to the liquid immersion exposure processing.

90. The computer system according to claim 89, wherein

the inspection processing includes an inspection of a water repellent film that is formed on the substrate.

91. The computer system according to claim 89, wherein

the inspection processing includes an inspection in which liquid that remains on the substrate is detected after a processing of removing liquid on the substrate.

92. The computer system according to claim 88, wherein

the specific processing includes a film formation processing of forming a water repellent film on a substrate subject to the liquid immersion exposure processing.