MULTI-LAYER CIRCUIT BOARD HAVING GROUND SHIELDING WALLS

• US 20070221405A1
• Filed: 01/05/2007
• Published: 09/27/2007
• Est. Priority Date: 03/22/2006
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Cheng, Hung-Hsiang
• Granted Patent: US 7,851,709 B2
• Time in Patent Office: Days
• US Class Current: 174/265
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0221 Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate
• CPC Class Codes: H05K 2201/09236 Parallel layout
• CPC Class Codes: H05K 2201/09981 Metallised walls
• CPC Class Codes: H05K 3/107 by filling grooves in the support with conductive material H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

A circuit board includes a plurality of signal lines and a plurality of shielding walls. The shield walls are disposed between the signal lines. Each shield wall includes an upper surface, a lower surface, a rectangular groove, a first metal layer and a second metal layer. The lower surface is opposite to the upper surface. The rectangular groove extends from the upper surface to the lower surface. The first metal layer is disposed on the upper surface. The second metal layer is disposed in the rectangular groove and electrically connected to the first metal layer.

Claims

1. A circuit board, comprising:

a plurality of signal lines; and

a plurality of shielding walls disposed between the signal lines, wherein each shielding wall comprises;

an upper surface;

a lower surface opposite to the upper surface;

a groove extending from the upper surface toward the lower surface;

a first metal layer disposed on the upper surface; and

a second metal layer disposed inside the groove and electrically connecting to the first metal layer.

2. The circuit board of claim 1, wherein the groove is a through groove which extends from the upper surface toward the lower surface.

3. The circuit board of claim 2, wherein the shielding wall further comprises a third metal layer disposed on the lower surface, wherein the second metal layer electrically connects the first metal layer to the third metal layer.

4. The circuit board of claim 3, wherein the shielding wall further comprises a plurality of conductive contacts disposed on the third metal layer.

5. The circuit board of claim 2, wherein the depth of the groove is approximately equivalent to the height of the shielding wall.

6. The circuit board of claim 1, wherein the groove is a non-through groove.

7. The circuit board of claim 6, wherein the depth of the groove is smaller than the height of the shielding wall.

8. The circuit board of claim 1, wherein the shielding wall further comprises a middle metal layer disposed between the upper surface and the lower surface, wherein the second metal layer electrically connects the first metal layer to the middle metal layer.

9. The circuit board of claim 8, wherein the first metal layer is a ground shielding layer or a power shielding layer.

10. The circuit board of claim 9, wherein the first metal layer is the ground-shield-typed ground line and the middle metal layer is a ground layer.

11. The circuit board of claim 9, wherein the first metal layer is the ground-shield-typed power line and the middle metal layer is a power layer.

12. The circuit board of claim 1, wherein the depth of the groove is approximately equivalent to the length of the shielding wall.

13. The circuit board of claim 1, wherein the width of the groove is smaller than the width of the shielding wall.

14. The circuit board of claim 1, wherein the groove is formed by laser cutting.

15. The circuit board of claim 1, wherein the groove is formed by mechanical process.