Light Emitting Diode Lamp

• US 20070221934A1
• Filed: 04/20/2005
• Published: 09/27/2007
• Est. Priority Date: 05/27/2004
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Inoue, Tomio
• Granted Patent: US 7,772,597 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil

Abstract

The present invention relates to an LED lamp including a pair of lead terminals 2 and 3, a cup portion 8 formed at an end of one of the lead terminals by denting the end and having a conical inner peripheral surface serving as a light-reflective surface 9, an LED chip 4, a transparent synthetic resin member 6 covering the ends of the paired lead terminals 2 and 3. The LED chip 4 includes an upper surface provided with an n-electrode 4d or a p-electrode 4e and a lower surface provided with a p-electrode 4e or an n-electrode 4d. An n-type semiconductor layer 4a and a p-type semiconductor layer 4b are provided between the n-electrode 4d and the p-electrode 4e and laminated to each other via a light emitting layer 4c interposed therebetween. The side surface of the LED chip 4 except for the n-electrode 4d and the p-electrode 4e is coated with light-transmitting synthetic resin 10 containing powder of a fluorescent material. The LED chip 4 is die-bonded to an inner bottom surface of the cup portion 8 with the n-electrode 4d or the p-electrode 4e oriented downward whereas the p-electrode 4e or the n-electrode 4d oriented upward.

Claims

1. A light emitting diode lamp comprising:

a pair of lead terminals;

a cup portion formed at an end of one of the lead terminals and including a dented inner peripheral surface flaring outward to serve as a light-reflective surface;

an LED chip; and

a transparent synthetic resin member for covering ends of the lead terminals or for filling the cup portion to cover the LED chip;

wherein the LED chip includes an upper surface provided with an n-electrode or a p-electrode and a lower surface provided with a p-electrode or an n-electrode, the LED chip also including an n-type semiconductor layer and a p-type semiconductor layer both provided between the n-electrode and the p-electrode and laminated to each other via a light emitting layer interposed therebetween, the LED chip further including a side surface covered by a light-transmitting synthetic resin coating containing powder of a fluorescent material, the resin coating being arranged not to cover the n-electrode and the p-electrode, the LED chip being arranged in the cup portion with the n-electrode or p-electrode oriented downward and the p-electrode or n-electrode oriented upward, the LED chip being die-bonded so that the downward n- or p-electrode is electrically connected to an inner bottom surface of the cup portion.

3. The light emitting diode lamp according to claim 1, wherein the cup portion is in a form of a rectangle elongated horizontally in plan view, and wherein the transparent synthetic resin member is in a form of a plate and covers the lead terminals so that the lead terminals are partially exposed at a surface of the transparent synthetic resin member to serve as a connection terminal.

5. The light emitting diode lamp according to claim 1, wherein the downward p- or n-electrode of the LED chip is covered by a light-transmitting synthetic resin coating containing powder of a fluorescent material.

2. A light emitting diode lamp comprising:

an insulating member;

a dented cup portion formed at the insulating member and having an inner peripheral surface flaring outward;

a light reflective electrode film formed inside of the cup portion;

an LED chip; and

a transparent synthetic resin member filling the cup portion to cover the LED chip;

wherein the LED chip includes an upper surface provided with an n-electrode or a p-electrode and a lower surface provided with a p-electrode or an n-electrode, the LED chip also including an n-type semiconductor layer and a p-type semiconductor layer both provided between the n-electrode and the p-electrode and laminated to each other via a light emitting layer interposed therebetween, the LED chip further including a side surface covered by a light-transmitting synthetic resin coating containing powder of a fluorescent material, the resin coating being arranged not to cover the n-electrode and the p-electrode, the LED chip being arranged in the cup portion with the n-electrode or p-electrode oriented downward and the p-electrode or n-electrode oriented upward, the LED chip being die-bonded so that the downward n- or p-electrode is electrically connected to the electrode film at an inner bottom surface of the cup portion.

4. The light emitting diode lamp according to claim 2, wherein the insulating member is in a form of a plate, and wherein the cup portion is in a form of a rectangle elongated horizontally in plan view.