Electronic Circuit Device

• US 20070222046A1
• Filed: 11/08/2005
• Published: 09/27/2007
• Est. Priority Date: 11/10/2004
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Tokunaga, Shigetomi
• Granted Patent: US 7,595,998 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/1034 Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/366 substantially perpendicularly to each other H05K3/361 takes precedence

Abstract

An electronic circuit device includes a sub-board disposed upright on a main board. The sub-board is electrically coupled to the main board via a board terminal) disposed at sub-board edge. A semiconductor element is mounted on the sub-board facing the sub-board in parallel. A temperature sensor is also mounted on the sub-board. A heat sink is formed so as to surround the sub-board and the semiconductor element. A resin material is injected inside a heat sink so as to cover the sub-board, the temperature sensor, and the semiconductor element.

Claims

1. An electronic circuit device comprising:

a sub-board electrically coupled to a main board via a board terminal disposed at a sub-board edge, and disposed upright on the main board;

a semiconductor element mounted on the sub-board, the semiconductor element facing the sub-board in parallel;

a temperature sensor mounted on the sub-board;

a heat sink formed so as to surround the sub-board and the semiconductor element; and

a resin material injected inside the heat sink so as to cover the sub-board, the temperature sensor, and the semiconductor element.

2. The electronic circuit device as defined in claim 1, wherein the temperature sensor is mounted on the sub-board at the same side of the semiconductor element.

3. The electronic circuit device as defined in claim 1, wherein the resin material is a potting material.

4. The electronic circuit device as defined in claim 1, wherein the resin material has high heat conductance.