Encapsulated Electrical Component and Production Method

• US 20070222056A1
• Filed: 04/21/2005
• Published: 09/27/2007
• Est. Priority Date: 04/22/2004
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Epcos AG (TDK Corporation)
• Inventors: Stelzl, Alois, Krueger, Hans, Bauer, Christian
• Granted Patent: US 7,544,540 B2
• Time in Patent Office: Days
• US Class Current: 257/687
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 21/44 Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H03H 3/0072 of microelectro-mechanical resonators or networks micromembranes or microbeams B81B2203/01; manufacture of microstructural devices in general B81C
• CPC Class Codes: H03H 9/1057 for microelectro-mechanical devices

Abstract

A micro-electro-mechanical systems (MEMS) component includes a panel, a chip having an underside containing active component structures, where the chip is mounted on the panel via bumps, a frame structure on the panel and enclosing an installation site of the chip, and a jet-printed structure closing a seam between frame structure and chip. The jet-printed structure has an upper edge that is above a lower edge of the chip.

Claims

1-30. -30. (canceled)

31. A micro-electro-mechanical systems (MEMS) component, comprising:

a panel;

a chip having containing active component structures, the chip having a back side and the chip being mounted on the panel via bumps;

a frame structure on the panel and enclosing an installation site of the chip; and

a jet-printed structure closing a seam between the frame structure and chip, the jet-printed structure having an upper edge that is above a lower edge of the chip.

33. The component of claim 31 or 32, wherein surfaces that come into contact with the jet-printed structure are non-wetting.

34. The component of claim 31 or 32, wherein frame structure comprises metal.

35. The component of claim 31 or 32, further comprising:

a cover layer over the chip, the jet-printed structure, and at least part of the frame structure.

36. The component of claim 35, wherein the cover layer comprises a metal layer that hermetically seals the component.

37. The component of claim 35, wherein the cover layer comprises a laminate film or a globtop covering.

38. The component of claim 35, further comprising:

a second jet-printed structure comprising a polymer layer that extends over at least part of the back side of the chip that does not contain active component structures;

wherein areas of the back side of the chip that are not covered by the second jet-printed structure directly contact the cover layer.

39. The component of claim 35, further comprising:

a second jet-printed structure comprising a polymer layer that extends over at least part of the back side of chip that does not contain active component structures such that lateral edges of the chip are not covered by the second jet-printed structure and directly contact the cover layer.

40. The component of claim 31, wherein the frame structure comprises a step that declines toward the chip.

41. The component of claim 31 or 32, wherein at least one part of the frame structure is below the chip.

42. The component of claim 35, further comprising:

a polymer strip between the panel and the cover layer, the polymer strip following an edge of the chip in a peripheral area of the component, outside an area enclosed by the frame structure, wherein the cover layer comprises a metal layer and seals the panel inside the surface area bounded by the polymer strip.

32. A micro-electro-mechanical systems (MEMS) component, comprising:

a panel;

a chip containing active component structures, the chip having a back side and the chip being mounted on the panel via bumps;

a frame structure on the panel and enclosing an installation site of the chip, the frame structure having at least one downwards step toward the installation site; and

a jet-printed structure closing a seam between frame structure and chip.

43. A method of manufacturing a micro-electro-mechanical systems (MEMS) component, the method comprising:

producing a plurality of frame structures on a panel, each of the plurality of frame structures for enclosing a chip installation site;

connecting, via bumps, a plurality of chips to the panel at installation sites, at least one of the plurality of chips having a back side containing active components; and

using a jet-printing process to apply a jet-printed structure that substantially closes a gap between the frame structure and the plurality of chips;

wherein a fluid and curable resin, a melted polymer, or a dispersion containing nanoparticles is used to produce the jet-printed structure.

45. The method of claim 43 or 44, further comprising:

separating the MEMs component from other MEMs components by cutting the panel.

46. The method according to claim 43, wherein the melted polymer comprises a UV-curing polymer.

47. The method of claim 43 or 44, further comprising:

before applying the jet-printed structure, modifying surface energy of surfaces coming into contact with the jet-printed structure such that the jet-printed structure does not wet the surfaces coming into contact with the jet-printed structure.

48. The method of claim 47, further comprising:

applying, to the surfaces coming into contact with the jet-printed structure, a film comprising a non-wetting surface, the film having a thickness of one or a more molecules.

49. The method of claim 48, further comprising

treating the surfaces coming into contact with the jet-printed structure with a plasma containing fluorine.

50. The method of claim 48, further comprising:

treating the surfaces coming into contact with the jet-printed structure with an organosilicon solution.

51. The method of claim 43 or 44, further comprising:

after connecting the plurality of chips and applying the jet-printed structure, applying a base metallization to the panel by sputtering, CVD, PECVD, vapor deposition, or a thin-film process; and

reinforcing the base metallization by depositing a metal layer using solution.

52. The method of claim 43 or 44, wherein the jet-printing process is performed under exposure to UV.

53. The method of claim 43 or 44, further comprising:

applying a cast frame to the panel, the cast frame being applied under UV exposure during the jet-printing process; and

producing a cover layer on the component by applying a polymer inside the cast frame without simultaneous UV exposure, wherein the polymer flows inside the cast frame and is thereafter cured.

54. The method of claim 43 or 44, further comprising:

applying a base metallization to the panel;

covering the base metallization with a polymer mask such than an annularly closed strip of the base metallization remains uncovered

reinforcing the base metallization in an area of the annular strip by metal deposition from a solution to thereby produce a metallic frame structure; and

removing the polymer mask prior to connecting a plurality of chips to the panel.

55. The method of claim 54, wherein the metallic frame structure has a height that is at least half a height of the bumps.

56. The method of claim 43 or 44, further comprising:

before connecting the plurality of chips, producing a frame structure on the panel, the frame structure comprising ceramic or metal and having a spacing away from a lower edge of at least one of the plurality of chips; and

sealing the frame structure via the jet-printing process after connecting the plurality of chips.

57. The method of claim 43 or 44, further comprising:

applying, to the panel, a base metallization comprising an adhesion layer comprising titanium and a copper layer; and

enhancing a thickness of the base metallization via non-current deposition using copper and nickel.

58. The method of claim 57, further comprising:

applying a lamination film before applying the base metallization; and

removing the lamination film in a strip-shaped area around at least one of the plurality of chips.

59. The method of claim 43 or 44, further comprising:

producing a polymer layer on a back side of at least one of the plurality of chips; and

depositing a metal layer over the polymer layer, the metal layer comprising a hermetic cover layer.

60. The method of claim 43 or 44, wherein polymer structures having a height between 20 μ

m and 30 μ

m height are produced in a single pass of the jet-printing process.

44. A method of manufacturing a micro-electro-mechanical systems (MEMS) component, the method comprising:

producing a plurality of frame structures on a panel, each of the plurality of frame structures for enclosing a chip installation site;

connecting, via bumps, a plurality of chips to the panel at the installation site, at least one of the plurality of chips having a back side containing active components; and

using a jet-printing process to apply a jet-printed structure that substantially closes a gap between the frame structure and the plurality of chips;

wherein a fluid and curable resin is printed as a dispersion containing nanoparticles to produce the jet-printed structure.