Camera Module, Method of Manufacturing the Same, and Printed Circuit Board for the Camera Module

• US 20070223913A1
• Filed: 03/23/2007
• Published: 09/27/2007
• Est. Priority Date: 03/23/2006
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Lee, Ju Hyun
• Granted Patent: US 7,665,915 B2
• Time in Patent Office: Days
• US Class Current: 396/529
• CPC Class Codes: G03B 17/00 Details of cameras or camera bodies; Accessories therefor lens hoods or caps G03B11/04
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H05K 2201/0919 Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes shielding provided by an inner layer of PCB H05K2201/0723
• CPC Class Codes: H05K 2201/0949 Pad close to a hole, not surrounding the hole if used for surface mounting H05K1/114
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/242 characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

A camera module, including a printed circuit board, an image sensor chip, and a housing, is provided. A plating line can be formed in an inner layer of the printed circuit board. A method of manufacturing the camera module can include connecting the plating line of the inner layer of the printed circuit board to a pattern of an outer layer using a via hole, performing a plating process, and forming an image sensor, the housing, and a lens part on the printed circuit board.

Claims

1. A camera module comprising:

a printed circuit board comprising at least one plating line at an inner surface;

an image sensor mounted to the printed circuit board;

a housing fixed to the printed circuit board; and

a lens part coupled to the housing.

2. The camera module according to claim 1, wherein a selected plating line of the at least one plating line is connected to an electrode terminal of an outer layer of the printed circuit board.

3. The camera module according to claim 2, wherein the printed circuit board comprises an interlayer connection portion connected to the selected plating line of the inner surface and the electrode terminal of the outer layer.

4. The camera module according to claim 3, wherein the interlayer connection portion is formed of a via or a via hole.

5. The camera module according to claim 3, wherein an end portion of the interlayer connection portion is connected to the electrode terminal formed in the printed circuit board or a pattern connected to the electrode terminal.

6. The camera module according to claim 3, wherein the interlayer connection portion is formed in whole layers or some layers of the printed circuit board.

7. The camera module according to claim 3, wherein the selected plating line of the printed circuit board is connected to the electrode terminal through at least one via hole and at least one pattern.

8. The camera module according to claim 1, wherein the printed circuit board is formed of a multi-layer printed circuit board, and the at least one plating line is formed in at least one inner layer of the printed circuit board.

9. The camera module according to claim 1, wherein the lens part comprises a lens barrel including at least one lens and at least one filter.

10. A printed circuit board for a camera module, the printed circuit board comprising:

a line pattern formed in at least one outer layer;

at least one plating line formed in at least one inner layer; and

at least one via hole connected to a pattern for plating among the plating line and the line pattern.

11. The printed circuit board according to claim 10, wherein the at least one via hole is formed in whole layers or some layers of the printed circuit board.

12. The printed circuit board according to claim 10, wherein the plating line is bonded to a bonding sheet provided in the inner layer of the printed circuit board.

13. A method of manufacturing a camera module, the method comprising:

forming a printed circuit board comprising at least one plating line formed in an inner surface and a line pattern formed in a top layer;

connecting a selected plating line of the at least one plating line to the line pattern using an interlayer connection portion;

forming a pattern protective layer on a region of the line pattern of the top layer except for a plating pattern;

connecting an electrode to the selected plating line so as to form a plating layer on a surface of the plating pattern;

mounting an image sensor on the printed circuit board; and

fixing a housing comprising a lens to the printed circuit board.

14. The method according to claim 13, wherein the printed circuit board comprises at least two substrates bonded to a bonding sheet, the substrates including the line pattern formed on at least one surface thereon.

15. The method according to claim 13, wherein the interlayer connection portion comprises at least one via hole and/or at least one via.

16. The method according to claim 13, wherein the at least one plating line is formed in at least one inner layer of the printed circuit board.

17. The method according to claim 13, wherein the plating layer is formed by an electroplating process.

18. The method according to claim 13, wherein the mounting of the image sensor comprises:

bonding the image sensor to the top layer of the printed circuit board; and

connecting an electrode pad of the image sensor to a plating pattern of the plating layer using a wire.

19. The method according to claim 13, wherein the plating layer is formed of an alloy of Au, Sn, Ag, and SnPb, or an alloy of Ni and AuNi.