Integrated liquid to air conduction module

• US 20070227708A1
• Filed: 03/30/2007
• Published: 10/04/2007
• Est. Priority Date: 03/30/2006
• Status: Active Grant

• Current Assignee: Vertiv Corporation (Vertiv Holdings Co.)
• Original Assignee: Cooligy Incorporated (Emerson Electric Company)
• Inventors: Munch, Mark, Zhou, Peng, Werner, Douglas E., Tsao, Paul, Conway, Bruce, Hom, James, Upadhya, Girish, Brewer, Richard
• Granted Patent: US 8,157,001 B2
• Time in Patent Office: Days
• US Class Current: 165/121
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20281 Thermal management, e.g. liquid flow control

Abstract

An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.

Claims

1. An integrated cooling system comprising:

a. a first cooling structure for circulating a first cooling medium; and

b. a second cooling structure stacked on the first structure for circulating a second cooling medium different from the first cooling medium.

2. The system of claim 1 further comprising a fluid path and a high surface area to volume ratio structure in the fluid path wherein the first medium is a fluid and the fluid path is in the first cooling structure.

3. The system of claim 2 further comprising a double-counter flow structure in the fluid path.

4. The system of claim 3 further comprising a pump connected to the fluid path thereby forming a close fluid path.

5. The system of claim 4 wherein the first cooling medium is a liquid and the second cooling medium is air.

6. An integrated cooling system comprising:

a. a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path adjacent to the contact area;

b. a second layer coupled to the first layer and having a plurality of air fins for passing air therethrough; and

c. a pump connected to the fluid path.

7. The system of claim 6, wherein the second layer seals to the first layer to define an inner surface of the fluid path.

8. The system of claim 7, wherein the fluid path has a contact area with the second layer which is greater than the contact area of the first layer with the heat source.

9. The system of claim 6, wherein the first layer and the second layer both have a thermal conductivity of 15 W/(mK) or greater.

10. The system of claim 6, wherein the first layer has a plurality of fluid fins for controlling the flow of a fluid within the fluid path and wherein the fluid fins are substantially evenly spaced over the area adjacent to the heat source.

11. The system of claim 6, wherein the fluid fins have a thermal conductivity of 15 W/(mK) or greater.

12. The system of claim 6, further comprising a heat source coupled to the first layer.

13. The system of claim 12, wherein the heat source comprises one or more electronic devices.

14. The system of claim 13, wherein the fluid path comprises a double-counter flow structure adjacent to at least one or more electronic devices.

15. The system of claim 6, further comprising a programmable controller.

16. The system of claim 15, further comprising a means for detecting a temperature and communicating the temperature to the programmable controller.

17. The system of claim 16, wherein the programmable controller is programmed to adjust a flow rate of the fluid in response to the temperature.

18. The system of claim 15, wherein the programmable controller is programmed to adjust an air-mover speed in response to the temperature.

19. The system of claim 13, wherein the flow path is optimized to maximize cooling of each electronic device.

20. The system of claim 13, wherein the flow path is optimized to minimize the temperature of each electronic device.

21. The system of claim 13, wherein the flow path is optimized to maximize the cooling of a selected one of the electronic devices.

22. The system of claim 6, further comprising a fluid reservoir connected to the pump.

23. The system of claim 6, wherein the second layer is configured with at least one airflow channel.

24. The system of claim 23, further comprising at least one air-mover coupled to the at least one airflow channel.

25. The system of claim 6, wherein the air fins are configured to control the airflow path and a rate of the airflow within the airflow channel.

26. The system of claim 6, wherein the air fins have a shape that is folded, pin, hexagonal shaped, airfoil shaped, ruffled, herringbone, lanced, and louvered, or any combination thereof.

27. An integrated cooling system comprising:

a. a first layer having a first side for coupling to a heat source adjacent to a contact area,

 

wherein the first layer has a first port and a second port coupled to a fluid path adjacent to the contact area,

 

the fluid path has a heat-transfer area adjacent to the second layer which is greater than the contact area,

 

the fluid path is configured to provide a double-counter flow structure adjacent to at least one electronic device, and

 

the first layer has a conductivity constant of fifteen W/(mK) or greater;

b. a plurality of fluid fins in the first layer flow path substantially evenly spaced over the contact area, and wherein the fins have a thermal conductivity constant of fifteen W/(mK) or greater;

c. a second layer sealed to the first layer, thereby defining a fluid path with an inlet and an outlet suitable for pumping the fluid, wherein the second layer is configured with at least one air channel;

d. a plurality of pin fins and folded fins coupled to a side opposing the first layer, wherein the air fins are within at least one of the air channels;

e. an air-mover coupled to at least one of the air channels;

f. a heat source comprising at least one electronic device;

g. a pump coupled to the fluid flow path, wherein the pump inputs from the flow-path port that is the greatest flow-path distance from the greatest heat source; and

h. a programmable controller,

 

wherein the programmable controller has a means for measuring the temperature, programmed to increase the fluid flow as a function of an increased temperature, and is programmed to increase an airflow from the air-mover as a function of an increased temperature.

28. A method of manufacturing an integrated cooling system comprising the steps of:

a. providing a first layer having a fluid path adjacent to a contact area for coupling to a heat source;

b. providing a second layer with a plurality of air fins overlying at least a portion of the contact area; and

c. coupling a pump to the fluid path.

29. The method of claim 28, wherein an interface of the first layer and second layer has an area that is greater than the contact area.

30. The method of claim 29, wherein the first and second layer have a thermal conductivity of 15 W/(mK) or greater.

31. The method of claim 28, further comprising the step of providing a plurality of fluid fins positioned in the fluid path and adjacent to at least one heat source.

32. The method of claim 28, further comprising the step of coupling a high surface area to volume ratio structure to the flowpath.

33. The method of claim 28, further comprising coupling one or more electronic devices to the contact area.

34. The method of claim 33, wherein the fluid path further comprises a double-counter flow structure adjacent to at least one electronic device.

35. The method of claim 34, further comprising coupling a programmable pump controller to the pump and the air-mover wherein the programmable controller provides a means for measuring a temperature, controlling a pump flow rate, and controlling an air-mover airflow wherein the increase in the fluid flow rate as a function of the temperature and the air flow is increased as a function of the temperature.

36. The method of claim 35, wherein the flow path is optimized to maximize cooling of each electronic device.

37. The system of claim 35, wherein the flow path is optimized to minimize the temperature of each electronic device.

38. The system of claim 35, wherein the flow path is optimized to maximize the cooling of a selected one of the electronic devices.

39. The method of claim 35, further comprising coupling a reservoir to the pump.