H01L 21/67288 :
Monitoring of warpage, curv...
H01L 22/20 :
Sequence of activities cons...
H01L 2224/11 :
Manufacturing methods
H01L 2224/1134 :
Stud bumping, i.e. using a ...
H01L 2224/12 :
Structure, shape, material ...
H01L 2224/13099 :
Material
H01L 2224/16 :
of an individual bump conne...
H01L 2224/16145 :
the bodies being stacked
H01L 2224/32225 :
the item being non-metallic...
H01L 2224/45 :
of an individual wire conne...
H01L 2224/45015 :
being circular
H01L 2224/45124 :
Aluminium (Al) as principal...
H01L 2224/45144 :
Gold (Au) as principal cons...
H01L 2224/45147 :
Copper (Cu) as principal co...
H01L 2224/4554 :
Coating
H01L 2224/48 :
of an individual wire conne...
H01L 2224/48091 :
Arched
H01L 2224/48227 :
connecting the wire to a bo...
H01L 2224/48599 :
Principal constituent of th...
H01L 2224/49 :
of a plurality of wire conn...
H01L 2224/49109 :
outside the semiconductor o...
H01L 2224/72 :
Detachable connecting means...
H01L 2224/73203 :
Bump and layer connectors
H01L 2224/73251 :
on different surfaces
H01L 2224/73265 :
Layer and wire connectors
H01L 2224/78 :
Apparatus for connecting wi...
H01L 2224/78301 :
Capillary
H01L 2224/81801 :
Soldering or alloying
H01L 2224/81901 :
Pressing the bump connector...
H01L 2224/85 :
using a wire connector
H01L 2224/85043 :
using a flame torch, e.g. h...
H01L 2224/85045 :
using a corona discharge, e...
H01L 2224/851 :
the connector being supplie...
H01L 2224/85201 :
Compression bonding
H01L 2224/85203 :
Thermocompression bonding
H01L 2224/85205 :
Ultrasonic bonding
H01L 2224/8592 :
Applying permanent coating,...
H01L 2225/0651 :
Wire or wire-like electrica...
H01L 2225/06527 :
Special adaptation of elect...
H01L 2225/06555 :
Geometry of the stack, e.g....
H01L 2225/06572 :
Auxiliary carrier between d...
H01L 23/49811 :
Additional leads joined to ...
H01L 24/72 :
Detachable connecting means...
H01L 24/81 :
using a bump connector
H01L 25/0652 :
the devices being arranged ...
H01L 25/16 :
the devices being of types ...
H01L 2924/00 :
Indexing scheme for arrange...
H01L 2924/00012 :
Relevant to the scope of th...
H01L 2924/00013 :
Fully indexed content
H01L 2924/00014 :
the subject-matter covered ...
H01L 2924/00015 :
the subject-matter covered ...
H01L 2924/01004 :
Beryllium [Be]
H01L 2924/01005 :
Boron [B]
H01L 2924/01006 :
Carbon [C]
H01L 2924/01011 :
Sodium [Na]
H01L 2924/01012 :
Magnesium [Mg]
H01L 2924/01013 :
Aluminum [Al]
H01L 2924/01014 :
Silicon [Si]
H01L 2924/01015 :
Phosphorus [P]
H01L 2924/01018 :
Argon [Ar]
H01L 2924/01019 :
Potassium [K]
H01L 2924/01022 :
Titanium [Ti]
H01L 2924/01023 :
Vanadium [V]
H01L 2924/01024 :
Chromium [Cr]
H01L 2924/01025 :
Manganese [Mn]
H01L 2924/01027 :
Cobalt [Co]
H01L 2924/01028 :
Nickel [Ni]
H01L 2924/01029 :
Copper [Cu]
H01L 2924/0103 :
Zinc [Zn]
H01L 2924/01031 :
Gallium [Ga]
H01L 2924/01033 :
Arsenic [As]
H01L 2924/01039 :
Yttrium [Y]
H01L 2924/01042 :
Molybdenum [Mo]
H01L 2924/01044 :
Ruthenium [Ru]
H01L 2924/01045 :
Rhodium [Rh]
H01L 2924/01046 :
Palladium [Pd]
H01L 2924/01047 :
Silver [Ag]
H01L 2924/01048 :
Cadmium [Cd]
H01L 2924/01049 :
Indium [In]
H01L 2924/0105 :
Tin [Sn]
H01L 2924/01051 :
Antimony [Sb]
H01L 2924/01074 :
Tungsten [W]
H01L 2924/01075 :
Rhenium [Re]
H01L 2924/01076 :
Osmium [Os]
H01L 2924/01077 :
Iridium [Ir]
H01L 2924/01078 :
Platinum [Pt]
H01L 2924/01079 :
Gold [Au]
H01L 2924/01082 :
Lead [Pb]
H01L 2924/01083 :
Bismuth [Bi]
H01L 2924/01204 :
4N purity grades, i.e. 99.99%
H01L 2924/013 :
Alloys
H01L 2924/01322 :
Eutectic Alloys, i.e. obtai...
H01L 2924/014 :
Solder alloys
H01L 2924/07802 :
not being an ohmic electric...
H01L 2924/10253 :
Silicon [Si]
H01L 2924/10329 :
Gallium arsenide [GaAs]
H01L 2924/12041 :
LED
H01L 2924/12044 :
OLED
H01L 2924/14 :
Integrated circuits
H01L 2924/15153 :
the die mounting substrate ...
H01L 2924/15165 :
Monolayer substrate
H01L 2924/15312 :
being a pin array, e.g. PGA
H01L 2924/1532 :
the connection portion bein...
H01L 2924/16195 :
Flat cap [not enclosing an ...
H01L 2924/181 :
Encapsulation
H01L 2924/19041 :
being a capacitor
H01L 2924/19043 :
being a resistor
H01L 2924/2075 :
larger or equal to 1 micron...
H01L 2924/20751 :
larger or equal to 10 micro...
H01L 2924/20752 :
larger or equal to 20 micro...
H01L 2924/20753 :
larger or equal to 30 micro...
H01L 2924/20754 :
larger or equal to 40 micro...
H01L 2924/20755 :
larger or equal to 50 micro...
H01L 2924/30105 :
Capacitance
H01L 2924/30107 :
Inductance
H01L 2924/3011 :
Impedance
H01L 2924/3025 :
Electromagnetic shielding
H01R 12/52 :
connecting to other rigid p...
H05K 1/141 :
One or more single auxiliar...
H05K 2201/0397 :
Tab forming integral conduc...
H05K 2201/068 :
wherein the coefficient of ...
H05K 2201/1031 :
Surface mounted metallic co...
H05K 2201/10318 :
Surface mounted metallic pins
H05K 2201/10378 :
Interposers
H05K 2201/10719 :
Land grid array [LGA]
H05K 2201/10734 :
Ball grid array [BGA]; Bump...
H05K 2201/10757 :
Bent leads
H05K 2201/10878 :
Means for retention of a le...
H05K 2201/10909 :
Materials of terminal, e.g....
H05K 2201/10946 :
Leads attached onto leadles...
H05K 3/20 :
by affixing prefabricated c...
H05K 3/308 :
Adaptations of leads connec...
H05K 3/326 :
the printed circuit having ...
H05K 3/3421 :
Leaded components
H05K 3/3426 :
characterised by the leads
H05K 3/368 :
parallel to each other H05K...
H05K 3/4015 :
using auxiliary conductive ...
H05K 3/4092 :
Integral conductive tabs, i...
H05K 7/1069 :
with spring contact pieces
Y02P 70/50 :
Manufacturing or production...
Y10T 29/49149 :
by metal fusion bonding