Light emitting device

• US 20070228391A1
• Filed: 03/26/2007
• Published: 10/04/2007
• Est. Priority Date: 03/29/2006
• Status: Abandoned Application

• Current Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Ishida, Makoto, Minami, Yukimura
• Application Number:
  US11/727,398
• Publication Number:
  US 20070228391A1
• Time in Patent Office: Days
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device has an LED (light emitting diode) element, and a power feeding member through which electrical power is fed to the LED element, the power feeding member comprising an electrically conductive material. The power feeding member has a light reflecting layer formed on the surface of the power feeding member, the light reflecting layer being formed of a metal, and a protecting layer formed on the surface of the light reflecting layer, the protecting layer being formed of an organic compound.

Claims

1. A light emitting device, comprising:

an LED (light emitting diode) element; and

a power feeding member through which electrical power is fed to the LED element, the power feeding member comprising an electrically conductive material,

wherein the power feeding member comprises a light reflecting layer formed on a surface of the power feeding member, the light reflecting layer comprising a metal, and a protecting layer formed on a surface of the light reflecting layer, the protecting layer comprising an organic compound.

2. The light emitting device according to claim 1, wherein:

the LED (light emitting diode) element comprises a group III nitride-based compound semiconductor.

3. The light emitting device according to claim 1, wherein:

the LED (light emitting diode) element comprises a group III nitride-based compound semiconductor, and

the organic compound comprises at least one of triazole, imidazole, triazine, thiazole, mercaptan, thiocyanic acid, benzole, silicate, titanate, amine, carbonyl, and tetrazole.

4. The light emitting device according to claim 1, further comprising:

a silicone-based resin material sealing the power feeding member.

5. The light emitting device according to claim 1, wherein:

the light reflecting layer comprises at least one of silver, gold, copper, palladium, aluminum, rhodium, chromium, nickel and tin.

6. The light emitting device according to claim 1, further comprising:

a silicone-based resin material sealing the power feeding member,

wherein the light reflecting layer comprises at least one of silver, gold, copper, palladium, aluminum, rhodium, chromium, nickel and tin.

7. The light emitting device according to claim 1, wherein:

the organic compound comprises at least one of benzotriazole compound, triazole compound, thiocyanic acid based compound, silane compound, titanium compound, triazine compound, benzoimidazole compound, imidazole compound, compound containing mercaptocarboxylic acid and/or salts thereof, thiazole compound, benzothiazole compound, thionalide, oxazole compound, thiol compound, tetrazole compound, alkylaminotriazoles compound, higher alkylamine compound, ethyleneoxide adduct of higher alkylamine compound, α

-dicarbonyl compound, amine adduct of α

-dicarbonyl, β

-dicarbonyl compound, and amine adduct of β

-dicarbonyl.

8. The light emitting device according to claim 1, wherein:

the organic compound comprises at least one of benzotriazole compound, triazole compound, thiocyanic acid based compound, silane compound, titanium compound, triazine compound, benzoimidazole compound, imidazole compound, compound containing mercaptocarboxylic acid and/or salts thereof, thiazole compound, benzothiazole compound, thionalide, oxazole compound, and thiol compound.

9. The light emitting device according to claim 4, wherein:

the silicone-based resin material comprises a phosphor that allows the device to emit a white light.

10. The light emitting device according to claim 6, wherein:

the silicone-based resin material comprises a phosphor that allows the device to emit a white light.