Socket, a circuit component having the socket and an information processing system having the circuit component

• US 20070229103A1
• Filed: 07/20/2006
• Published: 10/04/2007
• Est. Priority Date: 03/31/2006
• Status: Abandoned Application

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Tani, Michitaka
• Application Number:
  US11/489,632
• Publication Number:
  US 20070229103A1
• Time in Patent Office: Days
• US Class Current: 324/754.80
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A socket for mounting an IC device having an opening formed in the socket body is disclosed. At least a probe in electrical contact with the IC device is partly exposed to the opening and cooled by cooling air passing through the opening.

Claims

1. A socket for mounting a circuit component, comprising:

a body in which an opening is formed;

a probe arranged on the body and in electrical contact with the circuit component, the probe is positioned as to be partly exposed to the opening.

2. A socket according to claim 1, wherein said opening is formed through the body.

3. A socket according to claim 1, wherein said opening is supplied with a liquid.

4. A socket for mounting a circuit component, comprising:

a body having a component mounting surface to mount the circuit component;

a probe arranged on the body and electrical contact with the circuit component; and

a heat conductive member arranged on a surface of the socket other than the component mounting surface and in contact with the probe.

5. A socket according to claim 4, wherein said heat conductive member has a electrical conductivity.

6. A socket according to claim 5, wherein said heat conductive member is in contact with the probe connected to a power terminal and/or a ground terminal of the circuit component.

7. A socket for mounting circuit component, comprising:

a body having a component mounting surface to mount the circuit component;

a probe arranged on the body and in electrical contact with the circuit component;

an opening formed in the body in the direction crossing the probe; and

a through hole formed in the body to connect the opening to the component mounting surface.

8. A socket according to claim 7, wherein a meshed member is arranged on said through hole.

9. A socket for mounting a circuit component, comprising:

a body having a component mounting surface to mount the circuit component;

a probe arranged on the body and in electrical contact with the circuit component; and

a groove formed on the component mounting surface facing the circuit component.

10. A socket according to claim 9, wherein a plurality of probes are arranged on said body;

and

said groove is formed between adjacent ones of the probes.

11. A socket according to claim 9, further comprising:

an opening formed in the body in the direction crossing the probes; and

a through hole formed in said body to connect the opening to the component mounting surface;

wherein,

one end of the groove is formed to direct to the through hole.

12. A socket according to claim 11, wherein,

a plurality of through holes are formed in said body, and

at least two of the through holes are formed at both sides of the circuit component, and the grooves are formed in such a manner as to connect the through holes in longitudinal direction.

13. A socket for mounting a circuit component, comprising:

a body having a component mounting surface to mount the circuit component;

a probe arranged on the body and in electrical contact with the circuit component; and

a plurality of slits formed on the side surfaces of the body.

14. A socket according to claim 13, wherein the body has an opening formed in the direction crossing the probe.

15. A circuit component comprising:

a socket including a body having a mounting surface to mount the circuit element, a probe in electrical contact with the circuit element and an opening formed in the body in the direction crossing the probe; and

the circuit element mounted on the mounting surface and connected to the probe.

16. A circuit component comprising:

a socket including a body having a mounting surface to mount a circuit element, a probe in electrical contact with the circuit element and a heat conductive member arranged on the other surface of the socket body opposite to the mounting surface and in contact with the probe; and

the circuit element mounted on the mounting surface and connected to the probe.

17. A circuit component comprising:

a socket including a body having a mounting surface to mount a circuit element, a probe in electrical contact with the circuit element, an opening formed in the socket body in the direction crossing the probe and a through hole formed in the socket body to connect the opening to the mounting surface; and

the circuit element mounted on the mounting surface and connected to the probe.

18. An information processing system comprising:

a circuit board;

a socket mounted onto said circuit board, and having a mounting surface;

a circuit element mounted onto said mounting surface;

a probe in electrical contact with the circuit element mounted on said mounting surface;

and an opening formed in the socket body in a direction crossing the probe.

19. An information processing system comprising:

a circuit board;

a socket mounted onto said circuit board having a mounting surface;

a circuit element mounted onto said mounting surface;

a probe in electrical contact with the circuit element mounted onto said mounting surface; and

a heat conductive member arranged on the surface of the socket body opposite to the mounting surface and in contact with the probe.

20. An information processing system comprising:

a circuit board;

a socket mounted onto said circuit board having a mounting surface;

a circuit element mounted onto said mounting surface;

a probe in electrical contact with the circuit element mounted on said mounting surface;

an opening formed in the socket body in a direction crossing the probe; and

a through hole formed in the socket body connecting the opening and the mounting surface.