HIGH SPEED SIGNAL TRANSMISSION STRUCTURE

• US 20070229184A1
• Filed: 11/17/2006
• Published: 10/04/2007
• Est. Priority Date: 03/31/2006
• Status: Active Grant

• Current Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: LIN, YU-HSU, LIU, NING, MENG, YUN-QIANG
• Granted Patent: US 7,515,015 B2
• Time in Patent Office: Days
• US Class Current: 333/100
• CPC Class Codes: H01P 3/08 Microstrips; Strip lines
• CPC Class Codes: H05K 1/025 Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H01L23/66
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths

Abstract

A signal transmission structure includes a driving circuit block, a receiving circuit block, a main transmission line, and a copper patch. The main transmission line connects the driving circuit block to the receiving circuit block for transmitting signals therebetween. The copper patch is arranged at the main transmission line, and has a rectangular shape. The copper patch can reduce switching rates when the signal state of the driving circuit changes rapidly. The copper patch serves as a compensation capacitor, to reduce a rate of switching of the signal, and to reduce or even eliminate the problems of crosstalk and overshooting and undershooting of signals. It is of advantage that the copper patch is simple to manufacture and very suitable for mass production.

Claims

1. A signal transmission structure comprising:

a driving circuit block;

a receiving circuit block;

a main transmission line connecting the driving circuit block to the receiving circuit block for transmitting signals therebetween; and

a copper patch with a rectangular shape located at the main transmission line serving as a capacitor, for reducing switching rates of the signals.

2. The signal transmission structure as claimed in claim 1, wherein the driving circuit block comprises a driving circuit and a first branch transmission line, and the first branch transmission line transmits the signals from the driving circuit to the main transmission line.

3. The signal transmission structure as claimed in claim 2, wherein the receiving circuit block comprises a receiving circuit and a second branch transmission line, and the second branch transmission line transmits signals between the main transmission line and the receiving circuit.

4. The signal transmission structure as claimed in claim 1, wherein the copper patch is manufactured by patching copper onto a printed circuit board (PCB), and a width of the copper patch is greater than that of the main transmission line.

5. The signal transmission structure as claimed in claim 4, wherein corners of the copper patch are cut away to obtain a smooth transition from the main transmission line to the copper patch.

6. The signal transmission structure as claimed in claim 1, wherein a capacitance of the copper patch and an area of the copper patch are directly proportional to each other.

7. The signal transmission structure as claimed in claim 6, wherein when the capacitance of the copper patch is 20 pF, the area of the copper patch is at least 60 mm².

8. A printed circuit board (PCB) comprising:

a driving circuit block, the driving circuit block comprising a driving circuit and a first branch transmission line coupled to the driving circuit;

at least one receiving circuit block comprising a receiving circuit and a second branch transmission line coupled to the receiving circuit;

a main transmission line coupling the first branch transmission line and the second branch transmission line, the main transmission line comprising an enlarged section having a rectangular shape, and a width of the enlarged section being greater than that of the other section of the main transmission line.

9. The PCB as claimed in claim 8, wherein the copper patch and the main transmission line are etched on the PCB using a metal-etching process.

10. The PCB as claimed in claim 8, wherein a capacitance of the copper patch and an area of the copper patch are directly proportional to each other.

11. The PCB as claimed in claim 10, wherein when the capacitance of the copper patch is 20 pF, the area of the copper patch is at least 60 mm2.