Radio frequency identification tag and method of forming the same

• US 20070229284A1
• Filed: 03/15/2007
• Published: 10/04/2007
• Est. Priority Date: 03/17/2006
• Status: Abandoned Application

• Current Assignee: Xterprise Incorporated (SML Group Limited)
• Original Assignee: Xterprise Incorporated (SML Group Limited)
• Inventors: Svalesen, Richard Keith, Frew, Dean L.
• Application Number:
  US11/724,587
• Publication Number:
  US 20070229284A1
• Time in Patent Office: Days
• US Class Current: 340/572.800
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit

Abstract

A radio frequency identification (RFID) tag and method of forming the same are presented. In one embodiment, the RFID tag includes an integrated circuit located in a carrier and an adhesive coupled to the carrier. The RFID tag also includes a strain relief member coupled to the adhesive on a surface opposite the carrier and an encapsulant surrounding the carrier, the adhesive and the strain relief member.

Claims

1. A radio frequency identification (RFID) tag, comprising:

an integrated circuit located in a carrier;

an adhesive coupled to said carrier;

a strain relief member coupled to said adhesive on a surface opposite said carrier; and

an encapsulant surrounding said carrier, said adhesive and said strain relief member.

2. The RFID tag as recited in claim 1 wherein said adhesive and said strain relief member cover a surface area of said carrier.

3. The RFID tag as recited in claim 1 further comprising an antenna coupled to said carrier and surrounded by said encapsulant.

4. The RFID tag as recited in claim 1 further comprising an antenna coupled to said carrier and surrounded by said encapsulant, said adhesive and said strain relief member covering a surface area of said carrier and said antenna.

5. The RFID tag as recited in claim 1 wherein said RFID tag is affixed to a host material including a metal surface.

6. The RFID tag as recited in claim 1 wherein said strain relief member is configured to provide strain relief for said integrated circuit when said RFID tag is subject to mechanical stress.

7. The RFID tag as recited in claim 1 wherein said strain relief member is formed from a temperature resistive material.

8. A method of forming a radio frequency identification (RFID) tag, comprising:

providing an integrated circuit in a carrier;

coupling an adhesive to said carrier;

coupling a strain relief member to said adhesive on a surface opposite said carrier; and

surrounding said carrier, said adhesive and said strain relief member with an encapsulant.

9. The method as recited in claim 8 wherein said adhesive and said strain relief member cover a surface area of said carrier.

10. The method as recited in claim 8 further comprising coupling an antenna to said carrier and surrounding said antenna with said encapsulant.

11. The method as recited in claim 8 further comprising coupling an antenna to said carrier and surrounding said antenna with said encapsulant, said adhesive and said strain relief member covering a surface area of said carrier and said antenna.

12. The method as recited in claim 8 further comprising affixing said RFID tag to a host material including a metal surface.

13. The method as recited in claim 8 wherein said strain relief member is configured to provide strain relief for said integrated circuit when said RFID tag is subject to mechanical stress.

14. The method as recited in claim 8 wherein said strain relief member is formed from a temperature resistive material.

15. A radio frequency identification (RFID) system, comprising:

an RFID reader; and

an RFID tag, including;

an integrated circuit located in a carrier;

an adhesive coupled to said carrier;

a strain relief member coupled to said adhesive on a surface opposite said carrier; and

an encapsulant surrounding said carrier, said adhesive and said strain relief member.

16. The RFID system as recited in claim 15 wherein said adhesive and said strain relief member cover a surface area of said carrier.

17. The RFID system as recited in claim 15 wherein said RFID tag further includes an antenna coupled to said carrier and surrounded by said encapsulant.

18. The RFID system as recited in claim 15 wherein said RFID tag further includes an antenna coupled to said carrier and surrounded by said encapsulant, said adhesive and said strain relief member covering a surface area of said carrier and said antenna.

19. The RFID system as recited in claim 15 wherein said strain relief member is configured to provide strain relief for said integrated circuit when said RFID tag is subject to mechanical stress.

20. The RFID system as recited in claim 15 wherein said strain relief member is formed from a temperature resistive material.