Modified inverted-F antenna for wireless communication
First Claim
Patent Images
1. An apparatus comprising:
- a dielectric substrate having a first surface;
a radiating stub on the first surface of the dielectric substrate; and
a first ground plate on the first surface of the dielectric substrate to couple to ground, the first ground plate including one or more grounded capacitive stubs spaced apart from the radiating stub, the one or more grounded capacitive stubs to tune performance parameters.
2 Assignments
0 Petitions
Accused Products
Abstract
An embodiment of the present invention is a modified inverted-F antenna for wireless communication. The antenna circuit includes a dielectric substrate having a first surface, a radiating stub on the first surface of the dielectric substrate, and a first ground plate on the first surface of the dielectric substrate to couple to ground. The first ground plate includes one or more grounded capacitive stubs spaced apart from the radiating stub. The one or more grounded capacitive stubs tune performance parameters for the antenna circuit.
72 Citations
30 Claims
-
1. An apparatus comprising:
-
a dielectric substrate having a first surface; a radiating stub on the first surface of the dielectric substrate; and a first ground plate on the first surface of the dielectric substrate to couple to ground, the first ground plate including one or more grounded capacitive stubs spaced apart from the radiating stub, the one or more grounded capacitive stubs to tune performance parameters. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 28, 29)
-
-
16. A method comprising:
-
forming a dielectric layer on a first metal layer having a first surface; forming a pattern of a second metal layer on the dielectric layer to expose a dielectric window being part of the dielectric layer, the pattern having a radiating stub and one or more grounded capacitive stubs spaced apart from the radiating stub; and forming a first ground plate coupled to the one or more grounded capacitive stubs, the first ground plate being part of the second metal layer and coupled to ground. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25)
-
-
26. A system comprising:
-
a base-band processor to process base-band signals, the base-band processor generating a transmitting signal and processing a receiving signal; a transceiver coupled to the base-band processor to process the transmitting signal and the receiving signal; a switch coupled to the transceiver to switch between the transmitting signal and the receiving signal; and an antenna circuit coupled to the switch to transmit the transmitting signal and to receive the receiving signal, the antenna circuit comprising; a dielectric substrate having a first surface, a radiating stub on the first surface of the dielectric substrate, and a first ground plate on the surface of the dielectric substrate to couple to ground, the first ground plate including one or more grounded capacitive stubs spaced apart from the radiating stub, the one or more grounded capacitive stubs to tune performance parameters. - View Dependent Claims (27, 30)
-
Specification