Flexible floating electronic components
First Claim
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1. An apparatus comprising:
- an electronic device housing having a bottom inner surface, top inner surface, and attached inner side surfaces; and
a layer of gel in contact with at least one of the electronic device surfaces of the electronic device housing for floating an electronic component within said electronic device housing.
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Abstract
A method and apparatus for absorbing shocks and stresses associated with the movement of electrical components housed in electronic devices and especially in mobile electronic devices, and more particularly the use of gel as a means for floating electrical components within an electronic device housing, wherein portions of the gel are capable of electrically connecting critical electronic components within the fixed set of parameters thereby absorbing shocks and reducing stresses and allowing for flexible electrical interconnections to be established along isolated conductive gel pathways.
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Citations
20 Claims
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1. An apparatus comprising:
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an electronic device housing having a bottom inner surface, top inner surface, and attached inner side surfaces; and a layer of gel in contact with at least one of the electronic device surfaces of the electronic device housing for floating an electronic component within said electronic device housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An apparatus comprising:
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a laptop computer comprising a housing having a bottom inner surface, top inner surface, and attached inner side surfaces; a layer of gel in contact with at least one of the housing surfaces; a plurality of electronic components floatably maintained by said gel within the housing so as not to contact said inner surfaces of said housing; an isolated conductive pathway formed on at least one inner surface of the housing; and an electrically conductive gel for electrically interconnecting said plurality of electronic components deposited within the bounds of said isolated conductive pathway, thereby electrically interconnecting said electronic components. - View Dependent Claims (11)
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12. A method comprising the steps of:
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forming an electronic device housing having a bottom inner surface, top inner surface, and attached inner side surfaces; and depositing a layer of gel in contact with at least one of the electronic device surfaces of the electronic device housing for floating an electronic component within said electronic device housing. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification