INTEGRATED CIRCUIT COOLANT MICROCHANNEL WITH COMPLIANT COVER

• US 20070230116A1
• Filed: 06/11/2007
• Published: 10/04/2007
• Est. Priority Date: 03/01/2005
• Status: Abandoned Application

• Current Assignee: Alan Myers, Chia-Pin Chiu, Gregory Chrysler, Ioan Sauciuc, Je-Young Chang, Patrick Boyd, Ravi Prasher
• Original Assignee: Alan Myers, Chia-Pin Chiu, Gregory Chrysler, Ioan Sauciuc, Je-Young Chang, Patrick Boyd, Ravi Prasher
• Inventors: Prasher, Ravi, Sauciuc, Ioan, Myers, Alan, Chang, Je-Young, Chiu, Chia-pin, Chrysler, Gregory, Boyd, Patrick
• Application Number:
  US11/761,167
• Publication Number:
  US 20070230116A1
• Time in Patent Office: Days
• US Class Current: 361/689
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.

Claims

1. An apparatus comprising:

a microchannel structure having microchannels formed therein, said microchannels to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant; and

a cover positioned on the microchannel structure to define a respective upper wall of each of said microchannels, said cover presenting a compliant surface to said microchannels.

6. The apparatus of claim 1, wherein said cover includes a flexible pad secured to said cover.

7. The apparatus of claim 6, wherein said flexible pad is formed of rubber.

31. The apparatus of claim 6, wherein the cover includes a recess in which the flexible pad is located.

32. The apparatus of claim 6, wherein the pad is formed of polydimethylsiloxane elastomer.

2-5. -5. (canceled)

8-22. -22. (canceled)

23. An apparatus comprising:

an integrated circuit (IC); and

a microchannel assembly thermally coupled to the IC and having microchannels formed therein, each microchannel defined by a respective plurality of walls, at least one of said walls which defines said each microchannel being formed of a compliant material.

25. The apparatus of claim 23, wherein a respective upper wall of each of the microchannels is formed by a rubber pad.

33. The apparatus of claim 25, wherein the rubber pad is located in a recess in a cover.

24. (canceled)

26. A system comprising:

a microprocessor integrated circuit die;

a microchannel structure thermally coupled to the microprocessor integrated circuit die, the microchannel structure having microchannels formed therein, said microchannels to transport a coolant;

a cover positioned on the microchannel structure to define a respective upper wall of each of said microchannels, said cover presenting a compliant surface to said microchannels; and

a chipset in communication with the microprocessor integrated circuit die.

28. The system of claim 26, wherein said cover includes a rubber pad secured to a lower surface of said cover.

34. The system of claim 28, wherein the cover includes a recess in which the rubber pad is located.

27. (canceled)

29-30. -30. (canceled)