Fluid cooled electronic assembly
First Claim
1. An electronic assembly having thermal cooling fluid comprising:
- a housing generally defining a sealed fluid compartment;
an electronic device disposed within the housing;
an inlet port in fluid communication with the sealed fluid compartment for receiving a cooling fluid;
an outlet port in fluid communication with the sealed fluid compartment for passing the cooling fluid out of the housing; and
fluid flow channels formed in thermal communication with the electronic device within the housing, said fluid flow channels allowing fluid to flow from the inlet port into fluid communication with the electronic device to cool the electronic device and out the outlet port.
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Accused Products
Abstract
An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.
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Citations
21 Claims
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1. An electronic assembly having thermal cooling fluid comprising:
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a housing generally defining a sealed fluid compartment;
an electronic device disposed within the housing;
an inlet port in fluid communication with the sealed fluid compartment for receiving a cooling fluid;
an outlet port in fluid communication with the sealed fluid compartment for passing the cooling fluid out of the housing; and
fluid flow channels formed in thermal communication with the electronic device within the housing, said fluid flow channels allowing fluid to flow from the inlet port into fluid communication with the electronic device to cool the electronic device and out the outlet port. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An electronic assembly having thermal cooling liquid comprising:
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a housing generally defining a sealed compartment;
an electronic device disposed within the housing;
a cooling liquid adapted to pass through the compartment in thermal communication with the electronic device to cool the electronic device;
an inlet port in fluid communication with the sealed fluid compartment for receiving the cooling liquid;
an outlet port in fluid communication with the sealed fluid compartment for passing the cooling liquid out of the housing; and
fluid flow channels formed in at least one surface of the electronic device within the housing, said fluid flow channels allowing the cooling liquid to flow from the inlet port into fluid communication with the electronic device to cool the electronic device and out the outlet port. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification