System and method for interconnecting node boards and switch boards in a computer system chassis

• US 20070230148A1
• Filed: 03/31/2006
• Published: 10/04/2007
• Est. Priority Date: 03/31/2006
• Status: Abandoned Application

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Campini, Edoardo, Formisano, David, Mantion, Eric M.
• Application Number:
  US11/395,919
• Publication Number:
  US 20070230148A1
• Time in Patent Office: Days
• US Class Current: 361/788
• CPC Class Codes: G06F 13/409 Mechanical coupling back panels H05K7/1438

Abstract

An interconnect system may be used to interconnect node boards and one or more switch boards coupled to a common backplane in a computer system shelf or chassis. The interconnect system may interconnect the node boards and switch board(s) using external signal paths external to the backplane. In one embodiment, the signal paths may be connected to a rear transition module (RTM) that provides conversion between electrical node board signals and optical switch board signals. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Claims

1. A system comprising:

a chassis including a backplane having a first side and a second side, said backplane including a plurality of node slots and at least one switch slot on said first side, wherein said node slots include respective slot connectors configured to be connected to mating connectors on node boards, wherein conductors extend from said slot connectors through said backplane to said second side of said backplane;

at least one rear transition module (RTM) configured to be located on said second side of said backplane opposite said at least one switch slot, wherein said RTM includes an RTM connector configured to be connected to at least one switch board in said at least one switch slot; and

external signal paths configured to be coupled between said conductors associated with said node slots and said RTM, said external signal paths being located external to said backplane.

2. The system of claim 1 wherein said at least one RTM is configured to provide conversion between node board signals received and transmitted on said signal paths and switch board signals received by and transmitted to said at least one switch board, and wherein said second switch board signals have a higher bandwidth than said node board signals.

3. The system of claim 1 wherein said at least one RTM is configured to provide conversion between electrical node board signals received and transmitted on said signal paths and optical switch board signals received by and transmitted to said at least one switch board, and wherein said RTM connector includes an optical connector configured to mate with an optical connector on said at least one switch board.

4. The system of claim 1 wherein said external signal paths are configured to provide at least eight data channels associated with each of said node slots, each of said data channels including eight differential signal pairs.

5. The system of claim 1 wherein said external signal paths are included in a plurality of flexible film circuits configured to be coupled to respective node slots.

6. The system of claim 5 wherein said flexible film circuits include connectors coupled to at least one end.

7. The system of claim 5 wherein said conductors at each of said node slots are configured to provide at least eight channels, and wherein each of said flexible film circuits provides signal paths for said at least eight channels.

8. The system of claim 1 wherein said chassis is an Advanced Telecommunications Computing Architecture (ATCA) chassis.

9. The system of claim 8 wherein said external signal paths are configured to be coupled to fabric interface pins and base interface pins.

10. The system of claim 1 wherein said backplane includes fourteen node slots and two switch slots.

11. A system comprising:

a chassis including a backplane having a first side and a second side, said backplane including a plurality of node slots and at least one switch slot on said first side, wherein said at least one switch slot includes at least one switch slot connector, wherein said node slots include respective node slot connectors, wherein conductors extend from said node slot connectors through said backplane to said second side of said backplane;

a plurality of node boards configured to be located in said node slots, wherein said node boards include node board connectors configured to be connected to said node slot connectors on said backplane;

at least one switch board configured to be located in said at least one switch slot, said switch board including at least first and second switch board connectors, wherein said first switch board connector is configured to be connected to said at least one switch slot connector on said backplane; and

an interconnect system configured to couple said at least one switch board to said node boards, wherein said interconnect system is configured to be connected to said conductors at said second side of said backplane and connected to said second switch board connector on said switch board, and said interconnect system being located external to said backplane.

12. The system of claim 11 wherein said interconnect system includes:

at least one rear transition module (RTM) located in at least one RTM slot on said second side of said backplane opposite said at least one switch board and coupled to said switch board; and

external signal paths coupled between said conductors associated with said node slots and said RTM.

13. The system of claim 12 wherein said external signal paths are included in a plurality of flexible film circuits coupled to said conductors at respective said node slots and to said RTM.

14. The system of claim 12 wherein said at least one RTM is configured to provide conversion between electrical node board signals received and transmitted on said external signal paths and optical switch board signals received by and transmitted to said at least one switch board, and wherein said RTM includes an optical connector configured to mate with an optical connector on said at least one switch board.

15. The system of claim 11 wherein said interconnect system includes:

a plurality of interconnect modules coupled to said conductors on said second side of said backplane at respective said node slots, said interconnect modules configured to provide conversion between electrical node board signals received and transmitted on said conductors and optical switch board signals received by and transmitted to said at least one switch board; and

optical cables connected between said interconnect modules and said second switch board connector on said switch board.

16. The system of claim 11 wherein said interconnect system is configured to provide at least eight data channels between each of said node boards and said at least one switch board, each of said data channels including eight differential signal pairs.

17. The system of claim 11 wherein said chassis is an Advanced Telecommunications Computing Architecture (ATCA) chassis.

18. The system of claim 17 wherein said interconnect system is configured to be coupled to fabric interface pins and base interface pins.

19. The system of claim 11 wherein said backplane includes fourteen node slots and two switch slots.

20. A system comprising:

a cabinet comprising a plurality of chassis, at least one of said plurality of chassis being an Advanced Telecommunications Computing Architecture (ATCA) chassis;

said ATCA chassis comprising;

a backplane having a first side and a second side, said backplane including a plurality of node slots and at least one switch slot on said first side, wherein said at least one switch slot includes at least one switch slot connector, wherein said node slots include respective node slot connectors, wherein conductors extend from said node slot connectors through said backplane to said second side of said backplane;

a plurality of node boards located in said node slots, said node boards including node board connectors connected to said node slot connectors on said backplane;

at least one switch board located in said at least one switch slot, said switch board including at least first and second switch board connectors, said first switch board connector being connected to said at least one switch slot connector on said backplane;

at least one rear transition module (RTM) located on said second side of said backplane opposite said at least one switch board, wherein said RTM includes an RTM connector connected to said at least one switch board; and

external signal paths coupled between said conductors associated with said node slots and said RTM, said external signal paths being located external to said backplane.

21. The system of claim 20 wherein said at least one RTM is configured to provide conversion between electrical node board signals received and transmitted on said signal paths and optical switch board signals received by and transmitted to said at least one switch board, and wherein said RTM connector includes an optical connector configured to mate with an optical connector on said at least one switch board.

22. The system of claim 20 wherein said external signal paths are included in a plurality of flexible film circuits coupled between respective said node slots and said RTM.

23. The system of claim 20 wherein said external signal paths are configured to provide at least eight data channels between each of said node boards and said at least one switch board, each of said data channels including eight differential signal pairs.

24. A method comprising:

providing a chassis including a backplane configured to interconnect a plurality of node boards and at least one switch board, said backplane including a plurality of node slots configured to receive said node boards and at least one switch slot configured to receive said switch board, said node slots including node slot connectors configured to connect to node board connectors on said node boards and said switch slots including switch slot connectors configured to connect to switch board connectors on said switch boards, wherein a plurality of channels are associated with said node slots in said chassis, wherein a plurality of conductors associated with said channels extend from said node slot connectors through said backplane to a rear of said backplane;

connecting at least one switch board to said at least one switch board slot, said switch board including at least first and second switch board connectors, said first switch board connector being connected to at least one of said switch slot connectors on said backplane; and

coupling external signal paths between said conductors associated with said channels at said rear of said backplane and said second switch board connector of said switch board, said external signal paths being external to said backplane.

25. The method of claim 24 wherein coupling said external signal paths comprises:

coupling said signal paths to a rear transition module (RTM); and

connecting said RTM to said switch board via said second switch board connector.

26. The method of claim 25 wherein said RTM is configured to provide conversion between electrical signals received and transmitted on said signal paths and optical signals received by and transmitted to said at least one switch board, and wherein said RTM includes an optical connector configured to mate with an optical connector on said at least one switch board.

27. The method of claim 24 wherein coupling said external signal paths comprises:

connecting a plurality of flexible film circuits to respective said conductors associated with said channels;

connecting said plurality of flexible film circuits to a rear transition module (RTM); and

connecting said RTM to said switch board via said second switch board connector.

28. The method of claim 24 wherein coupling said external signal paths comprises:

connecting interconnect modules to said conductors at respective said nodes, wherein said interconnect modules are configured to provide conversion between electrical signals received and transmitted on said conductors and optical signals received by and transmitted to said at least one switch board; and

connecting optical cables between said interconnect modules and said second switch board connector of said switch board, wherein said second switch board connector includes an optical connector.

29. The method of claim 24 further comprising connecting a plurality of node boards to said node slots.

30. The method of claim 24 wherein said chassis is an Advanced Telecommunications Computing Architecture chassis.