Multilayer solder article

• US 20070231594A1
• Filed: 02/22/2006
• Published: 10/04/2007
• Est. Priority Date: 08/12/2005
• Status: Abandoned Application

• Current Assignee: Antaya Technologies Corporation (Aptiv PLC)
• Original Assignee: Antaya Technologies Corporation (Aptiv PLC)
• Inventors: Pereira, John
• Application Number:
  US11/359,876
• Publication Number:
  US 20070231594A1
• Time in Patent Office: Days
• US Class Current: 428/643
• CPC Class Codes: B23K 35/262 Sn as the principal constituent
• CPC Class Codes: B32B 15/01 all layers being exclusively metallic making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00
• CPC Class Codes: Y10T 428/12493 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
• CPC Class Codes: Y10T 428/12687 Pb- and Sn-base components: alternative to or next to each other

Abstract

A multilayer solder article includes a layer of a first non-lead solder for bonding to an electrically conductive material. A layer of a second non-lead solder can be on the layer of the first solder. The second solder can have a lower melting temperature than the first solder. The melting temperature of the second solder can be below about 310° F.

Claims

1. An electrical device comprising:

a base formed of electrically conductive material;

a layer of a first non-lead solder on the base;

a layer of a second non-lead solder on the layer of the first solder, the second solder having a composition comprising tin, indium, silver and copper, the second solder having a lower melting temperature than the first solder.

2. The electrical device of claim 1 in which the second solder has a melting temperature below about 360°

F.

3. The electrical device of claim 2 in which the second solder has a melting temperature below about 315°

F.

4. The electrical device of claim 3 in which the second solder has a melting temperature below about 310°

F.

5. The electrical device of claim 1 in which the second solder has a composition comprising at least about 50% tin, at least about 10% indium, about 1% to 10% silver and about 0.25% to 0.75% copper.

6. The electrical device of claim 5 in which the second solder comprises about 60% tin, about 35% indium, about 4.5% silver and about 0.5% copper.

7. The electrical device of claim 6 in which the second solder has a melting temperature of about 300°

F.

8. The electrical device of claim 1 in which the first solder comprises tin and silver with about 70% or greater tin.

9. The electrical device of claim 8 in which the first solder comprises about 95% tin and about 5% silver.

10. The electrical device of claim 9 in which the first solder has a melting temperature of about 465°

F.

11. The electrical device of claim 1 in which the base is made of sheet metal.

12. The electrical device of claim 11 in which the base is made of copper.

13. The electrical device of claim 12 in which the electrical device is an electrical connector.

14. A multilayer solder article comprising:

a layer of a first non-lead solder for bonding to an electrically conductive material; and

a layer of a second non-lead solder on the layer of the first solder, the second solder having a composition comprising tin, indium, silver and copper, the second solder having a lower melting temperature than the first solder and suitable for soldering to automotive glass.

15. The article of claim 14 in which the second solder has a melting temperature below about 360°

F.

16. The article of claim 15 in which the second solder has a melting temperature below about 315°

F.

17. The article of claim 16 in which the second solder has a melting temperature below about 310°

F.

18. The article of claim 14 in which the second solder has a composition comprising at least about 50% tin, at least about 10% indium, about 1% to 10% silver and about 0.25% to 0.75% copper.

19. The article of claim 18 in which the second solder comprises about 60% tin, about 35% indium, about 4.5% silver and about 0.5% copper.

20. The article of claim 19 in which the second solder has a melting temperature of about 300°

F.

21. The article of claim 14 in which the first solder comprises tin and silver with about 70% or greater tin.

22. The article of claim 21 in which the first solder comprises about 95% tin and about 0.5% silver.

23. The article of claim 22 in which the first solder has a melting temperature of about 465°

F.

24. The article of claim 14 further comprising a base substrate formed of electrically conductive material on which the layers of the first and second solders are bonded.

25. The article of claim 24 in which the base substrate is made of sheet metal.

26. The article of claim 25 in which the base substrate comprises a band of copper.

27. A method of making a multilayer solder article comprising:

providing a layer of a first non-lead solder;

bonding a layer of a second non-lead solder against the layer of the first solder by cold rolling the layers of the first and second solders together between a pair of rollers, the second solder having a composition comprising tin, indium, silver and copper, the layer of the second solder having a lower melting temperature than the layer of the first solder.

28. The method of claim 27 further comprising providing the second solder with a melting temperature below about 360°

F.

29. The method of claim 28 further comprising providing the second solder with a melting temperature below about 315°

F.

30. The method of claim 29, further comprising providing the second solder with a melting temperature below about 310°

F.

31. The method of claim 27 further comprising providing the second solder with a composition comprising at least about 50% tin, at least about 10% indium, about 1% to 10% silver and about 0.25% to 0.75% copper.

32. The method of claim 31 further comprising providing the second solder with a composition comprising about 60% tin, about 35% indium, about 4.5% silver and about 0.5% copper.

33. The method of claim 32 further comprising providing the second solder with a melting temperature of about 300°

F.

34. The method of claim 27 further comprising providing the first solder with a composition comprising tin and silver with about 70% or greater tin.

35. The method of claim 34 further comprising providing the first solder with a composition comprising about 95% tin and about 5% silver.

36. The method of claim 35 further comprising providing the first solder with a melting temperature of about 465°

F.

37. The method of claim 27 further comprising forming the layer of the first solder on a surface of a base substrate formed from a sheet of electrically conductive material.

38. The method of claim 37 further comprising forming the base substrate from sheet metal.

39. The method of claim 38 further comprising forming the base substrate from a band of copper.

40. The method of claim 39 further comprising forming the article into an electrical device.

41. The method of claim 40 further comprising forming the article into an electrical connector.

42. A method of soldering an electrical device to automotive glass comprising:

providing a layer of a first non-lead solder on the electrical device;

providing a layer of a second non-lead solder on the layer of the first solder, the second solder having a composition comprising tin, indium, silver and copper, the second solder having a lower melting temperature than the first solder;

orienting the electrical device relative to the automotive glass to position the layer of the second solder against the glass; and

applying a preselected amount of heat to the second solder for melting the layer of the second solder without substantially melting the layer of the first solder for soldering the electrical device to the automotive glass.

43. The method of claim 42 further comprising providing the second solder with a melting temperature below about 360°

F.

44. The method of claim 43 further comprising providing the second solder with a melting temperature below about 315°

F.

45. The method of claim 44 further comprising providing the second solder with a melting temperature below about 310°

F.

46. The method of claim 42 further comprising providing the second solder with a composition comprising at least about 50% tin, at least about 10% indium, about 1% to 10% silver and about 0.25% to 0.75% copper.

47. The method of claim 46 further comprising providing the second solder with a composition comprising about 60% tin, about 35% indium, about 4.5% silver and about 0.5% copper.

48. The method of claim 47 further comprising providing the second solder with a melting temperature of about 300°

F.

49. The method of claim 42 further comprising providing the first solder with a composition comprising tin and silver with about 70% or greater tin.

50. The method of claim 49 further comprising providing the first solder with a composition comprising about 95% tin and about 5% silver.

51. The method of claim 50 further comprising providing the first solder with a melting temperature of about 465°

F.

52. An electrical device comprising:

a base formed of electrically conductive material;

a layer of a first non-lead solder on the base;

a layer of a second non-lead solder on the layer of the first solder, the second solder having a lower melting temperature than the first solder, and the second solder having a solidus temperature below about 315°

F.

53. A multilayer solder article comprising:

a layer of a first non-lead solder for bonding to an electrically conductive material; and

a layer of a second non-lead solder on the layer of the first solder, the second solder having a lower melting temperature than the first solder, and the second solder having a solidus temperature below about 315°

F. and suitable for soldering to automotive glass.

54. A method of making a multilayer solder article comprising:

providing a layer of a first non-lead solder;

bonding a layer of a second non-lead solder against the layer of the first solder by cold rolling the layers of the first and second solders together between a pair of rollers, the layer of the second solder having a lower melting temperature than the layer of the first solder, and the second solder having a solidus temperature below about 315°

F.

55. A method of soldering an electrical device to automotive glass comprising:

providing a layer of a first non-lead solder on the electrical device;

providing a layer of a second non-lead solder on the layer of the first solder, the second solder having a lower melting temperature than the first solder, and the second solder having a solidus temperature below about 315°

F.;

orienting the electrical device relative to the automotive glass to position the layer of the second solder against the glass; and

applying a preselected amount of heat to the second solder for melting the layer of the second solder without substantially melting the layer of the first solder for soldering the electrical device to the automotive glass.