IMPLANTABLE MEDICAL DEVICE ASSEMBLY AND MANUFACTURING METHOD

• US 20070232119A1
• Filed: 03/30/2006
• Published: 10/04/2007
• Est. Priority Date: 03/30/2006
• Status: Active Grant

• Current Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Original Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Inventors: Angelo, Anthony, Sprain, Jason
• Granted Patent: US 7,803,014 B2
• Time in Patent Office: Days
• US Class Current: 439/357
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: Y10S 439/909 Medical use or attached to human body

Abstract

An implantable device includes a housing, a circuit board having a plurality of through holes, and a plurality of interconnect pins within the housing and oriented perpendicular to a major surface of the housing. The circuit board is connected to the interconnect pins such that the pins extend through the through holes of the circuit board.

Claims

1. An implantable device comprising:

a housing;

a circuit board having a plurality of through holes; and

a plurality of interconnect pins within the housing, each of the interconnect pins including a straight shaft oriented perpendicular to a major surface of the housing;

wherein the circuit board is attached to the interconnect pins such that the pins extend through the through holes of the circuit board.

2. The implantable device of claim 1, wherein at least one of the interconnect pins includes a feedthrough pin oriented such that an outer connection surface of the feedthrough pin lie in a parallel plane to the major surface of the housing.

3. The implantable device of claim 1, wherein the circuit board includes a rigid circuit board.

4. The implantable device of claim 1, wherein the interconnect pins are laid out in a predetermined configuration and the through holes have a matching configuration.

5. The implantable device of claim 1, wherein the circuit board is soldered to the interconnect pins.

6. The implantable device of claim 1, wherein the circuit board is welded, brazed, soldered, or epoxied to the interconnect pins.

7. An implantable device comprising:

an electronic assembly housing having two major surfaces connected by a side wall;

a plurality of feedthrough pins mounted within the electronic assembly housing, each of the plurality of feedthrough pins including a straight shaft oriented perpendicular to the two major surfaces of the electronic assembly housing and such that an outer connection surface of each feedthrough pin lies in a parallel plane to the major surface of the housing; and

a circuit board mounted within the electronic assembly housing, the circuit board including a plurality of through holes, wherein the feedthrough pins are electrically connected to the circuit board at the through holes.

8. The implantable device of claim 7, wherein the circuit board includes a rigid circuit board.

9. The implantable device of claim 7, wherein the feedthrough pins are laid out in a predetermined configuration and the through holes have a matching configuration.

10. The implantable device of claim 7, wherein the circuit board is welded, brazed, soldered, or epoxied to the interconnect pins.

11. The implantable device of claim 7, wherein the circuit board is soldered to the interconnect pins.

12. The implantable device of claim 7, wherein the feedthrough pins extend through the through holes of the circuit board.

13. The implantable device of claim 7, wherein the feedthrough pins contact a friction-fit contact on the circuit board.

14. A method comprising:

providing feedthrough pins within an implantable device housing, the feedthrough pins being oriented perpendicular to a major surface of the device housing and having an outer connection surface that lies in a parallel plane to the major surface of the housing;

placing a circuit board having a plurality of contacts over the interconnect pins; and

connecting the interconnect pins to the contacts.

15. The method of claim 14, wherein placing the circuit board includes placing a rigid circuit board.

16. The method of claim 14, including connecting the feedthrough pins to the circuit board by placing the feedthrough pins through through-holes on the circuit board, the through holes configured in the same pattern as the feedthrough pins.

17. The method of claim 14, wherein connecting includes welding.

18. The method of claim 14, wherein connecting includes brazing.

19. The method of claim 14, wherein connecting includes soldering.

20. The method of claim 14, wherein connecting includes using conductive epoxy.