Organic light-emitting display device and the preparing method of the same
First Claim
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1. A method of making an organic light emitting display device, the method comprising:
- providing a first substrate and a first frit bonded to the first substrate;
providing a second substrate and an array of organic light emitting pixels formed on the second substrate, the second substrate made of a single layer or multiple layers;
arranging the first substrate and the second substrate so as to oppose each other and interpose the array therebetween;
interposing a second frit between the first frit and the second substrate, the second frit forming a closed loop surrounding the array, the second frit is configured to melt substantially easier than the first frit upon irradiation of a laser or infrared beam thereto; and
bonding the second frit to the first frit and to the second substrate, thereby forming an integrated frit seal interposed between the first and second substrate wherein the frit seal, the first substrate and the second substrate together define an enclosed space in which the array is located.
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Abstract
An organic light-emitting display device includes a bottom substrate having a pixel region and a non-pixel region. In the pixel region, organic light-emitting pixels are formed. A top substrate is bonded to the top substrate. A sealing member is provided between the non-pixel region of the substrate and the encapsulation substrate. The sealing member includes a first frit and a second frit which melts substantially easier than the first frit upon irradiation of a laser or infrared beam thereto.
54 Citations
23 Claims
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1. A method of making an organic light emitting display device, the method comprising:
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providing a first substrate and a first frit bonded to the first substrate; providing a second substrate and an array of organic light emitting pixels formed on the second substrate, the second substrate made of a single layer or multiple layers; arranging the first substrate and the second substrate so as to oppose each other and interpose the array therebetween; interposing a second frit between the first frit and the second substrate, the second frit forming a closed loop surrounding the array, the second frit is configured to melt substantially easier than the first frit upon irradiation of a laser or infrared beam thereto; and bonding the second frit to the first frit and to the second substrate, thereby forming an integrated frit seal interposed between the first and second substrate wherein the frit seal, the first substrate and the second substrate together define an enclosed space in which the array is located. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification