METHOD AND APPARATUS FOR REDUCING CARBON MONOXIDE POISONING AT THE PERIPHERAL EDGE OF A SUBSTRATE IN A THIN FILM DEPOSITION SYSTEM
First Claim
Patent Images
1. A deposition system for forming a thin film on a substrate, comprising:
- a process chamber having a pumping system configured to evacuate said process chamber;
a substrate holder coupled to said process chamber and configured to support said substrate and heat said substrate;
a shield ring coupled to said substrate holder and configured to surround said substrate and reduce CO poisoning of said substrate;
a metal precursor vaporization system configured to vaporize a metal carbonyl precursor to form a metal carbonyl precursor vapor;
a vapor distribution system coupled to or within said process chamber and configured to introduce said metal carbonyl precursor vapor to a process space above said substrate;
a vapor delivery system having a first end coupled to an outlet of said metal precursor vaporization system and a second end coupled to an inlet of said vapor distribution system; and
a gas supply system coupled to at least one of said film precursor vaporization system or said vapor delivery system, or both, and configured to supply a CO gas to transport said metal carbonyl precursor vapor in said CO gas to said inlet of said vapor distribution system.
1 Assignment
0 Petitions
Accused Products
Abstract
A method and apparatus is described for reducing CO poisoning of a thin metal film formed on a substrate using a metal carbonyl precursor. The thin metal film is formed on the substrate resting on a substrate holder in a thin film deposition system. The substrate holder comprises a shield ring positioned on a peripheral edge of the substrate holder and configured to surround the peripheral edge of the substrate, whereby the shield ring reduces the production of CO by-products at the peripheral edge of the substrate.
409 Citations
21 Claims
-
1. A deposition system for forming a thin film on a substrate, comprising:
-
a process chamber having a pumping system configured to evacuate said process chamber;
a substrate holder coupled to said process chamber and configured to support said substrate and heat said substrate;
a shield ring coupled to said substrate holder and configured to surround said substrate and reduce CO poisoning of said substrate;
a metal precursor vaporization system configured to vaporize a metal carbonyl precursor to form a metal carbonyl precursor vapor;
a vapor distribution system coupled to or within said process chamber and configured to introduce said metal carbonyl precursor vapor to a process space above said substrate;
a vapor delivery system having a first end coupled to an outlet of said metal precursor vaporization system and a second end coupled to an inlet of said vapor distribution system; and
a gas supply system coupled to at least one of said film precursor vaporization system or said vapor delivery system, or both, and configured to supply a CO gas to transport said metal carbonyl precursor vapor in said CO gas to said inlet of said vapor distribution system. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
-
21. A method of depositing a metal layer on a substrate, the method comprising:
-
providing a substrate on a substrate holder in a process chamber of a deposition system;
providing a shield ring on said substrate holder surrounding a periphery of said substrate in order to reduce CO poisoning of said substrate;
elevating the temperature of said substrate holder to heat said substrate;
forming a process gas containing a metal carbonyl precursor vapor and a CO gas;
introducing said process gas into said process chamber; and
exposing said substrate to said process gas to deposit a metal layer on said substrate by a vapor deposition process.
-
Specification