Handle arrangement with integrated heat pipe
First Claim
1. A handle arrangement with an integrated heat pipe for use with a portable electronic device, the arrangement comprising:
- a heat pipe, the heat pipe configured with a heat receiving portion, a heat conducting portion, and a heat dissipating portion;
a handle disposed along an edge of the portable electronic device, the handle including a handle surface configured to enclose at least the heat dissipating portion, wherein the handle surface is vented to allow air flow across at least the heat dissipating portion;
at least one attachment housing for attaching the handle with the portable electronic device, the at least one attachment housing configured to enclose at least the heat conducting portion; and
at least one processing unit having a contact surface, the contact surface in thermal communication with the heat receiving portion wherein the portable electronic device is configured to enclose at least the heat receiving portion.
3 Assignments
0 Petitions
Accused Products
Abstract
Handle arrangements having an integrated heat pipe for use with a portable electronic device are presented including: a heat pipe, the heat pipe configured with a heat receiving portion, a heat conducting portion, and a heat dissipating portion; a handle disposed along an edge of the portable electronic device, the handle including a handle surface configured to enclose at least the heat dissipating portion, wherein the handle surface is vented to allow air flow across at least the heat dissipating portion; an attachment housing for attaching the handle with the portable electronic device, the attachment housing configured to enclose the heat conducting portion; and a processing unit having a contact surface, the contact surface in thermal communication with the heat receiving portion wherein the portable electronic device is configured to enclose the heat receiving portion.
21 Citations
19 Claims
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1. A handle arrangement with an integrated heat pipe for use with a portable electronic device, the arrangement comprising:
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a heat pipe, the heat pipe configured with a heat receiving portion, a heat conducting portion, and a heat dissipating portion;
a handle disposed along an edge of the portable electronic device, the handle including a handle surface configured to enclose at least the heat dissipating portion, wherein the handle surface is vented to allow air flow across at least the heat dissipating portion;
at least one attachment housing for attaching the handle with the portable electronic device, the at least one attachment housing configured to enclose at least the heat conducting portion; and
at least one processing unit having a contact surface, the contact surface in thermal communication with the heat receiving portion wherein the portable electronic device is configured to enclose at least the heat receiving portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A handle arrangement with an integrated heat pipe for use with a portable electronic device, the arrangement comprising:
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heat pipe means, the heat pipe means configured with a heat receiving portion, a heat conducting portion, and a heat dissipating portion;
handle means disposed along an edge of the portable electronic device, the handle means including a handle surface configured to enclose at least the heat dissipating portion, wherein the handle surface is vented to allow air flow across at least the heat dissipating portion;
attachment housing means for attaching the handle with the portable electronic device, the attachment housing means configured to enclose at least the heat conducting portion; and
at least one processing unit having a contact surface, the contact surface in thermal communication with the heat receiving portion wherein the portable electronic device is configured to enclose at least the heat receiving portion. - View Dependent Claims (11, 12, 13, 14)
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15. A passive cooling system integrated with an articulating handle for use with a portable computing system comprising:
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a heat pipe, the heat pipe configured with a heat receiving portion, a heat conducting portion, and a heat dissipating portion;
a heat sink configured to rotatably receive the heat receiving portion, the heat pipe in thermal contact with the heat receiving portion;
a portable computing system configured with a plurality of processing units, the plurality of processing units each having a contact surface, the contact surface in thermal communication with the heat sink wherein the portable computing system is configured to enclose at least the heat receiving portion; and
at least one attachment housing for rotatably attaching the articulating handle with the portable electronic device, the at least one attachment housing configured to enclose at least the heat conducting portion wherein the articulating handle is disposed along an edge of the portable electronic device, the articulating handle including a handle surface configured to enclose at least the heat dissipating portion, wherein the handle surface is vented to allow air flow across at least the heat dissipating portion and the portable computing system may be tilted from a planar surface by the articulating handle. - View Dependent Claims (16, 17, 18, 19)
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Specification