ELECTRONIC INLAY MODULE USED FOR ELECTRONIC CARDS AND TAGS
First Claim
Patent Images
10. An electronic card comprising:
- an electronic inlay comprising;
a circuit board, having a top surface and a bottom surface;
a plurality of circuit components attached to the top surface of the circuit board;
a bottom cover sheet attached to the bottom surface of the circuit board;
a top cover sheet positioned above the top surface of the circuit board; and
a layer of thermosetting material between the bottom cover sheet and the top cover sheet;
a top overlay attached to a top surface of the electronic inlay; and
a bottom overlay attached to a bottom surface of the electronic inlay.
1 Assignment
0 Petitions
Accused Products
Abstract
The disclosed electronic inlay and the method of making such an electronic inlay includes a circuit board, a plurality of circuit components attached to the circuit board, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The electronic inlay can be used to manufacture electronic cards while using conventional equipment to apply top and bottom overlays to the electronic inlay.
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Citations
43 Claims
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10. An electronic card comprising:
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an electronic inlay comprising; a circuit board, having a top surface and a bottom surface; a plurality of circuit components attached to the top surface of the circuit board; a bottom cover sheet attached to the bottom surface of the circuit board; a top cover sheet positioned above the top surface of the circuit board; and a layer of thermosetting material between the bottom cover sheet and the top cover sheet; a top overlay attached to a top surface of the electronic inlay; and a bottom overlay attached to a bottom surface of the electronic inlay. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method for manufacturing an electronic inlay, comprising:
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providing a circuit board having a top surface and a bottom surface; affixing a plurality of circuit components onto the top surface of the circuit board; affixing the bottom surface of the circuit board to a bottom cover sheet using a pressure sensitive adhesive tape or a spray-on adhesive; loading the circuit board and bottom cover sheet into an injection molding apparatus; loading a top cover sheet positioned above a top surface of the circuit board into the injection molding apparatus; injecting a thermosetting polymeric material between the top and bottom cover sheets; and applying a heat seal coating on the top and bottom cover sheets. - View Dependent Claims (17)
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18. A method for manufacturing an electronic card, comprising:
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providing a circuit board having a top surface and a bottom surface; affixing a plurality of circuit components onto the top surface of the circuit board; affixing the bottom surface of the circuit board to a bottom cover sheet using a pressure sensitive adhesive tape or a spray-on adhesive; loading the circuit board and bottom cover sheet into an injection molding apparatus; loading a top cover sheet positioned above a top surface of the circuit board into the injection molding apparatus; injecting a thermosetting polymeric material between the top and bottom cover sheets to form an electronic inlay; removing the electronic inlay; and providing a top overlay and a bottom overlay for attachment to the electronic inlay. - View Dependent Claims (19, 20, 21, 22)
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23. An electronic inlay, comprising:
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a circuit board, having a top surface and a bottom surface; a plurality of circuit components attached to the top surface of the circuit board; a top cover sheet positioned above the top surface of the circuit board; and a layer of thermosetting material between the circuit board and the top cover sheet. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31)
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32. An electronic card comprising:
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an electronic inlay comprising; a circuit board, having a top surface and a bottom surface; a plurality of circuit components attached to the top surface of the circuit board; a top cover sheet positioned above the top surface of the circuit board; and a layer of thermosetting material between the circuit board and the top cover sheet; a top overlay attached to a top surface of the electronic inlay; and a bottom overlay attached to the bottom surface of the circuit board. - View Dependent Claims (33, 34, 35, 36, 37)
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38. A method for manufacturing an electronic inlay, comprising:
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providing a circuit board having a top surface and a bottom surface; affixing a plurality of circuit components onto the top surface of the circuit board; loading the circuit board into an injection molding apparatus; loading a top cover sheet positioned above a top surface of the circuit board into the injection molding apparatus; injecting a thermosetting polymeric material between the top and cover sheet and the circuit board; and applying a heat seal coating on the top cover sheet and the bottom surface of the circuit board. - View Dependent Claims (39)
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40. A method for manufacturing an electronic card, comprising:
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providing a circuit board having a top surface and a bottom surface; affixing a plurality of circuit components onto the top surface of the circuit board; loading the circuit board into an injection molding apparatus; loading a top cover sheet positioned above a top surface of the circuit board into the injection molding apparatus; injecting a thermosetting polymeric material between the top cover sheet and the circuit board to make an electronic inlay; removing the electronic inlay; and providing a top overlay and a bottom overlay for attachment to the electronic inlay. - View Dependent Claims (1, 2, 3, 4, 5, 6, 7, 8, 9, 41, 42, 43)
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43-1. The method of claim 42, wherein the hot lamination process is performed at hot lamination process temperatures in a range of 250 to 320°
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Specification