Light emitting diode package having anodized insulation layer and fabrication method therefor

• US 20070235743A1
• Filed: 04/05/2007
• Published: 10/11/2007
• Est. Priority Date: 04/05/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Shin, Sang Hyun, Lee, Young Ki, Choi, Seog Moon
• Granted Patent: US 8,030,762 B2
• Time in Patent Office: Days
• US Class Current: 257/81
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

Claims

1. A light emitting diode package comprising:

an Al substrate having a reflecting region;

a light source mounted on the substrate and electrically connected to patterned electrodes of the substrate, the light source comprising a light emitting diode;

an anodized insulation layer formed between the patterned electrodes and the substrate;

a lens disposed over the light source of the substrate; and

an Al heat radiator formed under the light emitting diode so as to enhance heat radiation capacity.

2. The light emitting diode package according to claim 1, wherein the substrate has the light source disposed in the reflecting region thereof, the light emitting diode of the light source comprising blue, red and green light emitting diodes to emit white light.

3. The light emitting diode package according to claim 1, wherein the substrate has electrode connecting grooves adjacent to the reflecting region thereof, the electrode connecting grooves electrically connecting the light source to the patterned electrodes with wires.

4. The light emitting diode package according to claim 1, wherein the substrate has lens assembly grooves formed adjacent to the reflecting region thereof, the lens assembly grooves defining the location of the lens part, and wherein the lens has projections formed on outer surfaces thereof which are assembled into the lens assembly grooves.

5. The light emitting diode package according to claim 3, wherein the anodized insulation layer is formed in the electrode connecting grooves.

6. A method for fabricating a light emitting diode package comprising:

etching a surface of a substrate to form a reflecting region;

anodizing the substrate to form an insulation layer;

forming patterned electrodes on the substrate;

mounting a light source on the substrate and electrically connecting the light source to the patterned electrodes; and

assembling a lens onto the substrate.

7. The method according to claim 6, wherein the step of etching a surface of a substrate comprises forming electrode connecting grooves adjacent to the reflecting region to electrically connect the light source to the patterned electrodes with wires, and forming lens assembly grooves for defining the location of the lens part on the substrate.

8. The method according to claim 6, further comprising dicing a mother substrate into a plurality of the individual substrate.