APPARATUS, SYSTEM AND METHOD FOR USE IN MOUNTING ELECTRONIC ELEMENTS

• US 20070235845A1
• Filed: 03/28/2006
• Published: 10/11/2007
• Est. Priority Date: 03/28/2006
• Status: Active Grant

• Current Assignee: Cree Huizhou Solid State Lighting Company Limited (Smart Global Holdings Incorporated)
• Original Assignee: Cotco Holdings Limited
• Inventors: Xuan, Wong, Hui, Xie, Cheong, Cheng
• Granted Patent: US 7,675,145 B2
• Time in Patent Office: Days
• US Class Current: 257/676
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 5/0091 Housing specially adapted for small components for resistors H01C; for capacitors H01G; for integrated circuits H01L23/00
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing with a recess in a second surface; a first lead element partially encased by the casing comprising a coupling portion extending interior to the casing generally in a first direction and a chipset portion extending from the first coupling portion at a first acute angle and through an area exposed by the recess; a second lead element partially encased by the casing comprising a second coupling portion extending interior to the casing in a second direction substantially parallel to the first direction and a head portion extending from the second coupling portion at a second acute angle and partially terminating interior to the area exposed by the recess; and the chipset portion comprises a first indentation and a second indentation both extending into the area exposed through the recess.

Claims

1. A surface mount device comprising:

a casing comprising a first surface and a second surface, the second surface comprising a recess;

a first lead element partially encased by the casing, the first lead element comprising a first coupling portion and a chipset portion, the coupling portion extending interior to the casing from the first surface of the casing generally in a first direction, the chipset portion extending from the first coupling portion at a first acute angle relative to the first direction through an area exposed by the recess, and the first lead element terminating interior to the casing;

a second lead element partially encased by the casing and electrically isolated from the first lead element, the second lead element comprising a second coupling portion and a head portion, the second coupling portion extending interior to the casing from the first surface of the casing generally in a second direction substantially parallel to the first direction, the head portion extending from the second coupling portion toward the chipset portion at a second acute angle relative to the second direction and partially terminating interior to the area exposed by the recess; and

the chipset portion of the first lead element comprises a first indentation and a second indentation both extending into the area exposed through the recess and the second indentation is located opposite the first indentation and proximate the second lead element.

2. The device of claim 1 wherein the first and second indentations comprise encased portions such that casing material extends through at least a portion of the encased portions of the first and second indentations, and exposed portions that extend into the area exposed through the recess.

3. The device of claim 2, further comprising a fill material disposed within the recess and extending through at least a portion of the exposed portions of the first and second indentations.

4. The device of claim 2 wherein the first and second indentations in the chipset portion are substantially trapezoidal shaped and parallel sides of the trapezoidal shape of the first and second indentations are substantially parallel to an axis bisecting the chipset portion extending relative to the first direction at the first acute angle.

5. The device of claim 1 wherein the first acute angle is perpendicular to the second acute angle.

6. The device of claim 1, wherein interior to the casing the first coupling portion further comprises a first stepped portion that extends toward the second lead element substantially parallel to the first acute angle and a first extended portion extends from the first stepped portion in the first direction.

7. The device of claim 6, wherein interior to the casing the first coupling portion further comprises a second stepped portion extending from the first extended portion in a direction toward the second lead element substantially parallel to the first acute angle and a second extended portion extending from the second stepped portion in the first direction.

8. The device of claim 7, wherein interior to the casing the second coupling portion further comprises a third stepped portion that extends toward the first lead element substantially parallel to the second acute angle, a third extended portion extending in the second direction from the third stepped portion, a fourth stepped portion extending from the third extended portion toward the second lead element substantially parallel to the first acute angle, and fourth extended portion extending in the second direction from the fourth stepped portion.

9. The device of claim 6, wherein interior to the casing the

second coupling portion further comprises a third stepped portion that extends toward the first lead element substantially parallel to the second acute angle and a third extended portion extending from the third stepped portion in the second direction.

10. The device of claim 1, wherein a first width of the first coupling portion of the first lead is greater than the shortest distance between the first and second indentations in the chipset portion.

11. A surface mount device comprising:

a casing comprising a first surface having a recess extending into the casing;

a first lead element partially encased in the casing, the first lead element comprising a first coupling portion and a chipset portion, the first coupling portion extending interior to the casing generally in a first direction and the chipset portion extending from the coupling portion in a second direction, the chipset portion and the first lead element terminating within the casing with at least a portion of the chipset portion extending into an area exposed through the recess;

a second lead element partially encased in the casing and positioned proximate the first lead element, the second lead element comprising a second coupling portion and a head portion, the second coupling portion extending interior to the casing generally in a third direction substantially parallel to the first direction, the head portion extending from the second coupling portion and a portion of the head portion terminating within the recess; and

the first and second coupling portions of the first and second lead elements extending through a second surface of the casing, and wherein the first and second lead coupling portions have increased thicknesses exterior to the casing.

12. The device of claim 11, wherein the second direction of the extending chipset portion is toward an axis of the second lead element defined generally along the third direction.

13. The device of claim 12, wherein the head portion extends in a fourth direction towards the chipset portion.

14. The device of claim 12, wherein the first and second lead elements are positioned relative to the recess such that at least the portion of the chipset portion and a portion of the head portion are exposed through the recess, the chipset portion comprising first and second indentations defined along a length of the chipset portion with the chipset portion extending through the area exposed by the recess with first portions of the first indentation and the second indentation being encased by the casing and second portions of the fist and second indentations extending into the area exposed by the recess.

15. The device of claim 14, wherein the first indentation and second indentation are on opposite sides of an axis defined along the second direction bisecting the chipset portion.

16. The device of claim 14, further comprising fill material disposed within a least a portion of the recess, wherein casing material extends through the first portions of the first and second indentations and fill material extends through the second portions of the first and second indentations exposed by the recess.

17. A method of manufacturing a surface mount device, comprising:

shaping a first lead element comprising a chipset portion and a first coupling portion, the chipset portion comprising a first indentation and a second indentation;

shaping a second lead element comprising a second coupling portion and a head portion;

encasing a portion of the first and second lead elements in a casing, the first and second lead elements are positioned apart, the area between the first and second elements define an insulation gap, the second indentation partially defines the insulation gap, and the chipset portion and the head portion terminate interior to the casing; and

forming a recess in a first surface of the casing and exposing a portion of the chipset portion, a portion of the head portion, and a portion of the first and second indentations through the recess.

18. The method of claim 17, further comprising:

extending the first and second coupling portions through a second surface of the casing;

bending the first and second coupling portions along the second surface; and

terminating the first and second lead elements level with an end of the second surface.

19. The method of claim 17, wherein shaping the first and second lead elements comprises shaping the first and second lead elements such that a thickness of a portion of the first and second lead elements bent along the second surface has a thickness greater than a thickness of the first and second lead elements encased by the casing.

20. The method of claim 17, wherein the shaping the first lead element comprises shaping the chipset portion of the first lead element such that the chipset portion extends through the area exposed by the recess towards the second lead element in a first direction, and shaping the first and second indentations opposite each other across an axis bisecting the chipset portion in the first direction such that a first portion of the first indentation extends into an area bounded by the recess to be exposed by the recess and a portion of the second indentation extends into the area bounded by the recess to be exposed by the recess;

and

the encasing comprises encasing a second portion of the first indentation with the casing such that casing material extends through at least a portion of the second portion of the first indentation, and encasing a second portion of the second indentation with the casing such that casing material extends through at least a portion of the second portion of the second indentation.