APPARATUS, SYSTEM AND METHOD FOR USE IN MOUNTING ELECTRONIC ELEMENTS
First Claim
1. A surface mount device comprising:
- a casing comprising a first surface and a second surface, the second surface comprising a recess;
a first lead element partially encased by the casing, the first lead element comprising a first coupling portion and a chipset portion, the coupling portion extending interior to the casing from the first surface of the casing generally in a first direction, the chipset portion extending from the first coupling portion at a first acute angle relative to the first direction through an area exposed by the recess, and the first lead element terminating interior to the casing;
a second lead element partially encased by the casing and electrically isolated from the first lead element, the second lead element comprising a second coupling portion and a head portion, the second coupling portion extending interior to the casing from the first surface of the casing generally in a second direction substantially parallel to the first direction, the head portion extending from the second coupling portion toward the chipset portion at a second acute angle relative to the second direction and partially terminating interior to the area exposed by the recess; and
the chipset portion of the first lead element comprises a first indentation and a second indentation both extending into the area exposed through the recess and the second indentation is located opposite the first indentation and proximate the second lead element.
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Accused Products
Abstract
The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing with a recess in a second surface; a first lead element partially encased by the casing comprising a coupling portion extending interior to the casing generally in a first direction and a chipset portion extending from the first coupling portion at a first acute angle and through an area exposed by the recess; a second lead element partially encased by the casing comprising a second coupling portion extending interior to the casing in a second direction substantially parallel to the first direction and a head portion extending from the second coupling portion at a second acute angle and partially terminating interior to the area exposed by the recess; and the chipset portion comprises a first indentation and a second indentation both extending into the area exposed through the recess.
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Citations
20 Claims
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1. A surface mount device comprising:
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a casing comprising a first surface and a second surface, the second surface comprising a recess;
a first lead element partially encased by the casing, the first lead element comprising a first coupling portion and a chipset portion, the coupling portion extending interior to the casing from the first surface of the casing generally in a first direction, the chipset portion extending from the first coupling portion at a first acute angle relative to the first direction through an area exposed by the recess, and the first lead element terminating interior to the casing;
a second lead element partially encased by the casing and electrically isolated from the first lead element, the second lead element comprising a second coupling portion and a head portion, the second coupling portion extending interior to the casing from the first surface of the casing generally in a second direction substantially parallel to the first direction, the head portion extending from the second coupling portion toward the chipset portion at a second acute angle relative to the second direction and partially terminating interior to the area exposed by the recess; and
the chipset portion of the first lead element comprises a first indentation and a second indentation both extending into the area exposed through the recess and the second indentation is located opposite the first indentation and proximate the second lead element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A surface mount device comprising:
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a casing comprising a first surface having a recess extending into the casing;
a first lead element partially encased in the casing, the first lead element comprising a first coupling portion and a chipset portion, the first coupling portion extending interior to the casing generally in a first direction and the chipset portion extending from the coupling portion in a second direction, the chipset portion and the first lead element terminating within the casing with at least a portion of the chipset portion extending into an area exposed through the recess;
a second lead element partially encased in the casing and positioned proximate the first lead element, the second lead element comprising a second coupling portion and a head portion, the second coupling portion extending interior to the casing generally in a third direction substantially parallel to the first direction, the head portion extending from the second coupling portion and a portion of the head portion terminating within the recess; and
the first and second coupling portions of the first and second lead elements extending through a second surface of the casing, and wherein the first and second lead coupling portions have increased thicknesses exterior to the casing. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method of manufacturing a surface mount device, comprising:
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shaping a first lead element comprising a chipset portion and a first coupling portion, the chipset portion comprising a first indentation and a second indentation;
shaping a second lead element comprising a second coupling portion and a head portion;
encasing a portion of the first and second lead elements in a casing, the first and second lead elements are positioned apart, the area between the first and second elements define an insulation gap, the second indentation partially defines the insulation gap, and the chipset portion and the head portion terminate interior to the casing; and
forming a recess in a first surface of the casing and exposing a portion of the chipset portion, a portion of the head portion, and a portion of the first and second indentations through the recess. - View Dependent Claims (18, 19, 20)
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Specification