Method for mounting protective covers over image capture devices and devices manufactured thereby

• US 20070236591A1
• Filed: 04/11/2006
• Published: 10/11/2007
• Est. Priority Date: 04/11/2006
• Status: Abandoned Application

• Current Assignee: Flextronics America LLC (Flextronics International Limited)
• Original Assignee: Flextronics America LLC (Flextronics International Limited)
• Inventors: Tam, Samuel, Shangguan, Dongkai
• Application Number:
  US11/402,196
• Publication Number:
  US 20070236591A1
• Time in Patent Office: Days
• US Class Current: 348/308
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 23/631 Graphical user interfaces [GUI] specially adapted for controlling image capture or setting capture parameters
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A method for manufacturing camera modules including image capture devices with protective covers is disclosed. The method includes providing a unitary transparent substrate including a plurality of individual protective covers, providing a unitary component substrate including a plurality of individual component parts, bonding the unitary transparent substrate to the unitary component substrate, dividing the transparent substrate into a plurality of discrete protective covers, and separating the component parts from one another. According to one particular method, the component substrate is a semiconductor wafer having a plurality of integrated electronic image capture devices formed therein. According to another particular method, the component substrate is a circuit board having a plurality of individual device circuit boards formed therein.

Claims

1. A method for manufacturing camera modules, said method comprising:

providing a unitary component substrate including a plurality of individual component parts, a top surface, and a bottom surface;

providing a unitary transparent substrate including a top surface and a bottom surface;

bonding said bottom surface of said transparent substrate to said top surface of said component substrate;

dividing said transparent substrate into a plurality of discrete protective covers after said transparent substrate is bonded to said component substrate, each of said protective covers being bonded to a respective one of said component parts; and

separating said component parts from one another in a step separate from said step of dividing said transparent substrate.

2. A method for manufacturing camera modules according to claim 1, wherein said unitary transparent substrate is made of glass.

3. A method for manufacturing camera modules according to claim 1, wherein said unitary transparent substrate includes channels formed in said bottom surface of said transparent substrate to at least partially define said protective covers.

4. A method for manufacturing camera modules according to claim 3, wherein said channels are at least as deep as a predetermined thickness of said protective covers.

5. A method for manufacturing camera modules according to claim 3, wherein the width of said channels defines a predetermined spacing of said protective covers on said component substrate.

6. A method for manufacturing camera modules according to claim 3, wherein:

said channels include a first group of channels parallel to one another;

said channels include a second group of channels parallel to one another and perpendicular to said channels of said first group of channels; and

said protective covers are rectangular in shape and disposed between adjacent pairs of said channels.

7. A method for manufacturing camera modules according to claim 3, wherein said step of bonding said bottom surface of said transparent substrate to said top surface of said component substrate includes applying a bonding agent to bottom surfaces of said protective covers.

8. A method for manufacturing camera modules according to claim 7, wherein said step of applying a bonding agent to bottom surfaces of said protective covers includes applying an optical bonding agent to substantially the entire bottom surfaces of said protective covers.

9. A method for manufacturing camera modules according to claim 7, wherein said step of applying a bonding agent to bottom surfaces of said protective covers includes using a spin-on process to apply said bonding agent.

10. A method for manufacturing camera modules according to claim 7, wherein said step of applying a bonding agent to bottom surfaces of said protective covers includes patterning said bonding agent on said bottom surface of each said protective covers such that said bonding agent forms a closed perimeter around a peripheral portion of said bottom surface and leaves a central portion of said bottom surfaces free of said bonding agent.

11. A method for manufacturing camera modules according to claim 7, wherein said step of applying a bonding agent to bottom surfaces of said protective covers includes laminating said bonding agent on said bottom surfaces of said protective covers.

12. A method for manufacturing camera modules according to claim 7, wherein said bonding agent is a partially cured thermosetting adhesive.

13. A method for manufacturing camera modules according to claim 7, wherein said step of bonding said bottom surface of said transparent substrate to said top surface of said component substrate includes:

positioning said transparent substrate such that said bonding agent contacts said top surface of said component substrate; and

completing the curing process of said bonding agent.

14. A method for manufacturing camera modules according to claim 1, wherein:

said unitary component substrate is an integrated circuit wafer; and

said individual component parts are integrated image capture devices.

15. A method for manufacturing camera modules according to claim 1, wherein

said unitary component substrate is circuit board;

and

said individual component parts are camera module circuit boards.

16. A method for manufacturing camera modules according to claim 15, wherein:

said camera module circuit boards each include an opening; and

said method of manufacturing camera modules further includes attaching an image capture device to said bottom surface of each of said individual camera module circuit boards with a sensor of said image capture device facing through said opening.

17. A method for manufacturing camera modules according to claim 16, wherein said step of attaching said image capture device occurs after said step of bonding said bottom surface of said transparent substrate to said top surface of said component substrate.

18. A method for manufacturing camera modules according to claim 15, further including attaching passive electronic devices to said component substrate prior to bonding said bottom surface of said transparent substrate to said top surface of said component substrate.

19. A method for manufacturing camera modules according to claim 18, wherein said step of attaching passive electronic devices to said component substrate includes attaching said passive electronic devices to said top surface of said component substrate.

20. A method for manufacturing camera modules according to claim 1, wherein said step of dividing said transparent substrate into a plurality of discrete protective covers includes removing material from said top surface of said transparent substrate until said channels pass completely through said transparent substrate.

21. A method for manufacturing camera modules according to claim 20, wherein said step of removing material includes an etching process.

22. A method for manufacturing camera modules according to claim 20, wherein said step of removing material includes a lapping process.

23. A method for manufacturing camera modules according to claim 20, wherein said step of removing material includes a dicing process.

24. A method for manufacturing camera modules according to claim 1, wherein said step of separating said component parts occurs after said step of dividing said transparent substrate.

25. A method for manufacturing camera modules according to claim 1, further comprising mounting a lens holder on said component substrate after said step of dividing said transparent substrate but before said step of separating said component parts.

26. A method of assembling a camera module according to claim 1, wherein after said step of dividing said transparent substrate the top surface area of each of said individual protective covers is significantly smaller than the top surface area of an associated one of said component parts.

27. A method of assembling a camera module according to claim 1, further comprising forming an optical filter on said protective covers.

28. A camera module comprising:

a component substrate having a top surface;

a transparent protective cover disposed on said top surface of said component substrate, said protective cover having a thickness no greater than 300 microns.

29. A camera module according to claim 28, wherein said component substrate is an image capture integrated circuit chip.

30. A camera module according to claim 28, wherein said component substrate is a printed circuit board.

33. A camera module manufacturing workpiece according to claim 30, wherein said unitary component substrate is an integrated circuit wafer.

31. A camera module manufacturing workpiece comprising:

a unitary component substrate including a plurality of individual component parts; and

a unitary transparent substrate including a bottom surface, said bottom surface partially defining a plurality of discrete protective covers each bonded to a respective one of said individual component parts.

32. A camera module manufacturing workpiece according to claim 31, wherein said discrete protective covers are at least partially defined by channels formed in said bottom surface of said unitary transparent substrate.