Piano MEMS With Hidden Hinge
First Claim
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1. A micro-electro-mechanical (MEMs) device comprising:
- a platform pivotable about first and second perpendicular axes above a substrate;
a pedestal extending upwardly from the substrate underneath the platform;
a first hinge extending from the pedestal enabling the platform to tilt about the first axis;
a gimbal frame extending at least partially around the first hinge for receiving an outer end of the first hinge; and
a second hinge extending from the gimbal frame to an underside of the platform enabling the platform to roll about the second axis;
wherein the first and second hinges are disposed entirely underneath the platform to enable adjacent MEMs devices to be closely packed together.
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Abstract
The micro-electro-mechanical mirror device according to the present invention includes a platform pivotable about two perpendicular axes, and a hinge structure disposed beneath the platform. The hinge structure includes first and second hinges and a gimbal ring fabricated in a single layer beneath the platform layer. One end of the hinge structure extends from the undersurface of the platform, while the other end extends from a pedestal, which extends upwardly from a substrate.
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Citations
19 Claims
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1. A micro-electro-mechanical (MEMs) device comprising:
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a platform pivotable about first and second perpendicular axes above a substrate;
a pedestal extending upwardly from the substrate underneath the platform;
a first hinge extending from the pedestal enabling the platform to tilt about the first axis;
a gimbal frame extending at least partially around the first hinge for receiving an outer end of the first hinge; and
a second hinge extending from the gimbal frame to an underside of the platform enabling the platform to roll about the second axis;
wherein the first and second hinges are disposed entirely underneath the platform to enable adjacent MEMs devices to be closely packed together. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of fabricating a micro-electro-mechanical device comprising the steps of:
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a) providing a silicon-on-insulator (SOI) structure comprising first and second superposed wafer structures separated by a first etch stop layer, each of the first and second wafer structures comprising a handle substrate, a wafer layer, and a second etch stop layer therebetween, wherein the wafer layers of the first and second wafer structures are disposed on either side of the first etch stop layer;
b) removing the handle substrate and the second etch stop layer from the second wafer structure of the SOI structure;
c) etching a gimbal frame, and first and second hinge structures from the wafer layer of the second wafer structure, including removing most of the first etch stop layer thereunder and therearound;
d) providing a substrate layer including a pedestal extending therefrom;
e) attaching the first hinge structure to the pedestal; and
f) removing the handle substrate and the second etch stop layer of the first wafer structure. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification