IMPLANTABLE CO-FIRED ELECTRICAL FEEDTHROUGHS

• US 20070236861A1
• Filed: 04/05/2006
• Published: 10/11/2007
• Est. Priority Date: 04/05/2006
• Status: Abandoned Application

• Current Assignee: Jeremy Burdon, Joyce Yamamoto, Lea Nygren, William Wolf
• Original Assignee: Jeremy Burdon, Joyce Yamamoto, Lea Nygren, William Wolf
• Inventors: Yamamoto, Joyce, Burdon, Jeremy, Nygren, Lea, Wolf, William
• Application Number:
  US11/278,773
• Publication Number:
  US 20070236861A1
• Time in Patent Office: Days
• US Class Current: 361/302
• CPC Class Codes: A61N 1/3754 Feedthroughs

Abstract

A hermetic interconnect for implantable medical devices is presented. In one embodiment, the hermetic interconnect includes a conductive material introduced to a via in a single layer. The conductive material includes a first end and a second end. A first bonding pad is coupled to the first end of the conductive material. A second bonding pad is coupled to the second end of the conductive material. The single layer and the conductive material undergo a co-firing process.

Claims

1. A miniaturized hermetic electrical interconnect for an implantable medical device (IMD), comprising:

a monolithic structure derived from at least three discrete ceramic green-state sheet layers with each said at least three ceramic green-state sheet layers having at least one via-receiving aperture coupling major planar sides thereof;

a conductive metallic material disposed within and at least partially filling each of the via-receiving apertures;

a ferrule structure surrounding the monolithic structure, said ferrule structure having an upper surface and a lower surface; and

a structural support member coupled to at least a portion of the lower surface and a lower portion of said monolithic structure,

wherein said monolithic structure and said conductive metallic material are hermetically fused together at elevated temperature,

wherein the coupling between said structural support member and said monolithic structure comprises a diffusion bond.

2. An interconnect according to claim 1, wherein said monolithic structure comprises an insulating dielectric;

said insulating dielectric includes at least one of a Al₂O₃, a Al₂O₃—

ZrO₂, ZrO₂, SiO₂, aluminum nitride, silicon nitride, silicon carbide, silicon oxynitride, a glass material.

3. The interconnect of claim 2, wherein the SiO₂ being one of amorphous SiO₂ and crystalline SiO₂.

4. An interconnect according to claim 1, wherein the elevated temperature comprises a temperature of between about 650 degrees Celsius (°

C.) and 1300°

C.

5. An interconnect according to claim 1, wherein the conductive metallic material comprises at least one of platinum, platinum-gold, a platinum-iridium, platinum alloy, tungsten, tungsten-molybdenum, niobium, silver, gold, a silver-palladium, and gold-palladium.

6. An interconnect according to claim 1, wherein the coupling further comprises a braze-metal bond intermediate the ferrule structure and the monolithic structure

7. An interconnect according to claim 1, wherein the braze-metal bond comprises a gold material.

8. An interconnect according to claim 1, further comprising at least one capture pad coupled to the conductive metallic material disposed within one the via-receiving apertures.

9. An interconnect according to claim 1, wherein the via-receiving apertures are disposed in substantially axial alignment.

10. An interconnect according to claim 1, wherein the via-receiving apertures of adjacent green-state sheet layers are offset laterally and further comprising a conductive material coupling said offset via-receiving apertures.

11. An interconnect according to claim 1, wherein said capture pad electrically couples to an electrical circuit producing at least temporarily an electrical voltage-bias signal.

12. An interconnect according to claim 1, wherein said capture pad comprises at least one of:

a platinum material, a platinum-gold material, a platinum-iridium material, a platinum alloy material, a tungsten material, a tungsten-molybdenum material, a niobium material, a silver material, a gold material, a silver-palladium material, a gold-palladium material.

13. An interconnect according to claim 1, wherein said capture pad comprises a thin-film structure.

14. An interconnect according to claim 1, wherein said capture pad comprises at least one of niobium, tantalum, titanium, platinum, platinum alloy, gold, gold-palladium, and silver.

15. An interconnect according to claim 1, wherein said capture pad comprises a thick-film metallization ink applied subsequent to the co-firing of the metallic paste and the green-state sheet layers

16. An interconnect according to claim 1, wherein at least one layer of the at least three discrete ceramic green-sheet layers comprises a low temperature co-fire ceramic (LTCC) material.

17. An interconnect according to claim 16, wherein the LTCC material has a melting point between about 850°

C. and 1150°

C.

18. An interconnect according to claim 1, wherein at least one layer of the at least three discrete ceramic green-sheet layers comprises a high temperature co-fire ceramic (HTCC) material.

19. An interconnect according to claim 18, wherein the HTCC material comprises a refractory conductive material.

20. An interconnect according to claim 19, wherein the HTCC material has a melting point between about 1100°

C. and 1700°

C.

21. An interconnect according to claim 1, wherein said ferrule structure being at least one of a titanium material, a titanium alloy material, niobium, niobium alloy, and a ceramic oxide material.

22. The interconnect of claim 21 wherein the conductive metallic material comprises a noble metal being one of gold, silver, platinum, palladium, iridium, rhenium, ruthenium, osmium and alloys thereof.

23. The interconnect of claim 1 wherein the conductive metallic material comprises a metal capable of undergoing at least one of a LTCC condition and a HTCC condition.

24. The interconnect of claim 23 wherein the conductive metallic material comprises a metal capable of undergoing at least one of a low fire temperature condition and a high fire temperature condition.

25. The interconnect of claim 24 wherein the low fire temperature ranges from about 850°

C. to about 1150°

C.

26. The interconnect of claim 23 wherein the high fire temperature ranges from about 1100°

C. to about 1700°

C.

27. An interconnect according to claim 1, further comprising an aperture formed through a portion of an enclosure, said aperture configured to sealingly receive peripheral edges of the ferrule structure;

28. An interconnect according to claim 1, wherein said enclosure contains an electrochemical cell

29. An interconnect according to claim 28, wherein said electrochemical cell comprises one of:

a primary battery, a secondary batter, a capacitor.

30. An interconnect according to claim 1, wherein said enclosure contains at least a part of an IMD.

31. An interconnect according to claim 1, wherein said IMD comprises one of:

a pacemaker, a neurological stimulator, a drug pump, a cardioverter-defibrillator, a deep brain stimulator, a medical electrical lead, a physiologic sensor.

32. An interconnect according to claim 31, wherein the physiologic sensor includes one of a sensor adapted to be externally affixed to a patient'"'"'s body and another sensor implanted in the patient'"'"'s body.

33. A hermetic interconnect for an IMD, comprising:

a structure derived from at least three discrete ceramic layers with each said at least three ceramic layers having at least one via-receiving aperture coupling major planar sides thereof;

a conductive material disposed within at least one via;

a ferrule structure surrounding the structure, said ferrule structure having an upper surface and a lower surface; and

a structural support member coupled to at least a portion of the lower surface and a lower portion of said structure,

wherein said structure and said conductive material are hermetically fused together.

34. The hermetic interconnect of claim 33 wherein the conductive material being a metal.

35. A hermetic interconnect for an IMD comprising:

a first layer;

a second layer coupled to the first layer;

a third layer;

a first via disposed in the first layer;

a second via formed in the second layer;

a third via formed in the third layer;

a first conductive material disposed in the first via;

a second conductive material disposed in the second via;

a third conductive material in the third via;

a first conductive element coupled to the first and second conductive materials;

a second conductive element coupled to the second and third conductive elements; and

a ferrule surrounding the first, second and third layers.

36. The hermetic interconnect of claim 35 wherein the first, second and third conductive materials being one of a metal and an alloy.

37. The hermetic interconnect of claim 36 wherein the metal comprises at least one of a noble metal, an actinide metal, a lanthanide metal, alkali metal, an alkaline-earth metal, a rare metal, a rare-earth metal, and a transition metal.

38. The hermetic interconnect of claim 37 wherein the first conductive material and the second conductive material are different.

39. The hermetic interconnect of claim 37 wherein the second conductive material and the third conductive material are different.

40. The hermetic interconnect of claim 37 wherein the first second, and third conductive materials are the same.

41. The hermetic interconnect of claim 36 wherein the first conductive element being one of a metal and an alloy.

42. The hermetic interconnect of claim 38 wherein the metal being one of a noble metal, an actinide metal, a lanthanide metal, alkali metal, an alkaline-earth metal, a rare metal, a rare-earth metal, and a transition metal.

43. The hermetic interconnect of claim 35 wherein the first, second, and third layers comprise SiO₂.

44. The hermetic interconnect of claim 35 further comprising:

a fourth layer coupled to third layer, the fourth layer includes a fourth via with a fourth conductive material deposited therein.

45. The hermetic interconnect of claim 44 further comprising:

a fifth layer coupled to fourth layer, the fifth layer includes a fifth via with a fifth conductive material deposited therein.

46. The hermetic interconnect of claim 35 wherein the first and second conductive material comprise at least one of a metal and an alloy.

47. The hermetic interconnect of claim 46 wherein the metal being one of a noble metal, an actinide metal, a lanthanide metal, alkali metal, an alkaline-earth metal, a rare metal, a rare-earth metal, and a transition metal.

48. The hermetic interconnect of claim 47 wherein the first and second conductive material comprise a same metal.

49. The hermetic interconnect of claim 47 wherein the first and second conductive material comprise a different metal.

50. The hermetic interconnect of claim 44 further comprising:

a fourth conductive element coupled to the third conductive material and the fourth conductive material.

51. The hermetic interconnect of claim 50 further comprising:

a fifth conductive element coupled to the fourth conductive material and the fifth conductive material.

55. The hermetic interconnect of claim 46 wherein the conductive element comprises the same conductive material as at least one of the first and the second conductive materials.

56. The hermetic interconnect of claim 46 wherein the conductive element comprises different conductive material from the first and the second conductive elements.

52. A hermetic interconnect for an IMD comprising:

a single layer;

a conductive material coupled to the single layer, the conductive material includes a first end and a second end;

a first bonding pad coupled to the first end of the conductive material; and

a second bonding pad coupled to the second end of the conductive material,

wherein the hermetic interconnect being co-fired.

53. The hermetic interconnect of claim 52 further comprising:

a ferrule coupled to the hermetic interconnect via a diffusion bond.

54. A hermetic interconnect for an IMD comprising:

a first layer with a first via formed therein;

a first conductive material disposed in the first via;

a second layer with a second via formed therein;

a second conductive material disposed in the second via; and

a conductive element coupled to the first conductive material and the second conductive material,

wherein the first and the second layers being co-fired.

57. The hermetic interconnect of claim 54 further comprising:

a ferrule coupled to the hermetic interconnect via a diffusion bond.