Electronics assembly having heat sink substrate disposed in cooling vessel

• US 20070236883A1
• Filed: 04/05/2006
• Published: 10/11/2007
• Est. Priority Date: 04/05/2006
• Status: Abandoned Application

• Current Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Ruiz, Javier
• Application Number:
  US11/398,344
• Publication Number:
  US 20070236883A1
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Abstract

An electronics assembly is provided having a housing including walls defining a fluid vessel. One or more thermally conductive heat sink devices extend through one or more openings in the housing and in thermal communication with a liquid coolant. One or more electronics devices are mounted onto a mounting surface of the heat sink devices such that the electronics devices are cooled by the liquid coolant in the fluid vessel.

Claims

1. An electronics assembly comprising:

a housing comprising walls defining a fluid vessel, an inlet and an outlet, said housing further comprising at least one opening formed in a wall;

a thermally conductive heat sink device extending through said at least one opening in said wall of the housing and sealed to the housing, said heat sink device comprising an electronics mounting surface, and a heat exchange surface in thermal communication with cooling fluid in the fluid vessel; and

an electronics device mounted onto the electronics mounting surface of the heat sink device such that the electronics device is cooled by the cooling fluid exchanging thermal energy at the heat exchange surface.

2. The electronics assembly as defined in claim 1, wherein the heat sink device comprises a thermally conductive dielectric material.

3. The electronics assembly as defined in claim 1, wherein the cooling fluid comprises liquid.

4. The electronics assembly as defined in claim 1 further comprising a circuit board having electrical circuitry coupled to the electronics device.

5. The electronics assembly as defined in claim 4 further comprising an electrical interconnect connecting the electronics device to the electrical circuitry on the circuit board.

6. The electronics assembly as defined in claim 1, wherein the electronics assembly comprises a plurality of heat sink devices and a plurality of electronics devices mounted on the plurality of heat sink devices, wherein each of the heat sink devices comprises a plurality of fins, and wherein some of the fins are offset from other of the fins to disturb the flow of cooling fluid through the fluid vessel.

7. The electronics assembly as defined in claim 1 further comprising a plurality of electronics devices mounted onto the heat sink device.

8. The electronics assembly as defined in claim 1, wherein the housing comprises first and second members.

9. The electronics assembly as defined in claim 1, wherein the heat sink device comprises a ceramic material.

10. The electronics assembly as defined in claim 9, wherein the ceramic material comprises aluminum nitride.

11. The electronics assembly as defined in claim 1, wherein the housing comprises a polymeric material.

12. An electronics assembly comprising:

a housing comprising walls defining a liquid vessel, an inlet and an outlet, said housing further comprising at least one opening formed in a wall;

a thermally conductive heat sink device extending through said at least one opening in said wall of the housing and sealed to the housing, said heat sink device comprising an electronics mounting surface, and a heat exchange surface in thermal communication with cooling liquid in the liquid vessel; and

an electronics device mounted onto the electronics mounting surface of the heat sink device such that the electronics device is cooled by the cooling liquid exchanging thermal energy at the heat exchange surface.

13. The electronics assembly as defined in claim 12, wherein the heat sink device comprises a thermally conductive dielectric material.

14. The electronics assembly as defined in claim 12 further comprising a circuit board having electrical circuitry coupled to the electronics device.

15. The electronics assembly as defined in claim 14 further comprising a ribbon connector connecting the electronics device to the electrical circuitry on the circuit board.

16. The electronics assembly as defined in claim 12, wherein the electronics assembly comprises a plurality of heat sink devices and a plurality of electronics devices mounted on the plurality of heat sink devices, wherein each of the heat sink devices comprises a plurality of fins, and wherein some of the fins are offset from other of the fins to disturb the flow of cooling liquid through the liquid vessel.

17. The electronics assembly as defined in claim 12 further comprising a plurality of electronics devices mounted onto the heat sink device.

18. The electronics assembly as defined in claim 12, wherein the housing comprises first and second members.

19. The electronics assembly as defined in claim 12, wherein the heat sink device comprises a ceramic material.

20. The electronics assembly as defined in claim 19, wherein the ceramic material comprises aluminum nitride.

21. The electronics assembly as defined in claim 12, wherein the housing comprises a polymeric material.