Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom
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Abstract
A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.
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Citations
32 Claims
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23. An apparatus comprising:
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a first ceramic subassembly having a first circuit fabricated on a first side thereof; and
,a second ceramic subassembly having a second circuit fabricated on a first side thereof, wherein the first ceramic subassembly is joined to the second ceramic subassembly by metal layers that are selectively printed on one of a second side of the first ceramic subassembly and a second side of the second ceramic subassembly, dried and co-fired. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification