Method and Device for Production of Three-Dimensional Objects by Means of Electromagnetic Radiation of Electromagnetic Radiation and Application of an Absorber by Means of an Ink-Jet Method
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Abstract
The present invention relates to a process for the bonding of material for the production of three-dimensional objects by means of selective heating via electromagnetic energy which is either non-coherent and/or non-monochromatic and/or non-oriented, with a wavelength of from 100 nm to 1 mm. This radiation may be emitted in spot or linear form, or else in spread form. It is also possible to combine two or more sources of radiation in order to increase the speed of the process. The selectivity of the melting process is achieved via the application of an absorber to certain subregions of a layer composed of a pulverulent substrate, and then heating of the absorber by means of electromagnetic energy of wavelength from 100 nm to 1 mm. The heated absorber transfers the energy present therein to its surrounding pulverulent substrate, which is melted thereby and, after cooling, has firm cohesive bonding. The process is markedly more flexible, less expensive, and faster than conventional laser sintering.
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Citations
49 Claims
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1-26. -26. (canceled)
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27. A process for producing a three-dimensional object, which comprises
the steps of. a) providing a layer of a pulverulent substrate b) controlling the temperature of the manufacturing chamber c) selective application of an absorber in a suspension or of a liquid absorber via an inkjet to the e regions to be sintered d) if appropriate adjusting one or more functionalized layers, e.g. conductive properties by application of appropriate substances e) selective melting of regions of the powder layer by means of introduction of electromagnetic energy via laser of wavelength from 100 nm to 1 mm, by means of radiative heaters in the IR-A, and/or IR-B region, or using lamps in the visible or IR-A, and/or IR-B region f) cooling of the molten and non-molten regions to a temperature which allows the moldings to be removed intact g) removal of the moldings.
Specification