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Laser cutting method, display apparatus manufacturing method, and display apparatus

  • US 20070241085A1
  • Filed: 03/23/2007
  • Published: 10/18/2007
  • Est. Priority Date: 03/27/2006
  • Status: Active Grant
First Claim
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1. A laser cutting method for cutting a laminated substrate that is formed by laminating at least a pair of substrates, comprising the steps of:

  • providing a pattern member with a characteristic of absorbing light of a wavelength that transmits each of the substrates, between each of the substrates along a cutting position of the laminated substrate; and

    irradiating a laser of the wavelength that transmits the substrates along the pattern member, whereby the laminated substrate is cut along the pattern member.

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