LIGHT-EMITTING DIODE LAMP WITH LOW THERMAL RESISTANCE
First Claim
1. A light-emitting diode structure comprising:
- a light-emitting diode semiconductor active layer deposited on a metal substrate enclosed in a casing;
a secondary metal plate electrically connected to a bond pad on the active layer; and
a primary metal plate electrically and thermally conductively connected to the metal substrate via a metal bonding layer, wherein the primary and secondary metal plates are exposed through a bottom portion of the casing and provide external electrical connections to the light-emitting diode structure.
1 Assignment
0 Petitions
Accused Products
Abstract
A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable light-emitting diode structure is provided having an active layer deposited on a metal substrate directly bonded to a metal plate that is substantially exposed for low thermal resistance by positioning it on the bottom of the light-emitting diode structure. This metal plate can then be soldered to a printed circuit board (PCB) that includes a heat sink. For some embodiments of the invention, the metal plate is thermally and electrically conductively connected through several heat conduction layers to a large heat sink that may be included in the structure.
-
Citations
25 Claims
-
1. A light-emitting diode structure comprising:
-
a light-emitting diode semiconductor active layer deposited on a metal substrate enclosed in a casing;
a secondary metal plate electrically connected to a bond pad on the active layer; and
a primary metal plate electrically and thermally conductively connected to the metal substrate via a metal bonding layer, wherein the primary and secondary metal plates are exposed through a bottom portion of the casing and provide external electrical connections to the light-emitting diode structure. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A light-emitting diode structure comprising:
-
a light-emitting diode semiconductor active layer deposited on a metal substrate enclosed in a casing;
a secondary metal plate electrically connected to a bond pad on the active layer and exposed through a bottom portion of the casing; and
a primary metal plate having an upper and a lower tier, wherein the upper tier of the primary metal plate is electrically and thermally conductively connected to the metal substrate via a first metal bonding layer and enclosed in the casing and the lower tier of the primary metal plate is exposed through a bottom portion of the casing. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
-
-
15. A light-emitting diode structure comprising:
-
a light-emitting diode semiconductor active layer deposited on a metal substrate enclosed in a casing;
a secondary metal plate electrically connected to a bond pad on the active layer; and
a primary metal plate electrically and thermally conductively connected to the metal substrate via a first metal bonding layer, wherein the primary and secondary metal plates are positioned at an interior bottom surface of the casing and extend laterally through the casing to provide external electrical connections for the light-emitting diode structure. - View Dependent Claims (16, 17, 18, 19, 20)
-
-
21. A light-emitting diode structure comprising:
-
a light-emitting diode semiconductor active layer deposited on a metal substrate enclosed in a casing, wherein a p-doped side of the active layer is intimately coupled to the metal substrate;
a secondary metal plate electrically connected to a bond pad on the active layer; and
a primary metal plate electrically and thermally conductively connected to the metal substrate via a metal bonding layer, wherein the primary and secondary metal plates are exposed through a bottom portion of the casing and provide external electrical connections to the light-emitting diode structure. - View Dependent Claims (22, 23, 24, 25)
-
Specification