Sheet-Like Formed Material

• US 20070241900A1
• Filed: 03/25/2005
• Published: 10/18/2007
• Est. Priority Date: 03/25/2004
• Status: Active Grant

• Current Assignee: Tatsuo Sasazaki
• Original Assignee: Tatsuo Sasazaki
• Inventors: Sasazaki, Tatsuo
• Granted Patent: US 7,883,010 B2
• Time in Patent Office: Days
• US Class Current: 340/572.100
• CPC Class Codes: B32B 2519/00 Labels, badges
• CPC Class Codes: B32B 3/28 characterised by a layer comprising a deformed thin sheet , i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled B32B29/08 takes precedence
• CPC Class Codes: B32B 38/0004 Cutting, tearing or severing, e.g. bursting; Cutter details cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence
• CPC Class Codes: B65B 61/06 by cutting
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Abstract

A sheet-like formed material having a tape with IC tags useful for a production line for a sheet-like formed material continuously produced at high speed. A sheet-like formed material (40) where a tape (30) on which IC tags (20) are arranged at appropriate intervals is superposed on a sheet-like formed raw material, wherein the tape (30) with the IC tags is fixedly adhered, between sheet layers constructed in a layered form, to a cut sheet (100) from end to end of the sheet.

Claims

1. (canceled)

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21. A cut sheet (100) having an IC-tag tape (30) along its entire length, the cut sheet being formed by the steps of:

preparing a tape reel (1) of an IC-tag tape to which IC tags (20) are attached with such an IC-tag-pitch that each cut sheet includes at least one IC tag,

unwinding said IC-tag tape from said tape reel that is held by a reel stand and providing said IC-tag tape in the machine direction to attach said IC-tag tape to a successive sheet material, and

cutting said successive sheet material into said cut sheets with a predetermined length in the machine direction,

wherein said cut sheet includes an upper sheet material (8) that forms a first side of the cut sheet and a lower sheet material (9) that forms a second side of the cut sheet opposite to said first side,

wherein said IC-tag tape is successively attached to said first side or to said second side of said cut sheet, and

wherein said IC-tag tape is configured to be used as a cut tape for said cut sheet.

22. A cut sheet (100) of claim 21,

wherein the cut sheet is made of a corrugated board comprising a second linerboard (8), a first linerboard (9) that forms the opposite side of said cut sheet with respect to said second linerboard, and a corrugated medium (10) that is positioned between said second linerboard and said first linerboard, and

wherein said IC-tag tape is attached to said first linerboard and is configured to be used as a cut tape for said cut sheet.

28. The cut sheet (100) of claim 22, wherein said cut sheet is desirably shaped during a die-cutting process cutting after said successive sheet material into said cut sheets.

29. The cut sheet (100) of claim 22,

wherein said successive sheet material passes below an encoder (97) before the successive sheet material is cut into said cut sheets,

wherein said encoder (97) sends signals to a production control device (95), the signals indicating the length of said successive sheet material that has passed below the encoder,

wherein a detecting means (96) sends location signals to said production control device, the signals indicating the location of said IC tag that is attached to said successive sheet material,

wherein said production control device (95) calculates whether said IC tags (20) are positioned in an area to be trimmed during said die-cutting process using said signals from said encoder (97) and from said detecting means (96).

30. The cut sheet of claim 22,

wherein said successive sheet material passes below an encoder (97) before the successive sheet material is cut into said cut sheets,

wherein said encoder (97) sends signals to a production control device (95), the signals indicating the length of said successive sheet material that has passed below the encoder,

wherein an interrogator (96) with a radio antenna sends location signals to said production control device, the signals indicating the location of said IC tag (20) that is attached to said successive sheet material,

wherein said cut sheet is desirably shaped during a die-cutting process after cutting said successive sheet material into said cut sheets, and

wherein said production control device (95) calculates whether said IC tags (20) are positioned in an area to be trimmed during said die-cutting process using said signals from said encoder (97) and from said interrogator (96) with a radio antenna.

31. The cut sheet of claim 22,

wherein said IC-tag tape (30) is formed by printing an electronic circuit on a plastic tape substrate,

wherein said electronic circuit is covered with a protecting coat.

32. The cut sheet of claim 22, wherein said IC-tag-pitch is 5 to 300 cm.

33. The cut sheet of claim 22, wherein said IC-tag tape is 2 to 100 mm in width.

34. The cut sheet of claim 22, wherein said IC-tag tape is 4 to 10 mm in width.

23. A cut sheet (100) having an IC-tag tape (30) along its entire length, the cut sheet being formed by the steps of:

selecting a tape reel (1) of an IC-tag tape to which IC tags (20) are attached with such an IC-tag-pitch that each cut sheet includes at least one IC tag,

unwinding said IC-tag tape from said tape reel that is held by a reel stand and providing said IC-tag tape in the machine direction to attach said IC-tag tape to a successive sheet material, and

cutting said successive sheet material into said cut sheets with a predetermined length in the machine direction,

wherein said IC-tag tape is successively attached to an upper surface or to a lower surface of said cut sheet, and

wherein said IC-tag tape is configured to be used as a cut tape for said cut sheet.

24. A cut sheet (100) having an IC-tag tape (30) along its entire length, the cut sheet being formed by the steps of:

selecting a tape reel (1) of an IC-tag tape to which IC tags (20) are attached with such an IC-tag-pitch that each cut sheet includes at least one IC tag,

unwinding said IC-tag tape from said tape reel that is held by a reel stand and providing said IC-tag tape in the machine direction to attach said IC-tag tape to a successive sheet material, and

cutting said successive sheet material into said cut sheets with a predetermined length in the machine direction,

wherein said cut sheet includes a plurality of layers, and

wherein said IC-tag tape is positioned and attached between said plurality of layers.

25. The cut sheet of claim 24,

wherein said plurality of layers consists of wet web,

wherein said IC-tag tape (30) is attached to said cut sheet by inserting the IC-tag tape between said layers of wet web to be made into said successive sheet material before drying said wet web.

26. The cut sheet of claim 24, wherein said cut sheet (100) is made of a plastic corrugated board, and

wherein said IC tag tape is attached to said cut sheet by putting said IC tag tape on hot-melted part of said plastic corrugated board.

27. The cut sheet of claim 24, wherein said IC-tag tape is attached between said plurality of layers using starch paste or vinyl acetate emulsion.