Backlight for liquid crystal display using light emitting diode

• US 20070242477A1
• Filed: 04/13/2007
• Published: 10/18/2007
• Est. Priority Date: 04/14/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lee, Sang Yun, Yoo, Chul Hee, Yang, Yoon Tak, Lee, Hyun Ho, Park, Myoung Bo
• Granted Patent: US 7,648,254 B2
• Time in Patent Office: Days
• US Class Current: 362/612
• CPC Class Codes: G02F 1/133601 for spatial active dimming
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133628 with cooling means
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/09227 Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
• CPC Class Codes: H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034

Abstract

In an LCD backlight unit using a light emitting diode, a double-sided printed circuit board includes a plurality of divided areas and conductive vias. A plurality of light emitting diodes are disposed on a top surface of the double-sided printed circuit board. A plurality of driving circuit connectors are disposed at a portion of the double-sided printed circuit board. A plurality of first lead patterns are formed on the top surface of the printed circuit board, each of the first lead patterns electrically connecting the light emitting diodes in each of the divided areas with one another. Also, a plurality of second lead patterns are formed on an underside surface of the double-sided printed circuit board to electrically connect the first lead patterns with the connectors through the conductive vias.

Claims

1. A backlight for a liquid crystal display using a light emitting diode comprising:

a double-sided printed circuit board including a plurality of divided areas and conductive vias;

a plurality of light emitting diodes disposed on a top surface of the double-sided printed circuit board;

a plurality of driving circuit connectors disposed at a portion of the double-sided printed circuit board;

a plurality of first lead patterns formed on the top surface of the printed circuit board, each of the first lead patterns electrically connecting the light emitting diodes in each of the divided areas with one another; and

a plurality of second lead patterns formed on an underside surface of the double-sided printed circuit board to electrically connect the first lead patterns with the connectors through the conductive vias.

2. The backlight according to claim 1, wherein the double-sided printed circuit board further comprises heat radiating vias each formed underneath each of the light emitting diodes, the heat radiating vias extending through the top surface of the double-sided printed circuit board to the underside surface thereof.

3. The backlight according to claim 1, further comprising an insulating heat radiation pad disposed in contact with the underside surface of the double-sided printed circuit board.

4. The backlight according to claim 4, wherein at least one of the first lead patterns in a corresponding one of the divided areas adjacent to the connectors are directly connected to the connectors.